Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1995
05/24/1995EP0654818A1 Semiconductor device with solder bump and process for manufacturing the same
05/24/1995EP0654177A1 Semiconductor arrangement
05/24/1995EP0654176A1 Securing device for semiconductor circuit components
05/24/1995EP0654175A1 Construction of a power converter.
05/24/1995EP0654169A1 Cubic metal oxide thin film epitaxially grown on silicon
05/24/1995DE4441704A1 Mfg. metal conductor in semiconductor device
05/23/1995US5418740 Semiconductor memory apparatus formed of a plurality of small memory cells arrays having columns of memory cells connected to column selection word lines through selection transistors
05/23/1995US5418689 Printed circuit board or card for direct chip attachment and fabrication thereof
05/23/1995US5418687 Wafer scale multi-chip module
05/23/1995US5418329 High frequency IC package
05/23/1995US5418266 Phenolic resin curing agent
05/23/1995US5418189 Aminopropyltriethoxysilane coating to promote adhesion and reduce package cracking
05/23/1995US5418187 Method for extending electrically conductive layer into electrically insulating layer
05/23/1995US5418172 Method for detecting sources of contamination in silicon using a contamination monitor wafer
05/23/1995US5417905 Method of making a card having decorations on both faces
05/23/1995US5417830 Injection plating apparatus
05/23/1995US5417800 Thin film circuit board manufacturing process
05/23/1995US5417784 Method of manufacturing laminated electronic component
05/23/1995US5417362 Electrical connecting method
05/18/1995WO1995013625A1 Structure and method for mounting semiconductor device and liquid crystal display device
05/18/1995DE4338715A1 Protective package for semiconductor device, e.g. LED module
05/17/1995EP0653823A2 A semiconductor device with high heat conductivity
05/17/1995EP0653792A2 Electrostatic discharge protection device for semiconductor chip packages
05/17/1995EP0653791A1 Device for inscribing workpieces
05/17/1995EP0653790A1 Conductive layer for semiconductor device
05/17/1995EP0653789A2 Electronic package structure and method of making same
05/17/1995EP0653788A1 Bonding pad with circular exposed area and method thereof
05/17/1995EP0653104A1 Chip module
05/17/1995EP0621981A4 Lead frames with improved adhesion.
05/16/1995US5416660 Package for microwave device
05/16/1995US5416359 Semiconductor device having gold wiring layer provided with a barrier metal layer
05/16/1995US5416355 Semiconductor integrated circuit protectant incorporating cold cathode field emission
05/16/1995US5416347 Semiconductor memory device with additional conductive line to prevent line breakage
05/16/1995US5416343 Semiconductor device provided with a number of programmable elements
05/16/1995US5416277 Cicuit and process of manufacturing the circuit
05/16/1995US5416049 Glassy binder system for ceramic substrates, thick films and the like
05/16/1995US5415922 Resin-coated bonding device
05/16/1995US5415920 Patterned chromium barrier layer with flange-like structure
05/16/1995US5415898 Integrated circuits
05/16/1995US5414928 Method of making an electronic package assembly with protective encapsulant material
05/16/1995CA1335617C Silicone conformal coatings
05/11/1995WO1995012895A1 Process for producing semiconductor element and pressure-sensitive adhesive sheet for sticking wafer
05/11/1995WO1995012643A1 Electrically conductive adhesives
05/11/1995DE4438658A1 Semiconductor device and method for producing the same
05/11/1995DE4338393A1 Arrangement for dissipating heat from (cooling) an electronic component soldered onto a printed circuit board
05/11/1995DE4338392A1 Arrangement for dissipating heat from (cooling) an electronic component soldered onto a printed circuit board
05/10/1995EP0652590A1 Method of fabricating a semiconductor device with a bump electrode
05/10/1995EP0651912A1 Miniature housing for electronic components
05/10/1995EP0552258B1 Liquid cooling system employing air purging mechanism
05/10/1995CN1102506A A highly intergrated semiconductor wiring structure and a method for manufacturing the same
05/10/1995CN1102424A Pastes for the coating of substrates, methods for manufacturing them and their use
05/09/1995US5414655 Semiconductor memory device having a stack-type capacitor
05/09/1995US5414637 Intra-module spare routing for high density electronic packages
05/09/1995US5414458 Semiconductor device lead inspection system
05/09/1995US5414302 Semiconductor device with a multilayered contact structure having a boro-phosphate silicate glass planarizing layer
05/09/1995US5414301 High temperature interconnect system for an integrated circuit
05/09/1995US5414300 Lid for semiconductor package and package having the lid
05/09/1995US5414299 Semi-conductor device interconnect package assembly for improved package performance
05/09/1995US5414298 Semiconductor chip assemblies and components with pressure contact
05/09/1995US5414297 Semiconductor device chip with interlayer insulating film covering the scribe lines
05/09/1995US5414296 Venetian blind cell layout for RF power transistor
05/09/1995US5414222 Multilayer IC semiconductor package
05/09/1995US5414221 Embedded ground plane and shielding structures using sidewall insulators in high frequency circuits having vias
05/09/1995US5413970 Process for manufacturing a semiconductor package having two rows of interdigitated leads
05/09/1995US5413968 Semiconductor device and manufacturing method thereof
05/09/1995US5413965 Method of making microelectronic device package containing a liquid
05/09/1995US5413962 Multi-level conductor process in VLSI fabrication utilizing an air bridge
05/09/1995US5413961 Method for forming a contact of a semiconductor device
05/09/1995US5413861 Semiconductor device encapsulated with a flame retardant epoxy molding compound
05/09/1995US5413751 Method for making heat-dissipating elements for micro-electronic devices
05/09/1995US5413489 Integrated socket and IC package assembly
05/09/1995US5413167 For use in an exposure apparatus
05/09/1995US5412868 Process of removing polymers in semiconductor vias
05/04/1995WO1995012214A1 Polysilicon pillar heat sinks for semiconductor on insulator circuits
05/04/1995WO1995011798A1 Thermally-conductive di-electric composite materials, and methods of forming same
05/04/1995DE4338706A1 Multilayer substrate
05/03/1995EP0651603A2 Flexible heat transfer device
05/03/1995EP0651490A1 Overvoltage protection circuit
05/03/1995EP0651440A1 High reliable power package for an electronic semiconductor circuit
05/03/1995EP0651436A1 Tungsten conductors formation process for semiconductor integrated circuits
05/03/1995EP0651433A1 Method of making a contact hole to a doped region
05/03/1995EP0651342A2 System for modeling an integrated chip package and method of operation
05/03/1995EP0651040A1 Liquid adhesive for electronic parts and process for forming insulating adhesive layer using the same
05/03/1995EP0650795A2 Solder ball connections and assembly process
05/03/1995EP0650658A1 Electronic package having controlled epoxy flow
05/03/1995EP0650504A1 Process for producing a flame-resistant epoxy resin molding material
05/03/1995EP0640151A4 Solder bumping of integrated circuit die.
05/03/1995EP0623242A4 Backplane grounding for flip-chip integrated circuit.
05/03/1995EP0497948B1 Method and device for hermetic encapsulation of electronic components
05/02/1995US5412540 Apparatus for removably applying a flat-pack to a socket
05/02/1995US5412539 Multichip module with a mandrel-produced interconnecting decal
05/02/1995US5412537 Electrical connector including variably spaced connector contacts
05/02/1995US5412536 Local condensation control for liquid impingement two-phase cooling
05/02/1995US5412535 Heat transfer device
05/02/1995US5412333 Semiconductor device having bonding optional circuit
05/02/1995US5412285 Linear amplifier incorporating a field emission device having specific gap distances between gate and cathode
05/02/1995US5412261 Two-stage programmable interconnect architecture
05/02/1995US5412250 Barrier enhancement at the salicide layer
05/02/1995US5412249 Multilayer element with group III and group V alloys or intermetallics
05/02/1995US5412248 Semiconductor device package with shaped parts for direct coupling to standard connectors
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