Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1995
08/17/1995WO1995022175A1 Improved thermally conductive interface
08/17/1995WO1995022172A1 Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
08/16/1995EP0667737A1 Heat conductive device for electrical components
08/16/1995EP0667643A1 Electromagnetic interference suppressing body having low electromagnetic transparency and reflection, and electronic device having the same
08/16/1995EP0667642A1 Method of marking gold-plated lids of electronic components
08/16/1995EP0667640A2 Multilayer laminate product and process
08/16/1995EP0667639A2 Method of manufacturing semiconductor device
08/16/1995EP0667036A1 Chip interconnection having a breathable etch stop layer
08/16/1995CN1106926A Method for testing electronic devices attached to a leadframe
08/16/1995CN1106898A Spring clamp assembly with electrically insulating shoe
08/15/1995US5442589 Fuse circuitry having physical fuse and non-volatile memory cell coupled to a detector
08/15/1995US5442241 Bump electrode structure to be coupled to lead wire in semiconductor device
08/15/1995US5442239 Structure and method for corrosion and stress-resistant interconnecting metallurgy
08/15/1995US5442238 Interconnection structure of a semiconductor device
08/15/1995US5442237 Semiconductor device having a low permittivity dielectric
08/15/1995US5442236 Semiconductor device having a multilayered wiring structure with dummy wiring
08/15/1995US5442235 Semiconductor device having an improved metal interconnect structure
08/15/1995US5442234 Apparatus for thermally coupling a heat sink to a leadframe
08/15/1995US5442233 Packaged semiconductor device and a lead frame therefor, having a common potential lead with lead portions having dual functions of chip support and heat dissipation
08/15/1995US5442232 Thin semiconductor package having many pins and likely to dissipate heat
08/15/1995US5442231 Semiconductor device
08/15/1995US5442230 High density integrated circuit assembly combining leadframe leads with conductive traces
08/15/1995US5442229 Metal lead-film carrier assembly having a plurality of film carriers, and film carrier-semiconductor chip assembly and semiconductor device containing such metal lead-film carrier assembly
08/15/1995US5442228 Monolithic shielded integrated circuit
08/15/1995US5442225 Integrated circuit having interconnects with ringing suppressing elements
08/15/1995US5442213 Semiconductor device with high dielectric capacitor having sidewall spacers
08/15/1995US5442145 Metal core having gold covering layer and nickel underlay layer, for high strength bonding
08/15/1995US5442134 Lead structure of semiconductor device
08/15/1995US5441918 Method of making integrated circuit die package
08/15/1995US5441917 Method of laying out bond pads on a semiconductor die
08/15/1995US5441914 Method of forming conductive interconnect structure
08/15/1995US5441898 Fabricating a semiconductor with an insulative coating
08/15/1995US5441845 Curable; films for protecting electronic parts
08/15/1995US5441791 Laminated diamond substrate
08/15/1995US5441690 Process of making pinless connector
08/15/1995US5441684 Method of forming molded plastic packages with integrated heat sinks
08/15/1995US5441102 Heat exchanger for electronic equipment
08/15/1995US5441094 Trench planarization techniques
08/15/1995US5440805 Method of manufacturing a multilayer circuit
08/14/1995EP0724778A4 Anodized aluminum electronic package components
08/10/1995WO1995021518A1 Detachable apparatus for cooling integrated circuits
08/10/1995WO1995021459A1 Semiconductor storage component with a plurality of storage chips in a shared casing
08/10/1995WO1995021376A1 Device for imaging a three-dimensional object
08/10/1995DE19503823A1 Semiconductor device package forming process
08/09/1995EP0666595A1 Method of manufacture of a cubic integrated circuit structure
08/09/1995EP0666594A1 Semiconductor device and hybrid integrated circuit
08/09/1995EP0666593A1 Electronic circuit device
08/09/1995EP0666592A2 Method for forming a dielectric layer on a high temperature metal layer
08/09/1995EP0666245A2 Suscepter and process for production thereof
08/09/1995EP0448702B1 Application specific tape automated bonding
08/09/1995CN1106606A Metal base board and elecronic equipment using the same
08/09/1995CN1106580A Anisotropic conductive film, manufacturing method and connector using the same
08/08/1995US5440454 Electrical connecting device and method for making same
08/08/1995US5440453 Extended architecture for FPGA
08/08/1995US5440452 Surface mount components and semifinished products thereof
08/08/1995US5440451 Memory Assembly
08/08/1995US5440241 Method for testing, burning-in, and manufacturing wafer scale integrated circuits and a packaged wafer assembly produced thereby
08/08/1995US5440240 Z-axis interconnect for discrete die burn-in for nonpackaged die
08/08/1995US5440172 Integral heat sink interface
08/08/1995US5440170 Semiconductor device having a die pad with rounded edges and its manufacturing method
08/08/1995US5440169 Resin-packaged semiconductor device with flow prevention dimples
08/08/1995US5440167 Antifuse with double via contact and method of manufacture therefor
08/08/1995US5439849 Encapsulating semiconductor by coating device mounted on substrate with layer of silicone or polyimide, then with layer of glass using chemical vapor deposition
08/08/1995US5439848 Method for fabricating a self-aligned multi-level interconnect
08/08/1995US5439832 Method for fabricating semiconductor device
08/08/1995US5439765 Photomask for semiconductor integrated circuit device
08/08/1995US5439732 Ceramic multi-layer wiring board
08/08/1995US5439731 Interconnect structures containing blocked segments to minimize stress migration and electromigration damage
08/08/1995US5439638 Method of making flowable tungsten/copper composite powder
08/08/1995US5439636 Large ceramic articles and method of manufacturing
08/08/1995CA2020718C Oxide breakdown mos fuse and its application to memory cards
08/04/1995CA2141269A1 Suscepter and process for production thereof
08/03/1995WO1995020824A1 Cavity-containing structure and method for making same
08/03/1995WO1995017765A3 Liquid cooled heat sink for cooling electronic components
08/03/1995DE4424541A1 Solid-state image pick=up element mfg. method for video camera
08/03/1995DE4402918A1 Heat-sink for power semiconductor devices, e.g. converters in test equipment
08/02/1995EP0665638A1 Voltage controlled oscillator with low operating supply voltage
08/02/1995EP0665593A1 Semiconductor device
08/02/1995EP0665592A1 Semiconductor device and method of manufacturing the same
08/02/1995EP0665591A1 Method for forming a power circuit package
08/02/1995EP0665590A2 Microstructure, process for manufacturing thereof and devices incorporating the same
08/02/1995EP0665585A2 Method for joining a semiconductor chip to a chip carrier substrate and resulting chip package
08/02/1995EP0665584A1 Method for encasing an electronic component with a hardening plastic, electronic components with plastic encasement obtained by this method, and mould for carrying out the method
08/02/1995EP0665438A1 Vertically mounted accelerometer chip
08/02/1995EP0664925A1 Interconnection structure for integrated circuits and method for making same
08/02/1995EP0664924A1 Metal electronic package with reduced seal width
08/02/1995EP0664923A1 Process and device for forming the connection leads of integrated circuits
08/02/1995EP0663102A4 Power semiconductor integrated circuit package.
08/02/1995CN1106194A Naphthalene-ring resin, resin composition, and cured product thereof
08/02/1995CN1106164A Semiconductor device and a manufacturing method therefor
08/02/1995CN1106163A Electrode for semiconductor element and semiconductor device having the electrode and process for producing the same
08/01/1995US5438481 Molded-in lead frames
08/01/1995US5438478 Electronic component carriers and method of producing the same as well as electronic devices
08/01/1995US5438305 High frequency module including a flexible substrate
08/01/1995US5438297 Electrical trace having a closed loop configuration
08/01/1995US5438277 Ground bounce isolated output buffer
08/01/1995US5438224 Integrated circuit package having a face-to-face IC chip arrangement
08/01/1995US5438223 Anisotropic electrically conductive adhesive film and connection structure using the same
08/01/1995US5438222 Electronic device with plural pad connection of semiconductor chip to leads
08/01/1995US5438212 Semiconductor device with heat dissipation structure
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