Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2013
09/18/2013CN101771019B Dies, stacked structures, and systems
09/18/2013CN101752378B Semiconductor device and manufacturing method of the same
09/18/2013CN101707197B Omnibearing luminous LED device
09/18/2013CN101577243B 半导体结构及其制作方法 Semiconductor structure and fabrication method
09/18/2013CN101544089B Heat-conductive laminated material and manufacturing method thereof
09/18/2013CN101414586B Package for a power semiconductor device and package method
09/18/2013CN101350340B Semiconductor device and manufacture method of the same
09/17/2013US8537524 Capacitor structure in a semiconductor device
09/17/2013US8536780 Lighting device and attachment board of lighting device
09/17/2013US8536718 Integrated circuit packaging system with trenches and method of manufacture thereof
09/17/2013US8536716 Supply voltage or ground connections for integrated circuit device
09/17/2013US8536715 Semiconductor device and method of manufacturing the same
09/17/2013US8536714 Interposer, its manufacturing method, and semiconductor device
09/17/2013US8536713 System in package with heat sink
09/17/2013US8536712 Memory device and method of manufacturing the same
09/17/2013US8536711 Chip-stacked semiconductor and manufacturing method thereof
09/17/2013US8536710 Semiconductor device and manufacturing method thereof
09/17/2013US8536709 Wafer with eutectic bonding carrier and method of manufacturing the same
09/17/2013US8536708 Method of manufacturing a semiconductor device and semiconductor device
09/17/2013US8536707 Semiconductor structure comprising moisture barrier and conductive redistribution layer
09/17/2013US8536706 Method for fabricating semiconductor device and semiconductor device
09/17/2013US8536705 Integrated circuit system with through silicon via and method of manufacture thereof
09/17/2013US8536704 Semiconductor device and method for fabricating the same
09/17/2013US8536703 Semiconductor devices and electronic systems
09/17/2013US8536702 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
09/17/2013US8536701 Electronic device packaging structure
09/17/2013US8536700 Stackable electronic package and method of fabricating same
09/17/2013US8536699 Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
09/17/2013US8536698 Semiconductor device
09/17/2013US8536697 Packaged die for heat dissipation and method therefor
09/17/2013US8536696 Conductive pin attached to package substrate
09/17/2013US8536695 Chip-last embedded interconnect structures
09/17/2013US8536693 Tiered integrated circuit assembly and a method for manufacturing the same
09/17/2013US8536692 Mountable integrated circuit package system with mountable integrated circuit die
09/17/2013US8536691 Semiconductor device and method for manufacturing the same
09/17/2013US8536690 Integrated circuit packaging system with cap layer and method of manufacture thereof
09/17/2013US8536689 Integrated circuit package system with multi-surface die attach pad
09/17/2013US8536688 Integrated circuit leadframe and fabrication method therefor
09/17/2013US8536687 Semiconductor device having separated heatsink and chip mounting portion
09/17/2013US8536686 Semiconductor device
09/17/2013US8536685 Shielded semiconductor device structure
09/17/2013US8536684 Method of assembling shielded integrated circuit device
09/17/2013US8536675 Thermally insulated phase change material memory cells
09/17/2013US8536672 Image sensor package and fabrication method thereof
09/17/2013US8536670 Semiconductor device, manufacturing method therefor, and electronic apparatus
09/17/2013US8536643 Semiconductor device
09/17/2013US8536634 Memory device transistors
09/17/2013US8536631 Data cells and connections to data cells
09/17/2013US8536612 Light emitting device having a pluralilty of light emitting cells and package mounting the same
09/17/2013US8536584 High voltage wire bond free LEDS
09/17/2013US8536573 Plating process and structure
09/17/2013US8536572 Assembled multi-component electronic apparatus using alignment and reference marks
09/17/2013US8536069 Multilayered low k cap with conformal gap fill and UV stable compressive stress properties
09/17/2013US8535995 Method of manufacturing organic light-emitting display device
09/17/2013US8535989 Embedded semiconductive chips in reconstituted wafers, and systems containing same
09/17/2013US8535978 Die up fully molded fan-out wafer level packaging
09/17/2013US8535976 Method for fabricating chip package with die and substrate
09/17/2013US8535965 Silicon nitride film, a semiconductor device, a display device and a method for manufacturing a silicon nitride film
09/17/2013CA2572691C Semiconductor element with a passivation layer and method for production thereof
09/12/2013WO2013134749A1 3-d integrated package
09/12/2013WO2013134054A1 3d packaging with low-force thermocompression bonding of oxidizable materials
09/12/2013WO2013134018A1 Compositions of resin-linear organosiloxane block copolymers
09/12/2013WO2013133827A1 Glass clad microelectronic substrate
09/12/2013WO2013133430A1 Surface-modified-metal-oxide-particle material, composition for sealing optical semiconductor element, and optical semiconductor device
09/12/2013WO2013133282A1 Curable composition, encapsulating material for semiconductor light emitting devices using same, and semiconductor light emitting device
09/12/2013WO2013133268A1 Sheet for forming resin film for chips
09/12/2013WO2013133122A1 High-frequency package
09/12/2013WO2013132758A1 Printed semiconductor, fabrication method for same, and stamp
09/12/2013WO2013132749A1 Semiconductor device, semiconductor device manufacturing method, and semiconductor manufacturing apparatus
09/12/2013WO2013132644A1 Semiconductor module
09/12/2013WO2013109593A3 Laser assisted transfer welding process
09/12/2013WO2013032956A3 Methods of fabricating semiconductor chip solder structures by reflowing a first and a second metallic layer and corresponding device
09/12/2013US20130237018 Adhesive for electronic components, and manufacturing method for semiconductor chip mount
09/12/2013US20130235655 Via formation for cross-point memory
09/12/2013US20130235643 Semiconductor device having a fuse
09/12/2013US20130235636 Power module
09/12/2013US20130234789 Semiconductor integrated circuit apparatus having i/o signal line
09/12/2013US20130234750 Semiconductor wafer and method for testing the same
09/12/2013US20130234344 Flip-chip packaging techniques and configurations
09/12/2013US20130234343 Through-hole substrate and method of producing the same
09/12/2013US20130234342 Semiconductor device
09/12/2013US20130234341 Interposer substrate manufacturing method and interposer substrate
09/12/2013US20130234339 Semiconductor device and method of manufacturing same, and management system of semiconductor device
09/12/2013US20130234338 Semiconductor device and method for manufacturing the same
09/12/2013US20130234337 Semiconductor package and fabrication method thereof
09/12/2013US20130234336 Processes for forming integrated circuits and integrated circuits formed thereby
09/12/2013US20130234335 Hno3 single wafer clean process to strip nickel and for mol post etch
09/12/2013US20130234334 Semiconductor device with a line and method of fabrication thereof
09/12/2013US20130234333 Copper interconnects having a titanium-titanium nitride assembly between copper and compound semiconductor
09/12/2013US20130234332 Semiconductor device and method for manufacturing the same
09/12/2013US20130234330 Semiconductor Packages and Methods of Formation Thereof
09/12/2013US20130234329 Structures and methods to reduce maximum current density in a solder ball
09/12/2013US20130234328 Methods of fluxless micro-piercing of solder balls, and resulting devices
09/12/2013US20130234327 Semiconductor device bonding with stress relief connection pads
09/12/2013US20130234326 Semiconductor apparatus and method for manufacturing the same
09/12/2013US20130234325 Filled through-silicon via and the fabrication method thereof
09/12/2013US20130234324 Semiconductor Device and Method of Forming Vertically Offset Conductive Pillars Over First Substrate Aligned to Vertically Offset BOT Interconnect Sites Formed Over Second Substrate
09/12/2013US20130234323 Semiconductor chip and manufacturing method thereof
09/12/2013US20130234322 Thin 3D Fan-Out Embedded Wafer Level Package (EWLB) for Application Processor and Memory Integration
09/12/2013US20130234321 Semiconductor device and method for manufacturing the same
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