Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1995
06/13/1995US5424570 Contact structure for improving photoresist adhesion on a dielectric layer
06/13/1995US5424253 Method for manufacturing an inter-layer insulating film
06/13/1995US5424251 Method of producing semiconductor device having radiation part made of resin containing insulator powders
06/13/1995US5424249 Method of making mold-packaged pressure sensing semiconductor device
06/13/1995US5424248 Method of making an integrated circuit with variable pad pitch
06/13/1995US5424247 Method for making contact holes in semiconductor devices
06/13/1995US5424246 Method of manufacturing semiconductor metal wiring layer by reduction of metal oxide
06/13/1995US5424245 Method of forming vias through two-sided substrate
06/13/1995US5424030 Copper alloy for fine pattern lead frame
06/13/1995US5423475 Diffusion bonding with interlayer of silicon
06/13/1995US5423376 Heat exchanger for electronic components and electro-technical equipment
06/13/1995US5423375 CPU heat sink mounting structure
06/08/1995WO1995015579A1 Method for the encapsulation of components or elecetronic units and devices encapsulated using said method
06/08/1995WO1995015578A1 Rectifier diode
06/08/1995DE4443424A1 Multilayer substrate for power device controlled by microcomputer
06/08/1995CA2154480A1 Method for the encapsulation of components or elecetronic units and devices encapsulated using said method
06/07/1995EP0656741A2 Semiconductor package
06/07/1995EP0656658A1 High density memory structure
06/07/1995EP0656657A1 Arrangement for reduced noise level in a multi-level conductor integrated circuit
06/07/1995EP0656645A2 Field effect transistor with a sealed diffusion junction
06/07/1995EP0656151A1 Antifuse structure and method for forming
06/07/1995EP0656150A1 Metal electronic package incorporating a multi-chip module
06/07/1995CN1103423A Electrically conductive adhesives
06/06/1995US5422901 Semiconductor device with high heat conductivity
06/06/1995US5422790 Computer chip mounting hardware for heat dissipation
06/06/1995US5422788 Technique for enhancing adhesion capability of heat spreaders in molded packages
06/06/1995US5422779 Packaged solid-state surge protector
06/06/1995US5422615 High frequency circuit device
06/06/1995US5422516 Electronic parts loaded module including thermal stress absorbing projecting electrodes
06/06/1995US5422515 Semiconductor module including wiring structures each having different current capacity
06/06/1995US5422514 Packaging and interconnect system for integrated circuits
06/06/1995US5422513 Integrated circuit chip placement in a high density interconnect structure
06/06/1995US5422451 Adhesive layer is made of silver/tin alloy
06/06/1995US5422435 Circuit assembly
06/06/1995US5422314 Lead frame and production method for producing semiconductor device using the lead frame
06/06/1995US5422313 Integrated circuit device and manufacturing method using photoresist lead covering
06/06/1995US5422311 Depositing in situ phosphorus doped amorphous silicon film on substrate, annealing to form polysilicon and increase grain size, depositing tungsten silicide film, annealing to form polycide film with silicon layer at boundary, patterning
06/06/1995US5422308 Method of fabricating a tungsten contact
06/06/1995US5422307 Method of making an ohmic electrode using a TiW layer and an Au layer
06/06/1995US5422190 Via fill paste and method of using the same containing specific amounts of silver, gold and refractory oxides
06/06/1995US5422163 Flexible substrate with projections to block resin flow
06/06/1995US5421406 Heat sinks having pin-shaped fins and process for producing same
06/06/1995US5421402 Heat sink apparatus
06/01/1995WO1995015007A1 Electronic chip carrier package and method of making thereof
06/01/1995DE4442106A1 Transistor arrangement for e.g. MOSFet
06/01/1995DE4410947C1 Vertical integration semiconductor element
06/01/1995DE4404312C1 Connection device for microwave device unilateral planar line
06/01/1995DE4342369C1 Hybrid circuit terminal frame
06/01/1995DE4340847A1 Chip module with chip on substrate material
06/01/1995DE4340583A1 Temperature-stabilised hybrid circuit
06/01/1995DE4340047A1 Multilayer ceramic circuit material elements
06/01/1995DE4335512A1 Mfr. of silicon microchannel coolers for high-power laser diodes
05/1995
05/31/1995EP0655886A1 Ball grid array (BGA) packages
05/31/1995EP0655885A1 Ball grid array packages
05/31/1995EP0655884A1 Transport-by-suction type die
05/31/1995EP0655883A1 General-purpose lead working machine
05/31/1995EP0655782A2 Resin-sealed semiconductor device and method of fabricating same
05/31/1995EP0655780A1 Method for forming an aluminum contact
05/31/1995EP0655775A1 Dry etching process for SIOX compounds
05/31/1995EP0655705A2 Method for manufacturing identity cards having electronic modules
05/31/1995EP0655614A1 Integrated circuit having an on chip thermal circuit requiring only one dedicated integrated circuit pin and method of operation
05/31/1995CN1103205A Semiconductor device
05/31/1995CN1103204A Integrated circuit devices with solderable lead frame
05/31/1995CN1103203A Mass simultaneous sealing and electrical connection of electronic devices
05/30/1995US5420758 Integrated circuit package using a multi-layer PCB in a plastic package
05/30/1995US5420757 Method of producing a radio frequency transponder with a molded environmentally sealed package
05/30/1995US5420753 Structure for cooling an integrated circuit
05/30/1995US5420752 GPT system for encapsulating an integrated circuit package
05/30/1995US5420751 Ultra high density modular integrated circuit package
05/30/1995US5420462 Semiconductor device with conductors on stepped substrate having planar upper surfaces
05/30/1995US5420461 Integrated circuit having a two-dimensional lead grid array
05/30/1995US5420460 Thin cavity down ball grid array package based on wirebond technology
05/30/1995US5420459 Resin encapsulation type semiconductor device having an improved lead configuration
05/30/1995US5420456 Used in semiconductor circuitry
05/30/1995US5420455 Semiconductor device
05/30/1995US5420178 Flame-retardant epoxy molding compound
05/30/1995US5420101 Structures super conductor tracks and process for making them
05/30/1995US5420073 Structure and method for a superbarrier to prevent diffusion between a noble and a non-noble metal
05/30/1995US5420070 Manufacturing method of interconnection structure of semiconductor device
05/30/1995US5420069 Germanium-copper alloy
05/30/1995US5420058 Method of making field effect transistor with a sealed diffusion junction
05/30/1995US5419807 Method of providing electrical interconnect between two layers within a silicon substrate, semiconductor apparatus, and method of forming apparatus for testing semiconductor circuitry for operability
05/30/1995US5419806 Method for manufacturing a three-dimensional circuit apparatus
05/30/1995US5419780 Computers
05/30/1995US5419041 Process for manufacturing a pin type radiating fin
05/26/1995WO1995014330A1 Dual-sided push-pull amplifier
05/26/1995WO1995014314A1 Contact structure for interconnections, interposer, semiconductor assembly and method
05/26/1995WO1995014312A1 Solderable connector for high density electronic assemblies
05/26/1995WO1995014310A1 Antifuse with doped barrier metal layer
05/26/1995WO1995014309A1 Multi-chip electronic package module utilizing an adhesive sheet
05/26/1995WO1995014120A1 Method of making microchanneled heat exchangers utilizing sacrificial cores
05/26/1995WO1995013693A1 Diamond shaped gate mesh for cellular mos transistor array
05/24/1995EP0654866A2 Package for mating with a semiconductor die and method of manufacture
05/24/1995EP0654830A2 Semiconductor integrated circuit device
05/24/1995EP0654824A2 Electrostatic discharge protection device for semiconductor chip packages
05/24/1995EP0654823A2 Electrostatic discharge protection device for semiconductor chip packages
05/24/1995EP0654822A1 Heat sink assembly for integrated circuit
05/24/1995EP0654821A2 Electronic device having co-planar heatsink and electrical contacts
05/24/1995EP0654820A2 Semiconductor module
05/24/1995EP0654819A2 Heat dissipation device and associated fabrication process
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