| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/09/1996 | US5483421 IC chip attachment |
| 01/09/1996 | US5483106 Semiconductor device for sensing strain on a substrate |
| 01/09/1996 | US5483105 Module input-output pad having stepped set-back |
| 01/09/1996 | US5483104 Semiconductor structure |
| 01/09/1996 | US5483103 Means for clamping a semi-conductor to a support |
| 01/09/1996 | US5483101 Multilayer printed circuit board |
| 01/09/1996 | US5483100 Integrated circuit package with via interconnections formed in a substrate |
| 01/09/1996 | US5483099 Standardized power and ground design for pin grid array packages |
| 01/09/1996 | US5483098 Semiconductor device |
| 01/09/1996 | US5483097 Film made from hydrogen containing silicon nitride film with specified hydrogen bond concentration amd silicon/nitrogen ratio limits; transmits uv radiation |
| 01/09/1996 | US5483095 Optical semiconductor device |
| 01/09/1996 | US5483092 Semiconductor device having a via-hole with a void area for reduced cracking |
| 01/09/1996 | US5483084 Diamond covered member and process for producing the same |
| 01/09/1996 | US5483024 High density semiconductor package |
| 01/09/1996 | US5482903 Powder mixture of boria, calcia, and alumina; high density, thermoconductivity |
| 01/09/1996 | US5482898 Method for forming a semiconductor device having a thermal dissipator and electromagnetic shielding |
| 01/09/1996 | US5482897 Integrated circuit with on-chip ground plane |
| 01/09/1996 | US5482893 Method for producing semiconductor device having alignment mark |
| 01/09/1996 | US5482884 Low-temperature process metal-to-metal antifuse employing silicon link |
| 01/09/1996 | US5482735 Method for making multi-layer ceramic packages |
| 01/09/1996 | US5482658 Method of making an optoelectronic interface module |
| 01/09/1996 | US5482471 Socket apparatus for IC package testing |
| 01/09/1996 | US5481798 Etching method for forming a lead frame |
| 01/04/1996 | WO1996000494A1 Vertical interconnect process for silicon segments |
| 01/04/1996 | DE19521985A1 Semiconductor device with fuse(s) |
| 01/03/1996 | EP0690505A2 Sintered body for and manufacture of ceramic substrates |
| 01/03/1996 | EP0690504A1 Solder terminal and method of fabricating it |
| 01/03/1996 | EP0690503A1 Improved interconnect line structure and process therefor |
| 01/03/1996 | EP0690502A1 Cooling fin for semiconductor device |
| 01/03/1996 | EP0690501A2 Integrated circuit package with diamond heat sink |
| 01/03/1996 | EP0690500A1 Ball-grid-array integrated circuit package with solder-connected thermal conductor |
| 01/03/1996 | EP0690499A2 Paddleless molded plastic semiconductor chip package |
| 01/03/1996 | EP0690498A2 Poly(arcyl ether benzimidazoles) and their use as capping layers in microelectronic structures |
| 01/03/1996 | EP0690497A2 Semiconductor device and method of forming |
| 01/03/1996 | EP0690490A2 Flip chip technology using electrically conductive polymers and dielectrics |
| 01/03/1996 | EP0690297A1 Package for electrical components and method for making |
| 01/03/1996 | EP0689571A1 Three-layer polyimidesiloxane adhesive tape |
| 01/03/1996 | EP0548128B1 System of machining devices |
| 01/03/1996 | CN1114468A Composite material for lead wire frame |
| 01/02/1996 | US5481138 Structure and a method for repairing electrical lines |
| 01/02/1996 | US5481137 Improvement in aluminum alloy film used as interconnector, reducing pits and nodules |
| 01/02/1996 | US5481136 Heat exchangers for electronics with copper-tungsten or copper molybdenum alloy with expansion |
| 01/02/1996 | US5481135 Hermetic protection for integrated circuits |
| 01/02/1996 | US5481133 Three-dimensional multichip package |
| 01/02/1996 | US5480841 Process of multilayer conductor chip packaging |
| 01/02/1996 | US5480840 Multi-chip module with multiple compartments |
| 01/02/1996 | US5480839 Semiconductor device manufacturing method |
| 01/02/1996 | US5480837 Process of making an integrated circuit having a planar conductive layer |
| 01/02/1996 | US5480836 Method of forming an interconnection structure |
| 01/02/1996 | US5480834 Process of manufacturing an electrical bonding interconnect having a metal bond pad portion and having a conductive epoxy portion comprising an oxide reducing agent |
| 01/02/1996 | US5480822 Method of manufacture of semiconductor memory device with multiple, orthogonally disposed conductors |
| 01/02/1996 | US5480812 Multilayer electroconductive electronic imager and repair area over open circuits discontinuity and shunts |
| 01/02/1996 | US5480727 Molded lead for power module |
| 01/02/1996 | US5480503 Process for producing circuitized layers and multilayer ceramic sub-laminates and composites thereof |
| 01/02/1996 | US5479703 Method of making a printed circuit board or card |
| 01/02/1996 | CA2152132A1 Integrated circuit package with diamond heat sink |
| 01/02/1996 | CA2034075C Self-aligning contact and interconnect structure |
| 12/27/1995 | EP0689248A1 Integrated device with a surface electrical field delimiting structure and relative fabrication process |
| 12/27/1995 | EP0689247A1 High input/output density MLC flat pack |
| 12/27/1995 | EP0689246A1 Improvements in or relating to semiconductor devices |
| 12/27/1995 | EP0689245A2 Electronic device, its arrangement and method of manufacturing the same |
| 12/27/1995 | EP0689244A2 Articles having thermal conductors |
| 12/27/1995 | EP0689243A2 Semiconductor device assembly |
| 12/27/1995 | EP0689242A1 Encased integral molded plastic multi-chip module substrate and fabrication process |
| 12/27/1995 | EP0689241A2 Carrier for carrying semiconductor device |
| 12/27/1995 | EP0689240A1 Bonded structure and methods for forming this structure |
| 12/27/1995 | EP0689235A1 Porous dielectric material with improved pore surface properties for electronics applications |
| 12/27/1995 | CN1113921A Epoxy resin composite for plastic sealing semiconductor device and its preparing method |
| 12/26/1995 | US5479318 Bus communication system for stacked high density integrated circuit packages with trifurcated distal lead ends |
| 12/26/1995 | US5479054 Semiconductor device with improved planarization properties |
| 12/26/1995 | US5479053 Semiconductor device with conductor clad insulator wiring |
| 12/26/1995 | US5479052 Contact structure with capacitor for group III-V semiconductor devices |
| 12/26/1995 | US5479051 Semiconductor device having a plurality of semiconductor chips |
| 12/26/1995 | US5479050 Leadframe with pedestal |
| 12/26/1995 | US5479049 Solid state image sensor provided with a transparent resin layer having water repellency and oil repellency and flattening a surface thereof |
| 12/26/1995 | US5479045 Semiconductor circuit device capable of reducing influence of a parasitic capacitor |
| 12/26/1995 | US5479044 Semiconductor circuit device capable of reducing influence of a parasitic capacitor |
| 12/26/1995 | US5479038 Semiconductor device having a multilevel metallization |
| 12/26/1995 | US5479031 Four layer overvoltage protection device having buried regions aligned with shorting dots to increase the accuracy of overshoot voltage value |
| 12/26/1995 | US5478973 Semiconductor chip contact bump structure |
| 12/26/1995 | US5478972 Multilayer circuit board and a method for fabricating the same |
| 12/26/1995 | US5478871 Polyhydric phenol from naphthaldehyde and epoxy resin obtained using the same |
| 12/26/1995 | US5478782 Method bonding for production of SOI transistor device |
| 12/26/1995 | US5478781 Polyimide-insulated cube package of stacked semiconductor device chips |
| 12/26/1995 | US5478779 Electrically conductive projections and semiconductor processing method of forming same |
| 12/26/1995 | US5478771 Method of forming local interconnect structure without P-N junction between active elements |
| 12/26/1995 | US5478425 Method of making a thin film detector with an aerogel layer |
| 12/26/1995 | US5478420 Process for forming open-centered multilayer ceramic substrates |
| 12/26/1995 | US5478221 Miniature fan for printed circuit board |
| 12/26/1995 | US5478007 Method for interconnection of integrated circuit chip and substrate |
| 12/26/1995 | US5478006 Printed-circuit substrate and its connecting method |
| 12/26/1995 | US5477933 Electronic device interconnection techniques |
| 12/26/1995 | US5477916 Retainer frame assembly for dissipating heat generated on an integrated circuit chip |
| 12/26/1995 | US5477894 Device for correcting lateral bending of IC leads |
| 12/26/1995 | US5477611 Method of forming interface between die and chip carrier |
| 12/21/1995 | WO1995034897A1 Memory test system |
| 12/21/1995 | WO1995034347A1 Fire prevention device for electronics |
| 12/21/1995 | DE4442960C1 Solder bump used in mfr. of semiconductor chips |
| 12/21/1995 | DE4441122C1 Contactless plastic identity card with polyimide or polyethylene-naphthalene chip carrier |
| 12/21/1995 | DE4421025A1 Heat-sink for semiconductor power transistor in traffic engineering |