Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1995
05/02/1995US5412247 Protection and packaging system for semiconductor devices
05/02/1995US5412245 Integrated circuit
05/02/1995US5412244 Electrically-programmable low-impedance anti-fuse element
05/02/1995US5412160 Multilayer board with dielectric film on substrate and wire metal film on dielectric film
05/02/1995US5412157 Semiconductor device
05/02/1995US5412002 Composition of glycidylated phenol/vinylcyclohexene or vinylnorbornene resin
05/02/1995US5411924 Magnesium silicon oxynitride
05/02/1995US5411921 Semiconductor chip die bonding using a double-sided adhesive tape
05/02/1995US5411920 Lead frame, semiconductor device, and method of manufacturing same
05/02/1995US5411918 Processing microchips
05/02/1995US5411917 Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayer
05/02/1995US5411916 Method for patterning wirings of semiconductor integrated circuit device
05/02/1995US5411896 Method of making supra-passivant grid
05/02/1995US5411703 Lead-free, tin, antimony, bismtuh, copper solder alloy
05/02/1995US5411563 Strengthening of multilayer ceramic/glass articles
05/02/1995US5411077 Flexible thermal transfer apparatus for cooling electronic components
05/02/1995US5410806 Method for fabricating conductive epoxy grid array semiconductors packages
05/02/1995US5410804 Method for manufacturing a single product from integrated circuits received on a lead frame
04/1995
04/27/1995WO1995011524A1 Multilevel antifuse structure and method for making same
04/27/1995WO1995011523A1 A thin multichip module
04/27/1995DE4437761A1 Method for forming a contact in a semiconductor device
04/27/1995DE4437759A1 Protective transistor for electrostatic discharges and method for its production
04/27/1995DE4336235A1 Method for the production of ceramic multilayers
04/27/1995DE4335822A1 Electronic module with IC
04/26/1995EP0650196A2 Semiconductor integrated circuit device and method of producing the same using master slice approach
04/26/1995EP0650194A1 High density dynamic bus
04/26/1995EP0650193A2 Semiconductor device and method for manufacturing the same
04/26/1995EP0650192A2 Structure for coupling between low temperature circuitry and room temperature circuitry
04/26/1995EP0650191A1 Structure of semiconductor IC chip
04/26/1995EP0650189A1 Method of manufacture of a semiconductor module
04/26/1995EP0649893A1 Adhesive tape for electronic parts and liquid adhesive
04/26/1995EP0649892A1 Adhesive tape for electronic parts and liquid adhesive
04/26/1995EP0649590A1 Component module
04/26/1995EP0649565A1 Fitting unit for multilayer hybrid circuit with power components
04/25/1995US5410451 Location and standoff pins for chip on tape
04/25/1995US5410450 Internal wiring structure of a semiconductor device
04/25/1995US5410449 Heatsink conductor solder pad
04/25/1995US5410185 Internal bridging contact
04/25/1995US5410184 Microelectronic package comprising tin-copper solder bump interconnections, and method for forming same
04/25/1995US5410183 Contact structure of semiconductor device and method of manufacturing the same
04/25/1995US5410182 High density semiconductor device having inclined chip mounting
04/25/1995US5410181 Assembly for mounting an electronic device having an optically erasable surface
04/25/1995US5410180 Metal plane support for multi-layer lead frames and a process for manufacturing such frames
04/25/1995US5410173 Semiconductor integrated circuit device
04/25/1995US5410169 Dynamic random access memory having bit lines buried in semiconductor substrate
04/25/1995US5410163 Semi-conductor integrated circuit device including connection and disconnection mechanisms to connect and disconnect monitor circuit and semiconductor integrated circuit from each other
04/25/1995US5410161 Semiconductor device equipped with characteristic checking element
04/25/1995US5410107 Electrical interconnection medium
04/25/1995US5409869 High thermoconductivity and strength, manufactured through low temperature, short-time sintering
04/25/1995US5409866 Process for manufacturing a semiconductor device affixed to an upper and a lower leadframe
04/25/1995US5409865 Process for assembling a TAB grid array package for an integrated circuit
04/25/1995US5409864 Substrate for semiconductor apparatus
04/25/1995US5409862 Method for making aluminum single crystal interconnections on insulators
04/25/1995US5409860 Method of manufacturing a metal contact on a word line
04/25/1995US5409352 CPU heat dissipating device
04/25/1995US5409157 Composite transversely plastic interconnect for microchip carrier
04/25/1995US5409055 Heat pipe type radiation for electronic apparatus
04/25/1995US5408742 Process for making air bridges for integrated circuits
04/25/1995US5408741 Method for forming electronic device
04/20/1995WO1995010853A1 Edge connectable metal package
04/20/1995WO1995010852A1 Bonding of leads directly over chip active areas
04/20/1995WO1995010797A1 Method of forming polyimide patterns on substrates
04/20/1995DE4409015A1 Device for cooling electronic components
04/20/1995DE4335525A1 Cooling arrangement
04/20/1995DE4335299A1 Heat sink with integrated fastening system
04/20/1995DE4335132A1 Wide-band amplifier circuit
04/19/1995EP0649171A2 Multichip module with a mandrel-produced interconnecting decal
04/19/1995EP0649152A2 Transformer integrable with a semiconductor integrated circuit and method for producing thereof
04/19/1995EP0637196A4 Process for manufacturing integrated microcircuits.
04/19/1995CN1101754A Semiconductor device
04/18/1995US5408383 Container for electronic devices having a plurality of circuit boards
04/18/1995US5408190 Testing apparatus having substrate interconnect for discrete die burn-in for nonpackaged die
04/18/1995US5408131 Circuit identifier for use with focused ion beam equipment
04/18/1995US5408130 Interconnection structure for conductive layers
04/18/1995US5408128 High power semiconductor device module with low thermal resistance and simplified manufacturing
04/18/1995US5408127 Method of and arrangement for preventing bonding wire shorts with certain integrated circuit components
04/18/1995US5408126 Manufacture of semiconductor devices and novel lead frame assembly
04/18/1995US5408052 Flexible multi-layer circuit wiring board
04/18/1995US5407866 Method for forming a dielectric layer on a high temperature metal layer
04/18/1995US5407865 Method of manufacturing a flexible metallized polymer film cover for environmental protection of electronic assemblies
04/18/1995US5407864 Process for mounting a semiconductor chip and depositing contacts into through holes of a circuit board and of an insulating interposer and onto the chip
04/18/1995US5407863 Method of manufacturing semiconductor device
04/18/1995US5407862 Forming dielectric layers on semiconductor substrate
04/18/1995US5407855 Forming a region in semiconductor substrate, multilayer of silicon, dielectric, electrode, barrier, contact and via plug and an interconnet, an electroconductive layer of ruthenium, osmium, rhenium, iridium and their oxides
04/18/1995US5407848 Method for forming a gate electrode having a polycide structure
04/18/1995US5407557 Multilayer laminate composed of wiring boards formed from a flexible dielectric and a wiring pattern
04/18/1995US5407532 Self-aligned method of fabrication closely spaced apart metallization lines
04/18/1995US5407502 Method for producing a semiconductor device having an improved adhesive structure
04/18/1995US5407473 Conductive ink
04/18/1995US5407361 For mounting an electrical part
04/18/1995US5406807 Apparatus for cooling semiconductor device and computer having the same
04/18/1995US5406700 Method for producing pin integrated circuit lead frame
04/18/1995US5406699 Method of manufacturing an electronics package
04/18/1995CA2017080C Semiconductor device package structure
04/13/1995WO1995010121A1 Antifuse structure with increased breakdown at edges
04/13/1995DE4334091A1 Electronic apparatus
04/13/1995CA2117818A1 Method of manufacturing semiconductor device
04/12/1995EP0647967A2 Method of mounting a semiconductor device
04/12/1995EP0647966A1 Semiconductor device with wiring pattern and method for manufacturing same
04/12/1995EP0647722A1 Gold alloy wire for bonding semiconductor device
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