Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1995
12/07/1995DE4419060A1 Integrated circuit cooling package appts.
12/06/1995EP0685890A1 Semiconductor device having a MOS gate structure and a surface protective film and method of fabricating the same
12/06/1995EP0685886A1 MOS composite type semiconductor device
12/06/1995EP0685885A1 Improvements in or relating to the fabrication of semiconductor devices
12/06/1995EP0685884A1 Pressure equalizer for an integrated circuit chip interconnected to circuitry on a thin film membrane
12/06/1995EP0685883A2 Method of forming an improved dielectric in an integrated circuit
12/06/1995EP0685881A1 Linewidth control apparatus and method
12/06/1995EP0685878A2 Semiconductor package and method of forming the same
12/06/1995EP0685875A2 Sealing arrangement for mold
12/06/1995EP0685436A1 Ceramic substrates for hybrid integrated circuits
12/06/1995EP0685144A1 Microminiature stirling cycle cryocoolers and engines
12/06/1995EP0685114A1 Filling of vias and contacts employing an aluminum-germanium alloy
12/06/1995EP0685113A1 Address line repair structure and method for thin film imager devices
12/06/1995EP0685112A1 Repair line structure for thin film electronic devices
12/06/1995EP0565729B1 Laser device
12/06/1995CN1113070A Apparatus with supporting plate and method for applying passive glue
12/06/1995CN1113035A Semiconductor devices and method of making the devices
12/06/1995CN1030478C Low impedance, high voltage protection circuit
12/05/1995USRE35111 Local interconnect process for integrated circuits
12/05/1995USRE35109 Semiconductor device and method for fabricating the same
12/05/1995US5473514 Semiconductor device having an interconnecting circuit board
12/05/1995US5473512 Electronic device package having electronic device boonded, at a localized region thereof, to circuit board
12/05/1995US5473510 Land grid array package/circuit board assemblies and methods for constructing the same
12/05/1995US5473508 In a computer system
12/05/1995US5473276 MOS type power semiconductor switching device capable of protecting load shortcircuit problem under low heat dissipation
12/05/1995US5473199 Semiconductor device having a body with a carrier ring connected thereto
12/05/1995US5473198 Semiconductor memory device bonding pad arrangement
12/05/1995US5473195 Semiconductor integrated circuit device having parallel signal wirings variable in either width or interval
12/05/1995US5473194 Chip carrier having through hole conductors
12/05/1995US5473193 Package for parallel subelement semiconductor devices
12/05/1995US5473192 Unitary silicon die module
12/05/1995US5473190 Tab tape
12/05/1995US5473189 Lead frame for a semiconductor integrated circuit with outer leads having a staggered configuration
12/05/1995US5473188 Semiconductor device of the LOC structure type having a flexible wiring pattern
12/05/1995US5473119 Stress-resistant circuit board
12/05/1995US5473112 Method for manufacturing an integrated circuit
12/05/1995US5472913 Method of fabricating porous dielectric material with a passivation layer for electronics applications
12/05/1995US5472912 Method of making an integrated circuit structure by using a non-conductive plug
12/05/1995US5472911 Method for controlling electromigration and electrically conductive interconnect structure therefor
12/05/1995US5472901 Process for formation of vias (or contact openings) and fuses in the same insulation layer with minimal additional steps
12/05/1995US5472900 Capacitor fabricated on a substrate containing electronic circuitry
12/05/1995US5472825 Metal interconnect fabrication with dual plasma silicon dioxide deposition and etchback
12/05/1995US5472774 Photolithography test structure
12/05/1995US5472646 Method for fabricating a transfer model optical semiconductor apparatus
12/05/1995US5472507 IC wiring connecting method and apparatus
12/05/1995US5472488 Coating solution for forming glassy layers
12/05/1995US5472043 Two-phase component cooler with radioactive initiator
12/05/1995US5471850 Refrigeration system and method for very large scale integrated circuits
12/05/1995US5471844 High dissipation packaging for cryogenic integrated circuits
12/05/1995CA2048498C Thermal conductive colored aluminum nitride sintered body and method of preparing the same
12/05/1995CA2039417C Molded hybrid ic package and lead frame therefore
12/03/1995CA2147537A1 Sealing arrangement for mold
11/1995
11/30/1995WO1995032604A1 Processing low dielectric constant materials for high speed electronics
11/30/1995WO1995032523A1 A low capacitance, isotropically etched antifuse
11/30/1995WO1995032522A1 A low-capacitance, plugged antifuse and method of manufacture therefor
11/30/1995WO1995032519A1 Method for passivating silicon devices at low temperature to achieve low interface state density
11/30/1995DE4418679A1 Integrated circuit interconnect system for wafer test
11/30/1995DE4418617A1 Micro-wiring module with circuit board
11/30/1995CA2163627A1 Processing low dielectric constant materials for high speed electronics
11/29/1995EP0684647A1 Electronic parts having airbridge interconnection and method of manufacturing such electronic parts
11/29/1995EP0684646A1 Antifuse and method of manufacturing it
11/29/1995EP0684645A2 EMF shielding of an integrated circuit package
11/29/1995EP0684644A1 Method for manufacturing bump leaded film carrier type semiconductor device
11/29/1995EP0684643A1 Method of manufacturing semiconductor devices in an active layer on an support substrate
11/29/1995EP0684642A1 Method of fabrication of a porous dielectric layer for a semiconductor device
11/29/1995EP0684641A2 Semiconductor device moulding capable of accomplishing a high moisture proof
11/29/1995EP0684636A1 Method of applying opaque ceramic coatings containing silica
11/29/1995EP0684635A2 High throughput optical curing process for semiconductor device manufacturing
11/29/1995EP0683967A1 Housing for an electronic circuit.
11/29/1995EP0683923A1 Method of producing a radio frequency transponder with a molded environmentally sealed package
11/29/1995EP0656150A4 Metal electronic package incorporating a multi-chip module.
11/29/1995EP0539583B1 Method of producing heat pipe-type semiconductor cooling device
11/28/1995US5471369 Semiconductor device having a plurality of semiconductor chips
11/28/1995US5471366 Multi-chip module having an improved heat dissipation efficiency
11/28/1995US5471154 Programming of antifuses
11/28/1995US5471097 Resin encapsulated semiconductor device with an electrically insulating support and distortion preventing member
11/28/1995US5471096 And filler of specified particle sizes, free of alpha particle emissions; cured binder; connections between integrated semiconductors and carrier substrate
11/28/1995US5471095 Semiconductor integrated circuit device and method of fabricating same
11/28/1995US5471094 Self-aligned via structure
11/28/1995US5471093 Pseudo-low dielectric constant technology
11/28/1995US5471092 Metallurgical joint including a stress release layer
11/28/1995US5471091 Techniques for via formation and filling
11/28/1995US5471090 Electronic structures having a joining geometry providing reduced capacitive loading
11/28/1995US5471089 Semiconductor power module
11/28/1995US5471088 Semiconductor package and method for manufacturing the same
11/28/1995US5471027 Simple
11/28/1995US5471017 No fixture method to cure die attach for bonding IC dies to substrates
11/28/1995US5471011 Homogeneous thermoplastic semi-conductor chip carrier package
11/28/1995US5470802 Method of making a semiconductor device using a low dielectric constant material
11/28/1995US5470801 Multilayer element with insulation later on semiconductors with silicon, aluminum or germanium compoundds
11/28/1995US5470796 Electronic package with lead wire connections and method of making same
11/28/1995US5470790 Via hole profile and method of fabrication
11/28/1995US5470789 Forming apertures in insulating layers, coating with copper, wear, applying barriers and removal of layer
11/28/1995US5470788 Method of making self-aligned, lateral diffusion barrier in metal lines to eliminate electromigration
11/28/1995US5470787 Semiconductor device solder bump having intrinsic potential for forming an extended eutectic region and method for making and using the same
11/28/1995US5470780 Method of fabricating poly-silicon resistor
11/28/1995US5470549 Method of making tungsten-copper composite oxides
11/28/1995US5470411 Method for continuous assembly of patterned strips and integrated circuit micromodule obtained by said method
11/28/1995US5469981 Electrically blowable fuse structure manufacturing for organic insulators
11/23/1995WO1995031883A1 Process for manufacturing printed circuit foils or semifinished products for printed circuit foils, and thus manufactured printed circuit foils and semifinished products
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