| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/12/1995 | EP0662711A1 A hermetic package for a high power semiconductor device |
| 07/12/1995 | EP0662710A1 Method of fabricating a conducting connection between at least two metallisations of an integrated circuit |
| 07/12/1995 | EP0662709A2 Method of testing semiconductor circuit layers |
| 07/12/1995 | EP0662708A1 Thermocompression bonding using an aluminium-gold intermetallic |
| 07/12/1995 | EP0662278A1 Hermetically sealed circuit modules having conductive cap anchors |
| 07/12/1995 | EP0662246A1 Liquid-coolant cooling element |
| 07/12/1995 | EP0662245A1 A thin multichip module |
| 07/12/1995 | EP0662244A1 Plastic semiconductor package with aluminum heat spreader |
| 07/12/1995 | EP0662019A1 Method for making a ceramic metal composite |
| 07/12/1995 | CN1105120A Cooling apparatusm and assembling method thereof |
| 07/11/1995 | US5432913 Computer system module |
| 07/11/1995 | US5432708 Multichip module integrated circuit device having maximum input/output capability |
| 07/11/1995 | US5432679 Pressure equalizer for an integrated circuit chip interconnected to circuitry on a thin film membrane |
| 07/11/1995 | US5432677 Multi-chip integrated circuit module |
| 07/11/1995 | US5432675 Multi-chip module having thermal contacts |
| 07/11/1995 | US5432440 Detection of tri-state logic signals |
| 07/11/1995 | US5432380 Apparatus for tape-mounting a semiconductor device |
| 07/11/1995 | US5432127 Method for making a balanced capacitance lead frame for integrated circuits having a power bus and dummy leads |
| 07/11/1995 | US5431863 Method of mounting semiconductor device |
| 07/11/1995 | US5431718 Silver, binder, aluminum oxide spinel |
| 07/11/1995 | US5431579 Socket for IC package |
| 07/11/1995 | US5431328 Method for forming a bonded structure |
| 07/07/1995 | CA2139454A1 Thermocompression bonding using an aluminum-gold intermetallic |
| 07/07/1995 | CA2139453A1 Package for parallel subelement semiconductor devices and method |
| 07/07/1995 | CA2139452A1 Hermetic package for a high power semiconductor device |
| 07/06/1995 | WO1995018522A1 Printed wiring board |
| 07/06/1995 | WO1995018464A1 Protective coating combination for lead frames |
| 07/06/1995 | WO1995018249A1 Method and apparatus for processing surface with plasma under atmospheric pressure, method of producing semiconductor device and method of producing ink-jet printing head |
| 07/06/1995 | DE4444584A1 Semiconductor wafer for burn-in testing of integrated circuits |
| 07/05/1995 | EP0661917A1 Power dissipation apparatus and method for making |
| 07/05/1995 | EP0661916A1 Heat dissipating sheet |
| 07/05/1995 | EP0661778A2 Method and apparatus for providing electrical power to electronic devices enclosed in a chip carrier |
| 07/05/1995 | EP0661763A1 Superconducting ceramics elongated body and method of manufacturing the same |
| 07/05/1995 | EP0661748A1 Semiconductor device |
| 07/05/1995 | EP0661747A1 Semiconductor package |
| 07/05/1995 | EP0661746A1 Microwave integrated circuit and their fabrication |
| 07/05/1995 | EP0661745A1 Metal-to-metal antifuse including etch stop layer |
| 07/05/1995 | EP0661744A1 Semiconductor integrated circuit device |
| 07/05/1995 | EP0661743A2 Film carrier tape for use in tape automated bonding |
| 07/05/1995 | EP0661742A1 Integrated circuits with passivation and metallization for hermetic protection |
| 07/05/1995 | EP0661741A1 Heat-pipe type cooling apparatus |
| 07/05/1995 | EP0661740A2 Thermal management of electronic components using synthetic diamond |
| 07/05/1995 | EP0661739A2 Pin-grid array with a cooling structure |
| 07/05/1995 | EP0661738A1 Cavity down mounting seam welding ceramic package for semiconducteur device |
| 07/05/1995 | EP0661550A2 Method for burning-in semiconductor chips |
| 07/05/1995 | EP0661322A2 Modified polyepoxy compound, process for producing the compound, and epoxy resin composition |
| 07/05/1995 | EP0540578A4 Compact sram cell layout |
| 07/05/1995 | CN1029274C Multichip module and integrated circuit substrates having planarized patterned surfaces |
| 07/04/1995 | US5430611 Spring-biased heat sink assembly for a plurality of integrated circuits on a substrate |
| 07/04/1995 | US5430610 Separable positioning device for the heat sink on computer chips |
| 07/04/1995 | US5430331 Plastic encapsulated integrated circuit package having an embedded thermal dissipator |
| 07/04/1995 | US5430330 Semiconductor device, resin for sealing same and method of fabricating same |
| 07/04/1995 | US5430329 Semiconductor device with bonding pad electrode |
| 07/04/1995 | US5430328 Process for self-align contact |
| 07/04/1995 | US5430327 Ohmic contact for III-V semiconductor materials |
| 07/04/1995 | US5430325 Semiconductor chip having dummy pattern |
| 07/04/1995 | US5430258 Copper interconnection structure and method of preparing same |
| 07/04/1995 | US5430250 Wire support and guide |
| 07/04/1995 | US5430247 Twisted-pair planar conductor line off-set structure |
| 07/04/1995 | US5430012 Superconducting multilayer interconnection formed of a-axis and c-axis oriented oxide superconductor materials |
| 07/04/1995 | US5429995 Method of manufacturing silicon oxide film containing fluorine |
| 07/04/1995 | US5429992 Lead frame structure for IC devices with strengthened encapsulation adhesion |
| 07/04/1995 | US5429987 Method for profile control of selective metallization |
| 07/04/1995 | US5429958 Process for forming twin well CMOS integrated circuits |
| 07/04/1995 | US5429859 LTCC alignment marks for mechanical parts placement |
| 07/04/1995 | US5429670 Gold paste for a ceramic circuit board |
| 07/04/1995 | US5428982 Machine tool with cam gear, in particular for punching and shaping the lead-outs of integrated circuits |
| 07/04/1995 | US5428897 Heat sink attachment assembly |
| 07/04/1995 | US5428889 Method for manufacturing composite lead frame |
| 07/04/1995 | US5428885 Method of making a multilayer hybrid circuit |
| 06/30/1995 | CA2133898A1 Integrated circuits with passivation and metallization for hermetic protection |
| 06/29/1995 | WO1995017768A1 Address line repair structure and method for thin film imager devices |
| 06/29/1995 | WO1995017767A1 Repair line structure for thin film electronic devices |
| 06/29/1995 | WO1995017765A2 Liquid cooled heat sink for cooling electronic components |
| 06/29/1995 | DE4446881A1 Durchgangsloch und Herstellungsverfahren eines Durchgangslochs Through-hole, and manufacturing method of a through hole |
| 06/28/1995 | EP0660651A1 Multilayer ceramic circuit substrate, process for producing the same, and electrically conductive material for use in multilayer ceramic circuit substrate |
| 06/28/1995 | EP0660562A2 Clock frequency modulation for secure microprocessors |
| 06/28/1995 | EP0660416A1 Semiconductor device with reduced high voltage termination area and high breakdown voltage |
| 06/28/1995 | EP0660415A1 Stacked high voltage transistor unit |
| 06/28/1995 | EP0660409A1 Method for fabricating integrated circuits |
| 06/28/1995 | EP0660408A1 A method of manufacturing antifuse devices |
| 06/28/1995 | EP0660407A1 Adhesive for semiconductor device and reinforcing material using the same |
| 06/28/1995 | EP0660406A2 Manufacture of semiconductor devices and novel lead frame assembly |
| 06/28/1995 | EP0660405A2 Surface mount chip package |
| 06/28/1995 | EP0660404A2 Element joining pad for semiconductor device mounting board |
| 06/28/1995 | EP0660403A1 Semiconductor device |
| 06/28/1995 | EP0660402A1 Integrated structure pad assembly for wire bonding on active area in power semiconductor devices, particularly with cellular structure, and manufacturing process therefor |
| 06/28/1995 | EP0660401A2 Resin-encapsulated semiconductor device |
| 06/28/1995 | EP0660400A1 Thermoconductive element, utilized in electronics as a printed circuit support or as a component and its method of fabrication |
| 06/28/1995 | EP0660399A2 Ball-grid-array integrated circuit package with thermal conductivity |
| 06/28/1995 | EP0660398A1 Flame-retardant epoxy resin composition for semiconductor encapsulation |
| 06/28/1995 | EP0660397A2 High thermal conductive silicon nitride structural member, semiconductor package, heater and thermal head |
| 06/28/1995 | EP0660396A1 Power MOS device chip and package assembly |
| 06/28/1995 | EP0660394A1 CMOS integrated circuit fabrication |
| 06/28/1995 | EP0660393A1 Method and dielectric structure for facilitating overetching of metal without damage to inter-level dielectric |
| 06/28/1995 | EP0660392A1 Method and interlevel dielectric structure for improved metal step coverage |
| 06/28/1995 | EP0660386A1 Test structure for integrated circuit |
| 06/28/1995 | EP0660384A1 Method for electrodeposition of solder |
| 06/28/1995 | EP0660383A1 Electronic device package |
| 06/28/1995 | EP0660382A2 Hybrid circuits and a method of manufacture |