Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1995
10/10/1995US5457069 Applying a layer of alloy of titanium with one of cobalt, platinum, palladium and nickel, applying tungsten layer on above layer forming tungsten/cobalt-titanium/silicon structure transforming titanium tungsten/silicide/silicon layer
10/10/1995US5457068 Monolithic integration of microwave silicon devices and low loss transmission lines
10/10/1995US5457059 Method for forming TiW fuses in high performance BiCMOS process
10/10/1995US5456613 For a PGA component
10/10/1995US5456081 Thermoelectric cooling assembly with optimized fin structure for improved thermal performance and manufacturability
10/10/1995CA2056185C Multistage amplifier
10/05/1995WO1995026569A1 Fabricating a semiconductor with an insulative coating
10/05/1995WO1995026568A1 Semiconductor component designed for vertical integration, and method of manufacturing the component
10/05/1995DE19512245A1 Illuminating device resolution measuring photomask for semiconductor process
10/05/1995DE19511533A1 Fine measuring appts. for properties in semiconductor mfr
10/05/1995DE19511392A1 Method and appts. for production of solder bumps
10/05/1995DE19511229A1 Chip carrier system for planar electronic module
10/05/1995DE19510988A1 Schaltungsträger Circuit board
10/05/1995DE19507573A1 Conductor structure for semiconductor housing
10/05/1995DE19503178A1 Producing solderable metallising layer on non-solderable surface
10/04/1995EP0675674A1 Film circuit metal system for use with bumped IC packages
10/04/1995EP0675539A2 Ball grid package with integrated passive circuit elements
10/04/1995EP0675538A2 Integrated circuit package with flat topped heat sink
10/04/1995EP0675537A2 Protective electronic coatings using filled polysilazanes
10/04/1995EP0675533A1 Single point bonding method
10/04/1995EP0675531A2 Process for electrically interconnecting contacts
10/04/1995EP0674814A1 Method of forming interface between die and chip carrier
10/04/1995EP0674808A1 Electrical interconnect structures.
10/04/1995EP0662245A4 A thin multichip module.
10/03/1995US5455745 Coated bonding wires in high lead count packages
10/03/1995US5455740 Bus communication system for stacked high density integrated circuit packages
10/03/1995US5455738 High thermal conductivity, matched CTE. low density mounting plate for a semiconductor circuit
10/03/1995US5455462 Plastic molded package with heat sink for integrated circuit devices
10/03/1995US5455461 Semiconductor device having reformed pad
10/03/1995US5455460 Semiconductor device having complimentary bonding pads
10/03/1995US5455459 Reconstructable interconnect structure for electronic circuits
10/03/1995US5455458 Phase change cooling of semiconductor power modules
10/03/1995US5455457 Package for semiconductor elements having thermal dissipation means
10/03/1995US5455456 Integrated circuit package lid
10/03/1995US5455454 Semiconductor lead frame having a down set support member formed by inwardly extending leads within a central aperture
10/03/1995US5455453 Copper or copper alloy as matrix, insulating film, multilayer film; noncracking, nonpeeling
10/03/1995US5455452 Semiconductor package having an LOC structure
10/03/1995US5455448 For mounting on a heat sink
10/03/1995US5455446 Leaded semiconductor package having temperature controlled lead length
10/03/1995US5455445 Multi-level semiconductor structures having environmentally isolated elements
10/03/1995US5455439 Semiconductor device which moderates electric field concentration caused by a conductive film formed on a surface thereof
10/03/1995US5455390 Microelectronics unit mounting with multiple lead bonding
10/03/1995US5455387 Semiconductor package with chip redistribution interposer
10/03/1995US5455386 Chamfered electronic package component
10/03/1995US5455385 Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses
10/03/1995US5455384 High frequency module and method of producing the same
10/03/1995US5455382 IC package heat sink fin
10/03/1995US5455200 Method for making a lead-on-chip semiconductor device having peripheral bond pads
10/03/1995US5455199 Method of manufacturing frame for LEDs
10/03/1995US5455187 Method of making a semiconductor device with a metallic layer coupled to a lower region of a substrate and metallic layer coupled to a lower region of a semiconductor device
10/03/1995US5455126 Electrochemical stability, high energy density
10/03/1995US5455064 Process for fabricating a substrate with thin film capacitor and insulating plug
10/03/1995US5454929 Process for preparing solderable integrated circuit lead frames by plating with tin and palladium
10/03/1995US5454905 Method for manufacturing fine pitch lead frame
10/03/1995US5454161 Through hole interconnect substrate fabrication process
10/03/1995CA1337149C Devices and systems based on novel superconducting material
09/1995
09/28/1995WO1995026125A1 Two-phase thermal bag component
09/28/1995WO1995026124A1 Integrated circuit lamination process
09/28/1995WO1995026049A1 Three-terminal fuse and method of making same
09/28/1995WO1995026048A1 Two-phase component cooler with radioactive initiator
09/28/1995WO1995026047A1 Semiconductor package manufacturing method and semiconductor package
09/28/1995WO1995026046A1 Method for the sealed and electrically insulating attachment of an electrical conductor extending through a metal wall
09/28/1995DE4410212A1 Electronic module with semiconductor integrated circuit
09/28/1995DE4409593A1 Semiconductor cell clamp for electrical railway car power converter
09/28/1995DE19509441A1 Hybrid integrated circuit
09/27/1995EP0674474A1 IC package connector
09/27/1995EP0674472A2 Electronic package assembly and connector for use therewith
09/27/1995EP0674346A2 Connecting terminals for semiconductor package
09/27/1995EP0674344A2 Gallium oxide thin films
09/27/1995EP0673900A2 Carbon/carbon composites and electrical apparatus containing the same
09/27/1995EP0673547A1 Electronic package sealed with a dispensable adhesive
09/27/1995CN1109258A Packaging structure for microwave circuit
09/27/1995CN1109219A Microelectronic device package containing a liquid and method
09/27/1995CN1109218A Electronic units with semiconductor slugs
09/27/1995CN1109217A Semiconductor device and method for manufacturing the same
09/27/1995CN1109216A Semiconductor device and method for manufacturing the same
09/26/1995US5453913 Tab tape
09/26/1995US5453830 Spatially isolated diffractor on a calibration substrate for a pellicle inspection system
09/26/1995US5453641 Thermal regulation device for cooling heated region
09/26/1995US5453583 Interior bond pad arrangements for alleviating thermal stresses
09/26/1995US5453404 Method for making an interconnection structure for integrated circuits
09/26/1995US5453400 Method and structure for interconnecting different polysilicon zones on semiconductor substrates for integrated circuits
09/26/1995US5453293 Methods of manufacturing coated particles having desired values of intrinsic properties and methods of applying the coated particles to objects
09/26/1995US5453017 Solderable connector for high density electronic assemblies
09/26/1995US5452841 Wire bonding apparatus and method
09/26/1995US5452511 Composite lead frame manufacturing method
09/26/1995CA2077486C Electrical connector circuit wafer
09/21/1995WO1995025348A1 Logical three-dimensional interconnections between integrated circuit chips using a two-dimensional multi-chip module package
09/21/1995WO1995025347A1 Cooling and screening device for an integrated circuit
09/21/1995WO1995025346A1 Electric connections arranged in a high-density grid
09/21/1995DE4407810A1 Switching arrangement allowing larger packing density
09/21/1995DE19509202A1 Electrically conducting connection
09/20/1995EP0673190A1 IC socket
09/20/1995EP0673087A2 Electrical and mechanical connection device
09/20/1995EP0673068A1 Overvoltage protection device in integrated circuits
09/20/1995EP0673067A2 High-frequency circuit with integrated logic circuit
09/20/1995EP0673066A1 Heat sink
09/20/1995EP0673065A1 Cooling device for electronic components
09/20/1995EP0673064A1 Cooling device for electronic components
09/20/1995EP0673023A1 Ceramic substrate and its manufacture, and substrate vacuum-clamping device using ceramic vacuum-clamping board
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