Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/1995
09/05/1995US5448016 Selectively coated member having a shank with a portion masked
09/05/1995US5448014 Mass simultaneous sealing and electrical connection of electronic devices
09/05/1995US5447880 Method for forming an amorphous silicon programmable element
09/05/1995US5447876 Method of making a diamond shaped gate mesh for cellular MOS transistor array
09/05/1995US5447871 Electrically conductive interconnection through a body of semiconductor material
09/05/1995US5447797 Reaction resin mixture comprising epoxy resin, benzylthiolanium salt and sensitizer
09/05/1995US5447750 For hermetically sealed semiconductor chip
09/05/1995US5447599 Self-aligned process for capping copper lines
09/05/1995US5447576 Composition and method for encapsulating a solar cell which minimizes thermal discoloration
09/05/1995US5447448 IC socket
09/05/1995US5447444 IC socket
09/05/1995US5447189 Method of making heat sink having elliptical pins
09/05/1995US5446959 Method of packaging a power semiconductor device
09/05/1995CA2046253C Integrated circuit package and compact assemblies thereof
08/1995
08/31/1995WO1995023431A1 Antifuse with double via contact
08/31/1995DE4400032C1 Semiconductor device with insulating film having trench
08/31/1995DE19506759A1 Halbleitervorrichtung, zugehöriges Herstellungsverfahren, Verfahren zum Testen von Halbleiterelementen, Testsubstrat für das Verfahren sowie Verfahren zur Herstellung des Testsubstrats A semiconductor device manufacturing method thereof, method for testing semiconductor devices, the test substrate for the process and method of manufacturing the test substrate
08/31/1995DE19506373A1 Gas cooling system for electronic module
08/31/1995DE19504994A1 DRAM with cell matrix of transistors
08/30/1995EP0669652A1 Pressure contact type semiconductor device
08/30/1995EP0669651A1 Method and apparatus for cooling electronic components
08/30/1995EP0669650A2 Container for semiconductor device and method for manufacturing
08/30/1995EP0669648A2 Multilayer metal leadframe and method for making same
08/30/1995EP0669645A1 Semiconductor device having a planarized surface and method of manufacturing the same.
08/30/1995EP0669596A2 IC card
08/30/1995EP0669537A1 Integrated semiconductor device
08/30/1995EP0664924A4 Metal electronic package with reduced seal width.
08/30/1995CN1107641A Gold-alloy bonding wire
08/30/1995CN1107611A Semiconductor device having a reducing/oxidizing deviceive material and a process for forming the...
08/29/1995US5446625 Chip carrier having copper pattern plated with gold on one surface and devoid of gold on another surface
08/29/1995US5446623 Surface mounting type polar electronic component
08/29/1995US5446620 Ultra high density integrated circuit packages
08/29/1995US5446318 Semiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangement
08/29/1995US5446317 Single in-line package for surface mounting
08/29/1995US5446316 Hermetic package for a high power semiconductor device
08/29/1995US5446315 Resin-sealed semiconductor device containing porous fluorocarbon resin
08/29/1995US5446314 Low profile metal-ceramic-metal packaging
08/29/1995US5446313 Thin type semiconductor device and module structure using the device
08/29/1995US5446311 High-Q inductors in silicon technology without expensive metalization
08/29/1995US5446310 Integrated circuit power device with external disabling of defective devices and method of fabricating same
08/29/1995US5446309 Semiconductor device including a first chip having an active element and a second chip having a passive element
08/29/1995US5446246 MLC conductor pattern off-set design to eliminate line to via cracking
08/29/1995US5446245 Flexible circuit wiring board and method of producing the same
08/29/1995US5446243 Post processing shielding
08/29/1995US5446088 A stable acidity mixture in solvent comprising a copolymer of polysilicate and polysilsesquioxane; forming a protective coatings
08/29/1995US5446080 Piperazinylethylaminocarbonyl containing acrylonitrile-butadiene copolymer and bismaleimide compound
08/29/1995US5445995 Method for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sink
08/29/1995US5445994 Method for forming custom planar metal bonding pad connectors for semiconductor dice
08/29/1995US5445889 Piperidine-free matrices of polyepoxides, hardened by liquid (substituted)imidazole curing agents, which contain embedded strutures
08/29/1995US5445311 Electrical interconnection substrate with both wire bond and solder contacts, and fabrication method
08/29/1995US5444909 Method of making a drop-in heat sink
08/29/1995CA2125381A1 Multilayer metal leadframe and method for making same
08/24/1995WO1995022882A1 Low profile fan body with heat transfer characteristics
08/24/1995WO1995022839A1 Packaged integrated circuit with reduced electromagnetic interference
08/24/1995WO1995022838A1 Electromigration resistant metallization structures for microcircuit interconnections with rf-reactively sputtered titanium tungsten and gold
08/24/1995DE4405710A1 Applying passivation gel to device with carrier plate
08/24/1995DE19505947A1 Semiconductor device with improved barrier metal layer
08/24/1995DE19503389A1 Prodn. of semiconductor device
08/24/1995CA2160234A1 Electromigration resistant metallization structures for microcircuit interconnections with rf-reactively sputtered titanium tungsten and gold
08/23/1995EP0676082A4 Water-based polymer thick film conductive ink.
08/23/1995EP0668615A1 Plastic SMD package for a semiconductor chip
08/23/1995EP0668010A1 Device for bending leads of a lead frame.
08/23/1995CN1107256A A packaged semiconductor device having a flange at its side surface and its manufacturing method
08/23/1995CN1107255A A semiconductor device equipped with antifuse elements and a method for manufacturing an fpga
08/23/1995CN1107087A Process for metal surface treatment
08/22/1995US5444637 Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed
08/22/1995US5444602 An electronic package that has a die coupled to a lead frame by a dielectric tape and a heat sink that providees both an electrical and a thermal path between the die and teh lead frame
08/22/1995US5444600 Lead frame capacitor and capacitively-coupled isolator circuit using the same
08/22/1995US5444311 Integrated circuit and its connecting circuit
08/22/1995US5444304 Semiconductor device having a radiating part
08/22/1995US5444303 Wire bond pad arrangement having improved pad density
08/22/1995US5444302 Semiconductor device including multi-layer conductive thin film of polycrystalline material
08/22/1995US5444301 Semiconductor package and method for manufacturing the same
08/22/1995US5444300 Semiconductor apparatus with heat sink
08/22/1995US5444299 Electronic package with lead wire connections
08/22/1995US5444298 Voltage converting integrated circuit package
08/22/1995US5444297 Noise resistant semiconductor power module
08/22/1995US5444296 Ball grid array packages for high speed applications
08/22/1995US5444295 Linear dual switch module
08/22/1995US5444294 Semiconductor device of vertical surface-mounting type
08/22/1995US5444293 Structure and method for providing a lead frame with enhanced solder wetting leads
08/22/1995US5444287 Thermally activated noise immune fuse
08/22/1995US5444286 Packaged semiconductor pressure sensor including lead supports within the package
08/22/1995US5444188 Flexible circuit wiring board and method of producing the same
08/22/1995US5444186 Multilayer conductive wire for semiconductor device and manufacturing method thereof
08/22/1995US5444026 Method for manufacturing semiconductor device by forming insulator-layer to suppress bubble formation
08/22/1995US5444025 Process for encapsulating a semiconductor package having a heat sink using a jig
08/22/1995US5444022 Method of fabricating an interconnection structure for an integrated circuit
08/22/1995US5444021 Method for making a contact hole of a semiconductor device
08/22/1995US5444020 Method for forming contact holes having different depths
08/22/1995US5444019 Semiconductor contact via structure and method
08/22/1995US5444018 Metallization process for a semiconductor device
08/22/1995US5444015 Larce scale IC personalization method employing air dielectric structure for extended conductors
08/22/1995US5444012 Method for manufacturing semiconductor integrated circuit device having a fuse element
08/22/1995US5444009 Fabricating a semiconductor with an insulative coating
08/22/1995US5443996 Forming metal layer on insulator, forming silicon layer, masking and etching silicon to form connecting strip, forming second metal layer, heating to form nonsilicided metal over strip of metal silicide, removing metal, reheating silicide
08/22/1995US5443995 Method for metallizing a semiconductor wafer
08/22/1995US5443786 Oxidation and nitriding
08/22/1995US5443396 IC socket
08/22/1995CA2028358C Polyimide
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