Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1995
06/28/1995EP0659800A1 Polyimide precursor composition, polyimide composition and process for the production of said polyimide composition
06/28/1995EP0659782A1 Photodefinable dielectric layers
06/28/1995EP0659707A1 An aluminium nitride body and method for forming said body utilizing a vitreous sintering additive
06/28/1995EP0417484B1 Semiconductor memory device and process for making the same
06/28/1995CN1104415A 半导体器件 Semiconductor devices
06/28/1995CN1104413A Gold alloy wire for bonding semiconductor device
06/28/1995CN1104373A Interconnection structure for crosstalk reduction toimprove off-chip selectivity
06/28/1995CN1104320A Heat sink attachment assembly
06/27/1995US5428504 Cooling cover for RF power devices
06/27/1995US5428327 Microwave feedthrough apparatus
06/27/1995US5428251 Multi-layer wiring structure having continuous grain boundaries
06/27/1995US5428250 Laminated structure: first metal layer of low resistance material; second metal layer of a tantalum nitride alloy; amd a third layer of tantalum oxynitride
06/27/1995US5428248 Resin molded semiconductor package
06/27/1995US5428247 Down-bonded lead-on-chip type semiconductor device
06/27/1995US5428246 Highly integrated electronic component with heat-conductive plate
06/27/1995US5428245 For use in an integrated circuit package
06/27/1995US5428244 Metal silicide layer functions as electrode or as a wire
06/27/1995US5428242 Semiconductor devices with shielding for resistance elements
06/27/1995US5428229 Pressure contact type MOS semiconductor device and fabrication method of the same
06/27/1995US5428188 Low-cost package for electronic components
06/27/1995US5428057 Curing agent; curing catalyst; stress lowering agent; heat resistance-improving agent
06/27/1995US5427984 Method of making a cooling package for a semiconductor chip
06/27/1995US5427983 Depositing adhesion metal layer over etched molybdenum mask, overlays a metallic cushion layer and uppermost gold protective layer spreads over edges to cover exposed edges
06/27/1995US5427982 Method for fabricating a semiconductor device
06/27/1995US5427981 Process for fabricating metal plus using metal silicide film
06/27/1995US5427980 Method of making a contact of a semiconductor memory device
06/27/1995US5427979 Method for making multi-level antifuse structure
06/27/1995US5427973 Method for production of SOI transistor device having a storage cell
06/27/1995US5427972 Method of making a sidewall contact
06/27/1995US5427966 Process for fabricating a semiconductor device having floating gate and control gate electrodes
06/27/1995US5427961 Semiconductor device and method for forming the same
06/27/1995US5427938 Method of manufacturing a resin-sealed semiconductor device
06/27/1995US5427641 Method of forming a mounting structure on a tape carrier
06/27/1995US5427303 Fluxless solder coating and joining
06/27/1995US5426849 Method of producing a polyimide multilayer wiring board
06/22/1995WO1995017009A1 Semiconductor device
06/22/1995WO1995017007A1 Efficient routing method and resulting structure for integrated circuits
06/22/1995WO1995017005A1 Method for fabricating self-assembling microstructures
06/22/1995WO1995016797A1 Molybdenum-tungsten material for wiring, molybdenum-tungsten target for wiring, process for producing the same, and molybdenum-tungsten wiring thin film
06/22/1995DE4445796A1 Semiconductor device contg. MOSFET
06/22/1995DE4444618A1 Halbleiterlaser Semiconductor laser
06/22/1995DE4343494A1 Hf feed for laser module with Peltier cooling device
06/22/1995DE4343149A1 Power resistor for incorporation in assembly of liq. coolers and semiconductor cells
06/22/1995DE4342553A1 Heat dissipation element for electronic component
06/21/1995EP0658937A1 Vertical IC chip stack with discrete chip carriers formed from dielectric tape
06/21/1995EP0658936A2 Multilayer semiconductor device
06/21/1995EP0658935A2 Resin sealing type semiconductor device and method of making the same
06/21/1995EP0658934A2 Heat sink
06/21/1995EP0658933A2 Semiconductor devices and method for manufacturing the same
06/21/1995EP0658932A2 Ceramic substrate for semiconductor device
06/21/1995EP0658929A1 Process for delaminating organic resin from board and process for manufacturating organic resin multi-layer wiring board
06/21/1995EP0658927A1 Process for forming a parallel pipe-shaped cavity for receiving a component in a support plate
06/21/1995CN2201727Y Ceramic package semi-conductor anti-electrophoresis device
06/21/1995CN1103928A Microminiature stirling cycle cryocoolers and engines
06/21/1995CN1029056C Cooling apparatus for electronic elements
06/20/1995US5426566 Multichip integrated circuit packages and systems
06/20/1995US5426565 Electronic package clamping arrangement
06/20/1995US5426563 Three-dimensional multichip module
06/20/1995US5426405 Family of different-sized demountable hybrid assemblies with microwave-bandwidth interconnects
06/20/1995US5426399 Film carrier signal transmission line having separating grooves
06/20/1995US5426375 Method and apparatus for optimizing high speed performance and hot carrier lifetime in a MOS integrated circuit
06/20/1995US5426331 Semiconductor device with multi-layered heat-resistive electrode in titanium-titanium nitride-plantinum-gold system
06/20/1995US5426330 A interconnector for integrated circuits having a protective coating encapsulated the electrical lines; wear resistance, corrosion resistance
06/20/1995US5426329 Uniformity doping
06/20/1995US5426325 Metal crossover in high voltage IC with graduated doping control
06/20/1995US5426319 High-frequency semiconductor device including microstrip transmission line
06/20/1995US5426266 Die bonding connector and method
06/20/1995US5426263 Electronic assembly having a double-sided leadless component
06/20/1995US5426072 Process of manufacturing a three dimensional integrated circuit from stacked SOI wafers using a temporary silicon substrate
06/20/1995US5425982 Multi-layer wiring structure for semiconductor device and method of making the same
06/20/1995US5425649 Connector system having switching and testing functions using tapered spring contact elements and actuators therefor
06/16/1995CA2137969A1 Heat sink
06/15/1995WO1995016177A1 Heat sink with a heat plate
06/15/1995WO1995015905A1 Detaching linerless labels
06/15/1995CA2153803A1 Detaching linerless labels
06/14/1995EP0658074A1 Assembly of a printed circuit board and at least one component, and method of fastening a component to a printed circuit board
06/14/1995EP0657949A1 Superconducting ceramics elongated body and method of manufacturing the same
06/14/1995EP0657932A2 Terminal electrode for a chip package, assembly and method of production
06/14/1995EP0657931A1 Semiconductor device and manufacturing method of the same
06/14/1995EP0657925A1 Enhanced planarization technique for an integrated circuit
06/14/1995EP0657923A2 Method of protecting a solder ball during an etch process, by applying a resist around the base of the solder ball
06/14/1995EP0657922A1 A packaged semiconductor device and method of its manufacture
06/14/1995EP0657921A1 Semiconductor device and method of producing the same
06/14/1995EP0657553A1 Nitrogenous aluminum-silicon powder metallurgical alloy
06/14/1995DE4429004A1 Support spider for integrated circuit chip terminals
06/14/1995DE4339989A1 Mfg. solderable metal structures for contacting of electric modules
06/14/1995DE3844719C2 Bonding layer for semiconductor device e.g. MOS RAM - has conductive layer on buried dielectric
06/14/1995CN1103734A Chip carrier with protective coating for circuitized surface
06/14/1995CN1028937C Chip carrier with protective coating for circuitized surface
06/13/1995US5424920 Non-conductive end layer for integrated stack of IC chips
06/13/1995US5424919 Repairable electronic circuit package
06/13/1995US5424918 Universal hybrid mounting system
06/13/1995US5424917 Semiconductor device and method for mounting semiconductor wafer
06/13/1995US5424896 Semiconductor package electrostatic discharge damage protection
06/13/1995US5424693 Surface mountable microwave IC package
06/13/1995US5424580 Electro-mechanical assembly of high power and low power IC packages with a shared heat sink
06/13/1995US5424579 Semiconductor device having low floating inductance
06/13/1995US5424578 Lead frame for use in a semiconductor device and a semiconductor device using the same
06/13/1995US5424577 Lead frame for semiconductor device
06/13/1995US5424576 Semiconductor device having x-shaped die support member and method for making the same
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