Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1995
11/09/1995DE3153768C2 Plastics identity card with an internal integrated circuit
11/09/1995CA2186110A1 Method and apparatus for recovering power from semiconductor circuit using thermoelectric device
11/09/1995CA2178646A1 Tape application platform and processes therefor
11/08/1995EP0681334A1 Packaging medical image sensors
11/08/1995EP0681330A2 Electronic module for removing heat from a semiconductor die and method of making
11/08/1995EP0681329A2 A customizable logic array device
11/08/1995EP0681328A2 Hillock-free multilayer metal lines for high performance thin film structures
11/08/1995EP0681327A2 Dual dielectric capping layers for hillock suppression in metal layers in thin film structures
11/08/1995EP0681325A2 Thin-film structure with insulating and smoothing layers between crossing conductive lines
11/08/1995EP0681323A2 Test element group of a semiconductor wafer and semiconductor device
11/08/1995EP0681322A2 Bonded ceramic metal composite substrates and circuit boards constructed therewith
11/08/1995EP0680685A1 Mounting assembly for power semiconductors
11/08/1995EP0594652B1 Machine tool with curved drive, especially for stamping and shaping the connecting pins of integrated circuits
11/08/1995CN1111402A Device for semiconductor
11/07/1995US5465217 Method for automatic tab artwork building
11/07/1995US5465192 Cooling apparatus for integrated circuit chips for preventing forcible contact between a cooling member and the chips
11/07/1995US5465008 For high-frequency electronic devices
11/07/1995US5465007 Semiconductor device
11/07/1995US5465004 Programmable semiconductor integrated circuits having fusible links
11/07/1995US5464794 Method of forming contact openings having concavo-concave shape
11/07/1995US5464793 Method of making contact for semiconductor device
11/07/1995US5464790 Method of fabricating an antifuse element having an etch-stop dielectric layer
11/07/1995US5464682 Minimal capture pads applied to ceramic vias in ceramic substrates
11/07/1995US5464652 Green ceramic via metallization technique
11/07/1995US5464054 Spring clamp and heat sink assembly
11/07/1995US5463872 High performance thermal interface for low temperature electronic modules
11/07/1995EP0729659A4 Improved semiconductor architecture and application therefor
11/02/1995WO1995029506A1 Semiconductor integrated circuit device, and method and apparatus for manufacturing it
11/02/1995EP0680249A2 Fabricated sheet metal heat sink
11/02/1995EP0680147A2 Semiconductor power module and power conversion device
11/02/1995EP0680088A1 Thin-film structure with conductive molybdenum-chromium line
11/02/1995EP0680087A2 Semiconductor devices utilising silicide reaction for manufacturing adaptable interconnections
11/02/1995EP0680086A2 Semiconductor device and method of producing said semiconductor device
11/02/1995EP0680085A1 Via formation in polymeric materials
11/02/1995EP0680084A1 Self-aligned via using low permittivity dielectric
11/02/1995EP0680082A1 Structure and method for mounting semiconductor device and liquid crystal display device
11/02/1995EP0680081A2 Method of forming thin film and electronic device using thin film
11/02/1995EP0680077A1 Integrated circuit with improved contact barrier
11/01/1995CN2211653Y Insulative water cooling radiator
11/01/1995CN1111036A Method of manufacturing semiconductor device
10/1995
10/31/1995US5463667 Inspection method for soldered joints using x-ray imaging and apparatus therefor
10/31/1995US5463530 Heat-dissipating structure
10/31/1995US5463529 Electronic assembly
10/31/1995US5463528 Cooling structure for integrated circuits
10/31/1995US5463520 Electrostatic discharge protection with hysteresis trigger circuit
10/31/1995US5463255 Semiconductor integrated circuit device having an electrode pad including an extended wire bonding portion
10/31/1995US5463254 Formation of 3-dimensional silicon silicide structures
10/31/1995US5463253 Semiconductor device having a plurality of chips
10/31/1995US5463251 Power semiconductor package having improved durability
10/31/1995US5463250 Semiconductor component package
10/31/1995US5463249 Electronic circuit system unit with wiring substrate
10/31/1995US5463248 Inexpensive using a lead frame and adopted to prevent the resistance of lead frame from unduly increasing and curb the dependency of inductance on frequency
10/31/1995US5463247 Lead frame material formed of copper alloy for resin sealed type semiconductor devices
10/31/1995US5463246 Large scale high density semiconductor apparatus
10/31/1995US5463245 Semiconductor integrated circuit device having sealing means
10/31/1995US5463244 Antifuse programmable element using ferroelectric material
10/31/1995US5463234 High-speed semiconductor gain memory cell with minimal area occupancy
10/31/1995US5462898 Methods for passivating silicon devices at low temperature to achieve low interface state density and low recombination velocity while preserving carrier lifetime
10/31/1995US5462893 Method of making a semiconductor device with sidewall etch stopper and wide through-hole having multilayered wiring structure
10/31/1995US5462890 Method for making a tungsten plug of a semiconductor device
10/31/1995US5462888 Process for manufacturing semiconductor BICMOS device
10/31/1995US5462886 Method of manufacturing a semiconductor element
10/31/1995US5462638 Selective etching of TiW for C4 fabrication
10/31/1995US5462624 Embedded inter-connect frame
10/31/1995US5462446 Socket apparatus
10/31/1995US5462219 Device for assembling semiconductor chips between two heat sinks
10/31/1995US5461774 Apparatus and method of elastically bowing a base plate
10/31/1995US5461766 Method for integrally packaging an integrated circuit with a heat transfer apparatus
10/30/1995CA2147018A1 Fabricated sheet metal heat sink
10/26/1995WO1995028740A1 Electronic package having improved wire bonding capability
10/26/1995WO1995028739A1 Electronic component and process for producing same
10/26/1995WO1995028735A2 Method of manufacturing a device whereby a support bar is provided with conductor tracks for electrically contacting a semiconductor element
10/26/1995WO1995028713A1 Electronic memory device
10/26/1995EP0687383A4 Heat sink assembly for solid state devices
10/26/1995DE4414266A1 Hermetically sealed package body for semiconductor diode, thyristor
10/26/1995DE3153769C2 Plastics identity card with an internal integrated circuit
10/26/1995DE19500743A1 Package carrier for semiconductor components
10/26/1995CA2165169A1 Electronic memory device
10/25/1995EP0678948A1 Electrically configurable matrix for connection between lines with at least one input/output front for electrical signals
10/25/1995EP0678918A2 Multilayer printed wiring board
10/25/1995EP0678917A1 Supporting member for cooling means and electronic package using the same
10/25/1995EP0678916A1 Semiconductor power device having double insulation
10/25/1995EP0678915A2 Integrated semiconductor device with an EEPROM, semiconductor substrate with such integrated circuits and method for use of such a semiconductor substrate
10/25/1995EP0678914A2 Method for planarizing an integrated circuit topography
10/25/1995EP0678913A1 Multilevel metallization forming method
10/25/1995EP0678909A1 Monitoring of rf-plasma induced potential on a gate dielectric inside a plasma etcher
10/25/1995EP0678232A1 Plated compliant lead.
10/25/1995EP0583407A4 Integrated circuit packages using tapered spring contact leads for direct mounting to circuit boards
10/25/1995CN2211115Y Fork Lead-wire for F-type hybrid integrated circuit
10/25/1995CN2211114Y Fork Lead-wire for Y-type hybrid integrated circuit
10/25/1995CN1110819A A display board having wiring with three-layered structure and a display device including the display board
10/25/1995CN1110694A A polymer composition for making single or multilayer patterns
10/25/1995CN1030159C Indication module of luminescence diode
10/24/1995US5461578 A power bus having power slits embodied therein
10/24/1995US5461545 Process and device for hermetic encapsulation of electronic components
10/24/1995US5461539 Heat sensitive electronic component
10/24/1995US5461261 Semiconductor device with bumps
10/24/1995US5461260 Semiconductor device interconnect layout structure for reducing premature electromigration failure due to high localized current density
10/24/1995US5461259 High-current integrated circuit
10/24/1995US5461258 Semiconductor device socket
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