Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1995
08/01/1995US5438167 Ferrimagnetic vias within multi-layer 3-dimensional structures/substrates
08/01/1995US5438166 Customizable circuitry
08/01/1995US5438165 Integrated circuit interconnect leads releasably mounted on film
08/01/1995US5438023 Passivation method and structure for a ferroelectric integrated circuit using hard ceramic materials or the like
08/01/1995US5438022 Method for using low dielectric constant material in integrated circuit fabrication
08/01/1995US5438021 Method of manufacturing a multiple-chip semiconductor device with different leadframes
08/01/1995US5437921 Electronic components mounting base material
08/01/1995US5437915 Semiconductor leadframe and its production method and plastic encapsulated semiconductor device
08/01/1995US5437764 Lead frame and manufacturing method therefor
08/01/1995US5437763 Method for formation of contact vias in integrated circuits
08/01/1995US5437561 Self-locking tab
08/01/1995US5437557 IC socket
08/01/1995US5437328 Multi-stage heat sink
08/01/1995US5437327 CPU heat dissipating fan device
08/01/1995US5437096 Method for making a multilayer metal leadframe
08/01/1995US5437095 Method of making plastic encapsulated integrated circuit package
07/1995
07/27/1995WO1995020244A1 Package for electronic element
07/27/1995DE4441905A1 Semiconductor device esp. LED with increased life
07/27/1995DE4401956A1 Power semiconductor device, esp. MOSFET with temp. sensor
07/27/1995DE4401608C1 Thermally conductive electrically insulating adhesive joint
07/27/1995DE4401607A1 Rectangular cooling tube for power semiconductors
07/27/1995CA2157682A1 Package for electronic element
07/26/1995EP0664576A2 Pinned module
07/26/1995EP0664567A1 Microwave power transistor with double recess and its fabrication process
07/26/1995EP0664563A1 TAB Bonding pads geometry for semiconductor devices
07/26/1995EP0664562A1 Ball grid array plastic package
07/26/1995CN1105782A Encapsulating method for semiconductor transistor elements embedded circuit board
07/25/1995US5436997 Optical fiber-optical device coupling package and optical fiber-optical device module
07/25/1995US5436801 Method and structure for routing power for optimum cell utilization with two and three level metal in a partially predesigned integrated circuit
07/25/1995US5436798 Spring clip and heat sink assembly for electronic components
07/25/1995US5436793 Apparatus for containing and cooling an integrated circuit device having a thermally insulative positioning member
07/25/1995US5436573 High-speed semiconductor integrated circuit device with reduced delay in gate-to-gate wiring
07/25/1995US5436505 Titanium oxidation and diffusion resistance layer formed on titanium contact; used for diodes, transistors and thermistors
07/25/1995US5436503 Semiconductor device and method of manufacturing the same
07/25/1995US5436502 Semiconductor component and method for the manufacturing thereof
07/25/1995US5436501 Cooling structure for integrated circuit
07/25/1995US5436500 Surface mount semiconductor package
07/25/1995US5436497 Semiconductor device having a plurality of vertical type transistors having non-intersecting interconnections
07/25/1995US5436496 Vertical fuse device
07/25/1995US5436492 Charge-coupled device image sensor
07/25/1995US5436473 Gate lead for center gate pressure assembled thyristor
07/25/1995US5436412 Interconnect structure having improved metallization
07/25/1995US5436411 Fabrication of substrates for multi-chip modules
07/25/1995US5436410 Method and structure for suppressing stress-induced defects in integrated circuit conductive lines
07/25/1995US5436407 Metal semiconductor package with an external plastic seal
07/25/1995US5436203 Shielded liquid encapsulated semiconductor device and method for making the same
07/25/1995US5436202 Method and apparatus for hermetically sealing semiconductor package
07/25/1995US5436200 Increasing the adhesion of tungsten and silicon oxide layer by first forming a silicon layer, then tungsten silicide with tungsten fluoride, reducing to tungsten
07/25/1995US5436197 Method of manufacturing a bonding pad structure
07/25/1995US5436084 To form borosilicate ceramic
07/25/1995US5436083 Protective electronic coatings using filled polysilazanes
07/25/1995US5436082 Protective coating combination for lead frames
07/25/1995US5436029 Curing silicon hydride containing materials by exposure to nitrous oxide
07/25/1995US5435888 Enhanced planarization technique for an integrated circuit
07/25/1995US5435875 Method of manufacturing cavitied ceramic multilayer block
07/25/1995US5435734 Direct integrated circuit interconnector system
07/25/1995US5435732 Flexible circuit member
07/25/1995US5435446 BGA tube
07/25/1995US5435058 Hybrid/microwave enclosures and method of making same
07/20/1995WO1995019645A1 Methods and apparatus for producing integrated circuit devices
07/20/1995WO1995019644A1 Chamfered electronic package component
07/20/1995WO1995019643A1 Improved low-cost package for electronic components
07/20/1995CA2181339A1 Methods and apparatus for producing integrated circuit devices
07/19/1995EP0663693A1 Low thermal impedance integrated circuit
07/19/1995EP0663102A1 Power semiconductor integrated circuit package
07/19/1995CN1105481A Spring clamp and heat sink assembly
07/18/1995US5434917 Unforgeable identification device, identification device reader and method of identification
07/18/1995US5434751 Reworkable high density interconnect structure incorporating a release layer
07/18/1995US5434750 Partially-molded, PCB chip carrier package for certain non-square die shapes
07/18/1995US5434452 Z-axis compliant mechanical IC wiring substrate and method for making the same
07/18/1995US5434451 Tungsten liner process for simultaneous formation of integral contact studs and interconnect lines
07/18/1995US5434450 PGA package type semiconductor device having leads to be supplied with power source potential
07/18/1995US5434449 Semiconductor device in a single package with high wiring density and a heat sink
07/18/1995US5434448 Programmable contact structure
07/18/1995US5434436 Master-slice type semiconductor integrated circuit device having multi-power supply voltage
07/18/1995US5434432 Hydrogenated silicon carbide between conductors
07/18/1995US5434363 Multilayer printed circuits with protective layers and tantalum wires
07/18/1995US5434358 High density hermetic electrical feedthroughs
07/18/1995US5434357 Reduced semiconductor size package
07/18/1995US5434199 Tris-phenolmethane multifunctional resin and hardener; fused silica, silicone rubber and fluid; noncracking; integrated circuits
07/18/1995US5434106 Integrated circuit device and method to prevent cracking during surface mount
07/18/1995US5434105 Process for attaching a lead frame to a heat sink using a glob-top encapsulation
07/18/1995US5434095 Method for controlling electrical breakdown in semiconductor power devices
07/18/1995US5434094 Method of producing a field effect transistor
07/18/1995US5434044 Method for the formation of tin barrier layer with preferential (111) crystallographic orientation
07/18/1995US5433822 Method of manufacturing semiconductor device with copper core bumps
07/18/1995US5433260 Sealable electronics packages and methods of producing and sealing such packages
07/18/1995US5432999 Integrated circuit lamination process
07/18/1995US5432998 Gold-tin eutectic, alloy
07/18/1995CA1336334C Sintered body of aluminum nitride
07/15/1995CA2140311A1 Multilayer laminate product and process
07/13/1995WO1995019045A1 Process for filling contact holes
07/13/1995DE4423558A1 Conductive layer esp. for MOSFET
07/13/1995DE19500422A1 Semiconductor component with high heat emission
07/12/1995EP0662732A1 Circuit connection in an electrical assembly
07/12/1995EP0662721A1 Electromagnetic radiation detector and method of fabrication
07/12/1995EP0662715A1 Package for parallel subelement semiconductor devices and method
07/12/1995EP0662714A1 Semiconductor device and process for producing same
07/12/1995EP0662713A2 Minimal capture pads applied to ceramic vias in ceramic subtrates
07/12/1995EP0662712A1 Antifuse and method of manufacturing it
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