Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1995
12/21/1995CA2191075A1 Fire prevention device for electronics
12/21/1995CA2126253A1 Passive cpu cooler
12/20/1995EP0688154A2 Method of and apparatus for centering integrated circuit lead frame
12/20/1995EP0688079A2 Integrated circuit protection apparatus and method
12/20/1995EP0688054A2 Electrostatic discharge protection for integrated circuit semiconductor device
12/20/1995EP0688053A1 Low inductance power semiconductor module
12/20/1995EP0688052A2 Improvements in or relating to fabrication of semiconductor devices
12/20/1995EP0688051A1 Fabrication process and assembly of an integrated circuit card and such obtained card
12/20/1995EP0688050A1 Assembly method for integrated circuit card and such obtained card
12/20/1995EP0688049A1 Process for manufacturing semiconductor bicmos device
12/20/1995EP0688047A1 Aluminium nitride substrate and method of producing the same
12/20/1995EP0688026A1 Resistor coated on diamond substrate
12/20/1995EP0687751A1 Selective etching of TiW for C4 fabrication
12/20/1995EP0687383A1 Heat sink assembly for solid state devices
12/20/1995EP0687382A1 Device and method for reducing thermal cycling in a semiconductor package
12/20/1995EP0340241B1 High density electronic package comprising stacked sub-modules
12/20/1995CN1113658A Semiconductor device
12/20/1995CN1113608A Lead frame for semiconductor devices
12/20/1995CN1113607A A chip package, a chip carrier and a method for producing the same, a terminal electrode for a circuit substrate and a method for producing the same, and a chip package-mounted complex
12/20/1995CN1113517A 转录因子aprf Transcription factor aprf
12/19/1995US5477466 Method of fabricating an integrated circuit
12/19/1995US5477409 Printed circuit board assembly
12/19/1995US5477086 Shaped, self-aligning micro-bump structures
12/19/1995US5477085 Bonding structure of dielectric substrates for impedance matching circuits on a packaging substrate involved in microwave integrated circuits
12/19/1995US5477084 Microelectronic device packaging containing a liquid and method
12/19/1995US5477083 Chip carrier for enabling production of high performance microwave semiconductor device by disposing semiconductor chip thereon
12/19/1995US5477082 Bi-planar multi-chip module
12/19/1995US5477081 Semiconductor device package
12/19/1995US5477080 Tape carrier and tape carrier device using the same
12/19/1995US5477079 Power source noise suppressing type semiconductor device
12/19/1995US5477076 Integrated circuit having an on chip thermal circuit requiring only one dedicated integrated circuit pin and method of operation
12/19/1995US5477067 Semiconductor IC device having a RAM interposed between different logic sections and by-pass signal lines extending over the RAM for mutually connecting the logic sections
12/19/1995US5477065 Lateral thin film thyristor with bevel
12/19/1995US5477062 Semiconductor wafer
12/19/1995US5477009 Resealable multichip module and method therefore
12/19/1995US5477008 Polymer plug for electronic packages
12/19/1995US5476884 Curing agent is phenol-novolak, cresol-novolak, novolak resin synthesized from bisphenol A or resorcinol, and polyhydric phenol compound; good moldablity, and good solder dipping stability
12/19/1995US5476818 Semiconductor structure and method of manufacture
12/19/1995US5476817 Method of making reliable metal leads in high speed LSI semiconductors using both dummy leads and thermoconductive layers
12/19/1995US5476815 Manufacturing method of semiconductor device
12/19/1995US5476814 Method of manufacturing semiconductor device utilizing selective CVD method
12/19/1995US5476726 Circuit board with metal layer for solder bonding and electronic circuit device employing the same
12/19/1995US5476719 Superconducting multi-layer microstrip structure for multi-chip modules and microwave circuits
12/19/1995US5476716 Semiconductors
12/19/1995US5476211 Method of manufacturing electrical contacts, using a sacrificial member
12/19/1995US5475920 Method of assembling ultra high density integrated circuit packages
12/19/1995US5475918 Method of preventing deformation of lead frames
12/19/1995CA2088912C Heat pipe connector and electronic apparatus and radiating fins having such connector
12/19/1995CA2057123C Semiconductor device and method of making it
12/14/1995WO1995034106A1 Microelectronic contacts and assemblies
12/14/1995DE4420564A1 Flow cooling mounting unit for thyristor or diode in power converter
12/14/1995DE19521150A1 Verdrahtungsstruktur eines Halbleiterbaulementes und Verfahren zu ihrer Herstellung Wiring structure of a semiconductor component Mentes and processes for their preparation
12/14/1995DE19520700A1 Semiconductor element used e.g. as integrated circuit
12/13/1995EP0687042A1 Semiconductor laser device
12/13/1995EP0687014A2 Pressure contact type semiconductor device, preferably of the light triggered type
12/13/1995EP0687009A2 Multi-layer electronic circuit package with dielectric polymer layers having different optical absorption strength and method of forming it
12/13/1995EP0687008A2 Method and apparatus for improving interfacial adhesion between a polymer and a metal
12/13/1995EP0687007A2 Electronic surface mount device and method for making
12/13/1995EP0687006A1 Cooler
12/13/1995EP0687005A2 Method of making interconnections on semiconductor devices
12/13/1995EP0687004A1 Method for fabrication of dielectrics on semiconductor devices
12/13/1995EP0687000A1 Method for bonding integrated circuit chips to substrates
12/13/1995EP0686669A2 Compositions for protecting semiconductor elements and semiconductor devices
12/13/1995EP0640245A4 Bumpless bonding process having multilayer metallization.
12/13/1995EP0592463B1 Assembly apparatus
12/12/1995USRE35119 Textured metallic compression bonding
12/12/1995US5475643 Semiconductor signal line system with crosstalk reduction
12/12/1995US5475611 Circuit structure, semiconductor integrated circuit and path routing method and apparatus therefor
12/12/1995US5475568 Power supply structure for multichip package
12/12/1995US5475567 Method for hermetically sealing a single layer ceramic thick film electronic module
12/12/1995US5475565 Power distribution lid for IC package
12/12/1995US5475564 CPU heat sink holding-down device
12/12/1995US5475268 Semiconductor device having an alignment mark
12/12/1995US5475267 Aluminum alloy, tungsten, and titanium nitride
12/12/1995US5475266 Structure for microelectronic device incorporating low resistivity straps between conductive regions
12/12/1995US5475265 Semiconductor device including gold interconnections where the gold grain size is a function of the width of the interconnections
12/12/1995US5475264 Arrangement having multilevel wiring structure used for electronic component module
12/12/1995US5475263 Thick film hybrid multilayer circuit
12/12/1995US5475262 Functional substrates for packaging semiconductor chips
12/12/1995US5475261 Semiconductor device having many lead pins
12/12/1995US5475259 Semiconductor device and carrier for carrying semiconductor device
12/12/1995US5475254 Semiconductor device with thin film resistor
12/12/1995US5475253 Antifuse structure with increased breakdown at edges
12/12/1995US5475247 Internally shielded dynamic random access memory cell
12/12/1995US5475246 Repair line structure for thin film electronic devices
12/12/1995US5475240 Contact structure of an interconnection layer for a semiconductor device and a multilayer interconnection SRAM
12/12/1995US5475236 Semiconductor chip for mounting on a semiconductor package substrate by a flip-clip process
12/12/1995US5475224 Infrared detector substrate with breakaway test tabs
12/12/1995US5475048 Free radical curable formulation of an unsaturated polyester or vinyl ester, thermoplastic resin and crosslinking agent
12/12/1995US5474958 Method for making semiconductor device having no die supporting surface
12/12/1995US5474957 Process of mounting tape automated bonded semiconductor chip on printed circuit board through bumps
12/12/1995US5474956 Curing and patterning the thin layer of polyimide dielectric
12/12/1995US5474952 Process for producing a semiconductor device
12/12/1995US5474942 Method of forming a liquid crystal display device
12/12/1995US5474834 Ceramic dielectric; circuit film of niobium
12/12/1995US5474828 Electronic device sealing resin compositions and sealed electronic devices
12/12/1995US5474640 Apparatus for marking a substrate using ionized gas
12/12/1995US5474458 Interconnect carriers having high-density vertical connectors and methods for making the same
12/12/1995US5473813 Methods of forming electronic multi-layer printed circuit boards and/or cards and electronic packages including said boards or cards
12/07/1995WO1995028735A3 Method of manufacturing a device whereby a support bar is provided with conductor tracks for electrically contacting a semiconductor element
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