Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1995
10/24/1995US5461257 Integrated circuit package with flat-topped heat sink
10/24/1995US5461256 Portable semiconductor device with resin
10/24/1995US5461255 Multi-layered lead frame assembly for integrated circuits
10/24/1995US5461251 Symmetric SRAM cell with buried N+ local interconnection line
10/24/1995US5461201 Insulating part with integral cooling element
10/24/1995US5461197 Electronic device having a chip with an external bump terminal equal or smaller than a via hole on a board
10/24/1995US5461196 Low temperature co-fired ceramic (LTCC) high density interconnect package with circuitry within the cavity walls
10/24/1995US5461005 Method of forming silicide in integrated circuit manufacture
10/24/1995US5461004 Method for fabricating connection device with reduced area of highly integrated semiconductor device
10/24/1995US5461003 Multilevel interconnect structure with air gaps formed between metal leads
10/24/1995US5460983 Method for forming isolated intra-polycrystalline silicon structures
10/24/1995US5460877 Polymeric metal oxide materials and their formation and use
10/24/1995US5460677 Filament winding production method for a micropin array
10/24/1995US5460319 Lead, method of assembling an integrated circuit device, integrated circuit device, lead for providing a conductive path and method of providing a conductive path
10/24/1995US5459923 Method of marking hermetic packages for electrical device
10/24/1995CA1337376C Metallized substrate for electronic device
10/19/1995WO1995028073A1 An arrangement for shielding and/or cooling electronic components mounted on a circuit board
10/19/1995WO1995028005A2 Staggered pad array
10/19/1995WO1995023794A3 Glycidyl esters for use in electronics adhesives and process for their preparation
10/19/1995DE4413529A1 Elektronisches Bauelement und Verfahren zu seiner Herstellung An electronic device and method for its preparation
10/19/1995DE4413257A1 Integrierte Schaltungsanordnung mit einem EEPROM, Halbleiterscheibe mit solchen integrierten Schaltungen sowie Verfahren zur Verwendung einer solchen Halbleiterscheibe Integrated circuit arrangement having an EEPROM, the semiconductor wafer having such integrated circuits as well as methods of using such a semiconductor wafer
10/19/1995DE4410354A1 Planar structure power semiconductor element for electric drive circuit
10/19/1995DE4324210A1 Printed circuit board heat sink fixing
10/19/1995DE19515591A1 Microelectronic circuit conductor path connection system
10/19/1995CA2185987A1 An arrangement for shielding and/or cooling electronic components mounted on a circuit board
10/18/1995EP0677877A2 Insulating gate type semiconductor device and power inverter using such a device
10/18/1995EP0677873A1 A lead frame and a process for fabricating a packaged device containing the lead frame
10/18/1995EP0677872A1 Method of forming Si-O containing coatings
10/18/1995EP0677871A2 Electronic coatings using filled borosilazanes
10/18/1995EP0677869A1 Planarization process for the manufacturing of integrated circuits, particularly for non-volatile semiconductor memory devices
10/18/1995EP0677710A2 Cooling device
10/18/1995CN2210479Y Convenient and force-saving coupling device
10/18/1995CN1110431A Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
10/17/1995US5459655 Neutral-point clamped inverter device using semiconductor modules
10/17/1995US5459641 Polar electronic component and mounting structure therefor
10/17/1995US5459640 Circuit board assembly
10/17/1995US5459639 Printed circuit board assembly having high heat radiation property
10/17/1995US5459638 Semiconductor device with heat radiating fin assembly and container for housing the same
10/17/1995US5459634 Area array interconnect device and method of manufacture thereof
10/17/1995US5459420 Integrated circuit and its connecting circuit
10/17/1995US5459356 Power semiconductor module having a plurality of semiconductor arrangements
10/17/1995US5459355 Multiple layer programmable layout for version identification
10/17/1995US5459354 Semiconductor device with improved insulation of wiring structure from a gate electrode
10/17/1995US5459353 Semiconductor device including interlayer dielectric film layers and conductive film layers
10/17/1995US5459352 Coating of a solid polysiloxane
10/17/1995US5459350 Resin sealed type semiconductor device
10/17/1995US5459348 Heat sink and electromagnetic interference shield assembly
10/17/1995US5459223 First stage polymerization, second stage curing, acid catalyst curing agent for an epoxy resin molding material for sealing electronic parts
10/17/1995US5459107 Method of obtaining high quality silicon dioxide passivation on silicon carbide and resulting passivated structures
10/17/1995US5459105 Method of manufacturing a semiconductor device having multilayer insulating films
10/17/1995US5459103 Plating with copper, forming CuO layer on copper; plating with nickel, nickel/palladium and palladium; spot-plating
10/17/1995US5459101 Method for fabricating a semiconductor device comprising a polycide structure
10/17/1995US5459100 Method for forming metal wiring of semiconductor device
10/17/1995US5459093 Method for forming dummy pattern in a semiconductor device
10/17/1995US5459081 Process for transferring a device to a substrate by viewing a registration pattern
10/17/1995US5458912 Tamper-proof electronic coatings
10/17/1995US5458731 Method for fast and non-destructive examination of etched features
10/17/1995US5458716 Methods for manufacturing a thermally enhanced molded cavity package having a parallel lid
10/17/1995US5458709 Forming green sheets containing ceramic and glass powders; lamination; firing; porous glass powders control shrinkage and prevent cracks and delamination
10/17/1995US5458697 Highly purified metal material and sputtering target using the same
10/17/1995US5458499 IC socket
10/17/1995US5458189 Two-phase component cooler
10/17/1995US5457956 Microminiature stirling cycle cryocoolers and engines
10/17/1995US5457879 Method of shaping inter-substrate plug and receptacles interconnects
10/17/1995US5457878 Method for mounting integrated circuit chips on a mini-board
10/17/1995CA1337358C Heat-conductive aluminum nitride sintered body and method of manufacturing the same
10/12/1995WO1995027313A1 Method of manufacturing an antifuse with silicon spacers and resulting antifuse
10/12/1995WO1995027312A1 A multilayer antifuse with low leakage and method of manufacture therefor
10/12/1995WO1995027309A1 A multilayered antifuse with intermediate metal layer and method of manufacture therefor
10/12/1995WO1995027308A1 Cavity filled metal electronic package
10/12/1995WO1995027307A1 Process and device for producing solder humps
10/12/1995WO1995027127A1 Engine components including ceramic-metal composites
10/12/1995WO1995026852A1 Process and device for coating a non-solderable surface with a solderable metallised layer
10/12/1995DE4412467A1 Decoupling semiconductor integrated circuit for communications system
10/12/1995CA2144143A1 Flexible thermal transfer apparatus for cooling electronic components
10/11/1995EP0676807A1 Lead frame for semiconductor device
10/11/1995EP0676806A2 Ball grid array intergrated circuit package with high thermal conductivity
10/11/1995EP0676805A1 Surface mountable integrated circuit package with low-profile detachable module
10/11/1995EP0676804A1 Flexible thermal transfer apparatus for cooling electronic components
10/11/1995EP0676800A2 Process for producing metal-bonded-ceramic materials or components
10/11/1995EP0676469A2 Transcription Factor APRF
10/11/1995EP0676091A1 Tab testing of area array interconnected chips
10/11/1995EP0676082A1 Water-based polymer thick film conductive ink
10/11/1995EP0664925A4 Interconnection structure for integrated circuits and method for making same.
10/11/1995EP0485582B1 Method of producing microbump circuits for flip chip mounting
10/11/1995EP0372017B1 Epoxy resin compositions for sealing semiconductor devices
10/10/1995US5457649 Semiconductor memory device and write-once, read-only semiconductor memory array using amorphous-silicon and method therefor
10/10/1995US5457605 Electronic device having coplanar heatsink and electrical contacts
10/10/1995US5457604 Semiconductor module device having a desired electrical circuit constituted by combination of seminconductor devices formed on circuit boards
10/10/1995US5457348 High-current integrated circuit with wiring for minimized on-resistance
10/10/1995US5457345 Used to connect a lead-tin alloy solder to a semiconductor substrate
10/10/1995US5457342 Integrated circuit cooling apparatus
10/10/1995US5457341 Integrated circuit device and manufacturing method using photoresist lead covering
10/10/1995US5457340 Leadframe with power and ground planes
10/10/1995US5457334 Semiconductor memory device
10/10/1995US5457149 Reworkable adhesive for electronic applications
10/10/1995US5457076 Dielectric resonators
10/10/1995US5457072 Process for dicing a semiconductor wafer having a plated heat sink using a temporary substrate
10/10/1995US5457071 Stackable vertical thin package/plastic molded lead-on-chip memory cube
10/10/1995US5457070 Method of forming a step compensated semiconductor device
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