| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 09/20/1995 | EP0672300A1 Antifuse structure with increased breakdown at edges |
| 09/20/1995 | CN1108860A Radiating structure and manufacture of same |
| 09/20/1995 | CN1108813A Surface mount chip package |
| 09/20/1995 | CN1108812A Package for mating with a semiconductor die and method of manufacture |
| 09/20/1995 | CN1108810A A method for applying adhesive to microelectronic chips |
| 09/20/1995 | CN1108806A Method of fabricating semiconductor device |
| 09/19/1995 | US5452183 Chip carrier system |
| 09/19/1995 | US5452182 Flexible high density interconnect structure and flexibly interconnected system |
| 09/19/1995 | US5452181 Detachable apparatus for cooling integrated circuits |
| 09/19/1995 | US5451819 Semiconductor device having conductive plug projecting from contact hole and connected at side surface thereof to wiring layer |
| 09/19/1995 | US5451818 Millimeter wave ceramic package |
| 09/19/1995 | US5451817 Semiconductor-mounting heat-radiative substrates, a method of making and use thereof in semiconductor packages |
| 09/19/1995 | US5451816 Integrated circuit package receptacle |
| 09/19/1995 | US5451815 Semiconductor device with surface mount package adapted for vertical mounting |
| 09/19/1995 | US5451814 Multi-chip module integrated circuit |
| 09/19/1995 | US5451813 Semiconductor device with lead frame having different thicknesses |
| 09/19/1995 | US5451812 Leadframe for semiconductor devices |
| 09/19/1995 | US5451811 Electrically programmable interconnect element for integrated circuits |
| 09/19/1995 | US5451810 Metal-to-metal antifuse structure |
| 09/19/1995 | US5451716 Resin-packaged electronic component having bent lead terminals |
| 09/19/1995 | US5451715 Molded package integrated circuit with electrochemical cell |
| 09/19/1995 | US5451548 Multilayer semiconductors with dielectrics and insulators by evaporation of single crystal thin films |
| 09/19/1995 | US5451545 Process for forming stable local interconnect/active area silicide structure VLSI applications |
| 09/19/1995 | US5451544 Method of manufacturing a back contact for semiconductor die |
| 09/19/1995 | US5451543 Multilayer semiconductor with conductor layers and dielectric layers formed by etchhing and coating, filling and removal |
| 09/19/1995 | US5451529 Method of making a real time ion implantation metal silicide monitor |
| 09/19/1995 | US5451263 Marking integrated circuits with metal parts and adhesion of inks |
| 09/19/1995 | US5451165 Temporary package for bare die test and burn-in |
| 09/19/1995 | CA2035724C Power semiconductor device with heat dissipating property |
| 09/14/1995 | WO1995024747A1 Semiconductor chip affording a high-density external interface |
| 09/14/1995 | WO1995024734A1 Technique for producing interconnecting conductive links |
| 09/14/1995 | WO1995024733A1 Prefabricated semiconductor chip carrier |
| 09/14/1995 | WO1995024732A1 A molded lead frame and method of making same |
| 09/14/1995 | WO1995024730A2 Apparatus having inner layers supporting surface-mount components |
| 09/14/1995 | WO1995024639A1 Method of evaluating siloxane used for forming insulation coating, coating fluid used for forming insulation coating, process for producing the fluid, process for forming insulation coating for semiconductor device, and process for producing semiconductor device by applying the above process |
| 09/14/1995 | DE4422322C1 Laser module coupling semiconductor laser to optical fibre |
| 09/14/1995 | DE4408176A1 Component encapsulation esp. integrated circuits |
| 09/14/1995 | DE4408020A1 Long-shaped silicon chip prodn. using test pattern for parallel cutting |
| 09/14/1995 | DE19507124A1 Electronic component, esp. surface acoustic wave filter |
| 09/13/1995 | EP0671768A2 Improvements in or relating to electrodes for LSI |
| 09/13/1995 | EP0671767A2 Semiconductor antifuse structure and method |
| 09/13/1995 | EP0671766A1 Semiconductor package and method |
| 09/13/1995 | EP0671765A1 Passivation method and structure for a ferroelectric integrated circuit using hard ceramic materials or the like |
| 09/13/1995 | EP0671764A2 A process for fabricating a superconducting circuit |
| 09/13/1995 | EP0671705A2 Manufacturing process for a contactless card and contactless card |
| 09/13/1995 | EP0671055A1 Process for making multilevel interconnections of electronic components |
| 09/13/1995 | EP0662278A4 Hermetically sealed circuit modules having conductive cap anchors. |
| 09/13/1995 | EP0662244A4 Plastic semiconductor package with aluminum heat spreader. |
| 09/13/1995 | CN1108431A Metallic film for sealing semiconductor |
| 09/13/1995 | CN1108161A General-purpose lead working machine |
| 09/12/1995 | US5450290 Printed circuit board with aligned connections and method of making same |
| 09/12/1995 | US5450289 Semiconductor package and a printed circuit board applicable to its mounting |
| 09/12/1995 | US5450288 Printed substrate for mounting high-power semiconductor chip thereon and driver component making use of the printed substrate |
| 09/12/1995 | US5450287 Semiconductor device having a semiconductor chip mounted on an insulating body |
| 09/12/1995 | US5450284 Heat sink and transistor retaining assembly |
| 09/12/1995 | US5450283 Thermally enhanced semiconductor device having exposed backside and method for making the same |
| 09/12/1995 | US5450263 Electronic device |
| 09/12/1995 | US5450046 Composite microwave circuit module assembly and its connection structure |
| 09/12/1995 | US5449955 Copper barrier layer between nickel and gold |
| 09/12/1995 | US5449954 Interconnection structure with TiON layers |
| 09/12/1995 | US5449951 Lead frames with improved adhesion to a polymer |
| 09/12/1995 | US5449948 Semiconductor integrated circuit devices including means for reducing noise generated by high frequency internal circuitry |
| 09/12/1995 | US5449947 Electrically programmable antifuse |
| 09/12/1995 | US5449938 MOS-controlled power semiconductor component |
| 09/12/1995 | US5449934 Semiconductor memory device and process |
| 09/12/1995 | US5449930 High power, compound semiconductor device and fabrication process |
| 09/12/1995 | US5449648 Method for preparing an aluminum nitride sintered body |
| 09/12/1995 | US5449642 Method of forming metal-disilicide layers and contacts |
| 09/12/1995 | US5449641 Method for fabricating an interconnect for semiconductor devices using (111) crystal plane orientation |
| 09/12/1995 | US5449427 Processing low dielectric constant materials for high speed electronics |
| 09/12/1995 | US5449108 Method for forming a bump on a semiconductor device |
| 09/12/1995 | US5448826 Method of making ceramic microwave electronic package |
| 09/12/1995 | US5448825 Method of making electrically and thermally enhanced integrated-circuit package |
| 09/12/1995 | CA2038832C Material for passive electronic components |
| 09/08/1995 | WO1995023951A1 Heat-radiating element |
| 09/08/1995 | WO1995023794A2 Glycidyl esters for use in electronics adhesives and process for their preparation |
| 09/07/1995 | DE4407397A1 Cooling liq. distributor for system with power semiconductors and cooling boxes |
| 09/06/1995 | EP0670667A1 Direct copper bonded substrates |
| 09/06/1995 | EP0670599A1 An integrated circuit package with improved high frequency performance |
| 09/06/1995 | EP0670597A2 Structure of contact between wiring layers in semiconductor integrated circuit device and method for forming the contact |
| 09/06/1995 | EP0670596A2 Tape carrier for integrated circuit |
| 09/06/1995 | EP0670595A1 Resin-sealed semiconductor device |
| 09/06/1995 | EP0670594A1 Semiconductor package and fabrication method thereof |
| 09/06/1995 | EP0670103A1 Local hardening method of a semiconductor integrated circuit |
| 09/05/1995 | US5448520 Semiconductor memory |
| 09/05/1995 | US5448512 Semiconductor memory device with contact region intermediate memory cell and peripheral circuit |
| 09/05/1995 | US5448451 Lead carrier |
| 09/05/1995 | US5448450 Lead-on-chip integrated circuit apparatus |
| 09/05/1995 | US5448449 Retainer for securing a heat sink to a socket |
| 09/05/1995 | US5448132 Array field emission display device utilizing field emitters with downwardly descending lip projected gate electrodes |
| 09/05/1995 | US5448114 Semiconductor flipchip packaging having a perimeter wall |
| 09/05/1995 | US5448113 Micro metal-wiring structure having stress induced migration resistance |
| 09/05/1995 | US5448112 Plastic sealed multiple level metalization semiconductor device |
| 09/05/1995 | US5448108 Cooling of semiconductor power modules by flushing with dielectric liquid |
| 09/05/1995 | US5448107 Radiating fin having an improved life and thermal conductivity |
| 09/05/1995 | US5448106 Thin semiconductor integrated circuit device assembly |
| 09/05/1995 | US5448105 Semiconductor device having a leadframe and metal substrate |
| 09/05/1995 | US5448096 Semiconductor device with reduced stress applied to gate electrode |
| 09/05/1995 | US5448095 Semiconductors with protective layers |
| 09/05/1995 | US5448020 Interconnection system |