| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/18/2013 | EP2637966A1 Method for the production of a substrate comprising embedded layers of getter material |
| 09/18/2013 | CN203205855U Electrostatic protection circuit applicable to keyboards |
| 09/18/2013 | CN203205854U Electrostatic protection circuit for USB flash disk interface |
| 09/18/2013 | CN203205443U Photovoltaic power generation module junction box |
| 09/18/2013 | CN203205442U Solar junction box |
| 09/18/2013 | CN203205430U Optocoupler packaging structure |
| 09/18/2013 | CN203205429U Photovoltaic bypass circuit module and conjunction box comprising the same |
| 09/18/2013 | CN203205417U Iron sealing common-anode diode power device with aluminum cooling fin |
| 09/18/2013 | CN203205415U Antistatic protector |
| 09/18/2013 | CN203205414U Semiconductor device having alignment marks and display device |
| 09/18/2013 | CN203205413U Metal arrangement structure of integrated power transistor |
| 09/18/2013 | CN203205412U Antistatic sliding fingerprint acquisition module |
| 09/18/2013 | CN203205411U Novel triode double-row framework |
| 09/18/2013 | CN203205410U Fully encapsulated lead frame for common anode diode device |
| 09/18/2013 | CN203205409U Novel triode pin structure |
| 09/18/2013 | CN203205408U Power integrated module |
| 09/18/2013 | CN203205407U 芯片封装结构 Chip package structure |
| 09/18/2013 | CN203205406U System-level packaging piece with integrated insertion slot |
| 09/18/2013 | CN203205405U Full-packaging common-anode diode power device |
| 09/18/2013 | CN203205404U Semiconductor wafer heat radiation apparatus |
| 09/18/2013 | CN203205403U 冷却装置 Cooling device |
| 09/18/2013 | CN203205402U Wafer heat dissipation element |
| 09/18/2013 | CN203205401U 芯片封装结构 Chip package structure |
| 09/18/2013 | CN203205400U Air-tight metal case for surface mounting |
| 09/18/2013 | CN203205399U New type integrated ceramic tube shell |
| 09/18/2013 | CN203202919U Driver chips for two-lamp LED lamp with high color rendering |
| 09/18/2013 | CN103314651A Method for obtaining palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates |
| 09/18/2013 | CN103314649A Method of transferring and electrically joining high density multilevel thin film to circuitized and flexible organic substrate and associated devices |
| 09/18/2013 | CN103314478A Cooling element having improved assembly productivity and battery modules including same |
| 09/18/2013 | CN103314457A Light emitting device chip scale package |
| 09/18/2013 | CN103314437A Power semiconductor module and power unit device |
| 09/18/2013 | CN103314436A Cooler |
| 09/18/2013 | CN103314435A Reversibly adhesive thermal interface material |
| 09/18/2013 | CN103314038A Siloxane compositions including metal-oxide nanoparticles suitable for forming encapsulants |
| 09/18/2013 | CN103313507A Printed circuit board and chip system |
| 09/18/2013 | CN103311692A Connector |
| 09/18/2013 | CN103311283A Power semiconductor chip gate resistor |
| 09/18/2013 | CN103311231A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/18/2013 | CN103311229A Semiconductor device |
| 09/18/2013 | CN103311228A Die, wafer and method of processing a wafer |
| 09/18/2013 | CN103311227A Chip module and circuit board |
| 09/18/2013 | CN103311226A Semiconductor device and manufacturing method thereof |
| 09/18/2013 | CN103311225A Semiconductor package and fabrication method thereof |
| 09/18/2013 | CN103311224A Contact test structure and method |
| 09/18/2013 | CN103311223A Nickel and gold electroplating product of wafer and method for manufacturing nickel and gold electroplating product |
| 09/18/2013 | CN103311222A Semiconductor packages and methods of formation thereof |
| 09/18/2013 | CN103311221A Semiconductor device integrated with passive component |
| 09/18/2013 | CN103311220A Circuit repair structure and method |
| 09/18/2013 | CN103311219A Inductor for post passivation interconnect |
| 09/18/2013 | CN103311218A Structure and method for a fishbone differential capacitor |
| 09/18/2013 | CN103311217A 3D transmission lines for semiconductors |
| 09/18/2013 | CN103311216A Novel high-density multilayer circuit chip flip encapsulation structure and manufacturing method |
| 09/18/2013 | CN103311215A Molded interconnection system ball grid array integrated circuit |
| 09/18/2013 | CN103311214A Base plate for stacked packaging |
| 09/18/2013 | CN103311213A Semiconductor packaging member integrating shielding film and antenna |
| 09/18/2013 | CN103311212A 半导体装置 Semiconductor device |
| 09/18/2013 | CN103311211A Multichip packaging member |
| 09/18/2013 | CN103311210A Lead frame used for assembling semiconductor device |
| 09/18/2013 | CN103311209A Silver-alloy welding wire |
| 09/18/2013 | CN103311208A Methods and materials useful for chip stacking, chip and wafer bonding |
| 09/18/2013 | CN103311207A Stacked package structure |
| 09/18/2013 | CN103311206A Electronic device encapsulated with welding end ring and electronic equipment provided with electronic device |
| 09/18/2013 | CN103311205A Encapsulating piece for preventing chip salient point from being short-circuited and manufacturing process thereof |
| 09/18/2013 | CN103311204A Flip-chip packaging techniques and configurations |
| 09/18/2013 | CN103311203A 半导体装置及其制造方法 Semiconductor device and manufacturing method |
| 09/18/2013 | CN103311202A Wire bonding structures for integrated circuits |
| 09/18/2013 | CN103311201A Semiconductor structure and manufacturing method thereof |
| 09/18/2013 | CN103311200A Chip package |
| 09/18/2013 | CN103311199A Through silicon via (TSV) exposure structure |
| 09/18/2013 | CN103311198A Through-silicon via and fabrication method thereof |
| 09/18/2013 | CN103311197A Substrate for power module |
| 09/18/2013 | CN103311196A High-density integrated micro-nano photoelectron chip radiator based on thermoelectric cooler |
| 09/18/2013 | CN103311195A Heat radiation structure |
| 09/18/2013 | CN103311194A Electrical power circuit assembly |
| 09/18/2013 | CN103311193A Semiconductor power module package structure and preparation method thereof |
| 09/18/2013 | CN103311192A Thin-gap POP (Package on Package) type packaging structure and packaging method |
| 09/18/2013 | CN103311191A Semiconductor device |
| 09/18/2013 | CN103311190A Mini-projector chip package structure and package method thereof |
| 09/18/2013 | CN103311189A Multilayer packaging device for flexible substrate |
| 09/18/2013 | CN103311177A Integrated optoelectronic interconnect with side-mounted transducers |
| 09/18/2013 | CN103311143A Chip package testing device and lead frame used thereby |
| 09/18/2013 | CN103311142A Packaging structure and packaging technology thereof |
| 09/18/2013 | CN103311141A Manufacturing method of coaxial vertical interconnection conductor |
| 09/18/2013 | CN103311138A Packaging methods and packaged semiconductor devices |
| 09/18/2013 | CN103311134A Semiconductor packages and methods of forming the same |
| 09/18/2013 | CN103311118A Semiconductor device, wafer assembly and methods of manufacturing wafer assemblies and semiconductor devices |
| 09/18/2013 | CN103308095A Detection of environmental conditions in semiconductor chip |
| 09/18/2013 | CN103305139A Heat-resistance pressure-sensitive adhesive tape for semiconductor device production and method for producing semiconductor device by using heat-resistance pressure-sensitive adhesive tape |
| 09/18/2013 | CN103302910A Biodegradable flexible conductive base plate and preparation method thereof |
| 09/18/2013 | CN102496612B High-isolation integrated circuit packaged by adopting ceramic casing |
| 09/18/2013 | CN102376686B Semiconductor device and production method thereof |
| 09/18/2013 | CN102332435B Electronic component and manufacturing method of same |
| 09/18/2013 | CN102263099B 3D (three-dimensional) IC (integrated circuit) and manufacturing method thereof |
| 09/18/2013 | CN102237321B 半导体装置 Semiconductor device |
| 09/18/2013 | CN102214622B 功率半导体模块 Power semiconductor module |
| 09/18/2013 | CN102185474B Dc-dc converter |
| 09/18/2013 | CN102160175B Impedance controlled electrical interconnection employing meta-materials |
| 09/18/2013 | CN102110612B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 09/18/2013 | CN102034781B Semiconductor package for printing bonding material on lead frame and wafer and manufacturing method thereof |
| 09/18/2013 | CN101836268B Method of forming copper wiring pattern and copper oxide particle dispersion for use in the same |