Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1995
11/23/1995WO1995031829A1 Semiconductor fabrication with contact processing for wrap-around flange interface
11/23/1995WO1995031826A1 Electronic packages with improved electrical performance
11/23/1995DE4431754C1 Carrier element for ic module of chip card
11/22/1995EP0683624A2 Narrow channel finned heat sinking for cooling high power electronic components
11/22/1995EP0683520A2 Method for making a contact device for planar high frequency leads and contact device for planar high frequency leads
11/22/1995EP0683519A2 A hybrid IC
11/22/1995EP0683518A2 Lead frame and semiconductor device
11/22/1995EP0683517A2 Semiconductor device having semiconductor chip bonded to circuit board through bumps and process of mounting thereof
11/22/1995EP0683516A2 Multilayer circuit board and multichip module substrate
11/22/1995EP0683514A1 Overpass mask/insulator for local interconnects and fabrication methods for the same
11/22/1995EP0683513A1 Electronic package with multilevel connections
11/22/1995EP0683450A2 Card type semiconductor device and method of manufacturing it
11/22/1995EP0683190A2 Improved novolac type epoxy resin and electronic parts encapsulating resin composition
11/22/1995EP0682812A1 Thermally conductive integrated circuit package with radio frequency shielding
11/22/1995EP0682809A1 Method for the encapsulation of components or elecetronic units and devices encapsulated using said method
11/22/1995EP0682808A1 Semiconductor component
11/22/1995EP0682636A1 Detaching linerless labels
11/22/1995CN1112291A Semiconductor integrated circuit device including a memory device having memory cells with increased information storage capacitance and method of man
11/22/1995CN1112290A Tape attaching apparatus for semiconductor lead frame
11/22/1995CN1112280A Polar electrnic component and mounting structure therefor
11/21/1995US5469329 Printed circuit board with bi-metallic heat spreader
11/21/1995US5469322 Carbon brush for discharging static electricity
11/21/1995US5469131 Hybrid integrated circuit device
11/21/1995US5468999 Liquid encapsulated ball grid array semiconductor device with fine pitch wire bonding
11/21/1995US5468998 Resin molded type semiconductor device having a conductor film
11/21/1995US5468997 Integrated circuit package having a multilayered wiring portion formed on an insulating substrate
11/21/1995US5468996 Electronic package assembly and connector for use therewith
11/21/1995US5468995 Semiconductor device having compliant columnar electrical connections
11/21/1995US5468994 High pin count package for semiconductor device
11/21/1995US5468993 Semiconductor device with polygonal shaped die pad
11/21/1995US5468992 Electronic circuit package including plural bare chips mounted on a single wiring substrate
11/21/1995US5468991 Semiconductor chip package
11/21/1995US5468990 Structures for preventing reverse engineering of integrated circuits
11/21/1995US5468985 Semiconductor device
11/21/1995US5468910 Semiconductor device package and method of making
11/21/1995US5468909 Insulating part with improved heat transfer element
11/21/1995US5468685 Method for producing a semiconductor integrated circuit
11/21/1995US5468680 Method of making a three-terminal fuse
11/21/1995US5468669 Integrated circuit fabrication
11/21/1995US5468664 Method of making semiconductor device with alignment marks
11/21/1995US5468541 Thin film delamination test chip
11/21/1995US5468457 Reaction of copper oxide and tungsten oxide with milling and dehydration for composite
11/21/1995US5468445 Firing metals to form oxides from conductive metals
11/21/1995US5468340 Highly selective high aspect ratio oxide etch method and products made by the process
11/21/1995US5468339 Plasma etch process
11/21/1995US5467803 Outer lead bending apparatus for a semiconductor package device having a package and outer leads extending from the package
11/21/1995US5467758 Electronic distributing type ignition device
11/16/1995WO1995031008A1 Lead frame including an inductor or other such magnetic component
11/16/1995WO1995031007A1 Interconnect structures for integrated circuits
11/16/1995WO1995031006A1 Surface mount and flip chip technology
11/16/1995WO1995031005A1 Integrated circuit package having a liquid metal - aluminum/copper joint
11/16/1995WO1995031004A1 Apparatus for encapsulating with plastic a lead frame with chips
11/16/1995WO1995028005A3 Staggered pad array
11/16/1995DE4416616A1 Gehäuse Housing
11/16/1995DE4034674C2 Halbleiterbauelement Semiconductor device
11/15/1995EP0682374A1 Method for encapsulating an integrated circuit
11/15/1995EP0682369A1 Semiconductor package
11/15/1995EP0682368A2 Metallization for polymer-dielectric multichip modules
11/15/1995EP0682367A1 Packaged semiconductor device and a manufacturing process therefor
11/15/1995EP0682366A2 Mounting of integrated circuit devices
11/15/1995EP0682365A1 Three-dimensional interconnection of electronic component housings using printed circuits
11/15/1995EP0682363A2 Via-structure of a multilayer interconnection ceramic substrate
11/15/1995EP0682260A2 Contacting system for electrical circuits
11/15/1995EP0682223A1 Heat sink with a heat plate
11/15/1995EP0681741A1 Electronic chip carrier package and method of making thereof
11/15/1995CN2212836Y Ribbed radiator
11/15/1995CN2212835Y Combined rectifier tube
11/15/1995CN1111833A Pinned module
11/15/1995CN1111823A Semiconductor element sealed with resin and production of same
11/15/1995CN1111549A Transport-by-suction type mold
11/14/1995US5467253 Semiconductor chip package and method of forming
11/14/1995US5467252 Method for plating using nested plating buses and semiconductor device having the same
11/14/1995US5467251 Printed circuit boards and heat sink structures
11/14/1995US5466972 Multilayer integrated circuits, titanium-palladium alloy, improved adhesion
11/14/1995US5466971 Semiconductor device having a multilayer interconnection layer
11/14/1995US5466970 For attaching an electronic device package to a heat sink
11/14/1995US5466969 Intelligent power device module
11/14/1995US5466968 Leadframe for making semiconductor devices
11/14/1995US5466967 Lead frame for a multiplicity of terminals
11/14/1995US5466966 Lead frame with leads projecting alternately from opposite sides of a lead frame block
11/14/1995US5466960 BiCMOS device having self-aligned well tap and method of fabrication
11/14/1995US5466952 Semiconductor device having an IGET and a control or protection component
11/14/1995US5466888 Packaged semiconductor device having stress absorbing film
11/14/1995US5466887 Resin-packaged electronic component
11/14/1995US5466728 Flame retardant organosilicon polymer composition, process for making same, and article produced therefrom
11/14/1995US5466640 Method for forming a metal wire of a semiconductor device
11/14/1995US5466638 Method of manufacturing a metal interconnect with high resistance to electromigration
11/14/1995US5466637 Method of making a self-aligned contact in semiconductor device
11/14/1995US5466635 Process for making an interconnect bump for flip-chip integrated circuit including integral standoff and hourglass shaped solder coating
11/14/1995US5466634 Electronic modules with interconnected surface metallization layers and fabrication methods therefore
11/14/1995US5466540 Mark of an electronic component lid
11/14/1995US5466512 Flame retardant organosilicon polymer composition, process for making same, and article produced therefrom
11/14/1995US5465899 Method and apparatus for fine pitch wire bonding using a shaved capillary
11/14/1995US5465898 Process for producing a metal-ceramic substrate
11/14/1995US5465481 Method for fabricating a semiconductor package
11/14/1995US5465470 Fixture for attaching multiple lids to multi-chip module (MCM) integrated circuit
11/09/1995WO1995030246A1 Method and apparatus for recovering power from semiconductor circuit using thermoelectric device
11/09/1995WO1995030245A1 Venetian blind cell layout for rf power transistor
11/09/1995WO1995030243A1 Tape application platform and processes therefor
11/09/1995WO1995030241A1 Method for passivating the sides of a thin film semiconductor component
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