| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/30/1996 | US5488253 Semiconductor device |
| 01/30/1996 | US5488252 Layout for radio frequency power transistors |
| 01/30/1996 | US5488246 Semiconductor device and method of manufacturing the same |
| 01/30/1996 | US5488144 Bifunctional aromatic cyanates, prepolymers and electrical laminates made therefrom |
| 01/30/1996 | US5488015 Method of making an interconnect structure with an integrated low density dielectric |
| 01/30/1996 | US5488014 Interconnection structure of semiconductor integrated circuit device and manufacturing method thererfor |
| 01/30/1996 | US5488013 Method of forming transverse diffusion barrier interconnect structure |
| 01/30/1996 | US5487999 Method for fabricating a penetration limited contact having a rough textured surface |
| 01/30/1996 | US5487923 Corrosion resistant layers formed by vapor deposition |
| 01/30/1996 | US5487852 Polyamides, polyester ethers or polyimides for sheets |
| 01/30/1996 | US5487218 Method for making printed circuit boards with selectivity filled plated through holes |
| 01/27/1996 | CA2154719A1 Multi-chip module semiconductor device |
| 01/25/1996 | WO1996002071A1 Packaged integrated circuit |
| 01/25/1996 | WO1996002068A1 Microelectronic mounting with multiple lead deformation |
| 01/25/1996 | DE4425389A1 Electrically and thermally conductive motor vehicle component coupler |
| 01/25/1996 | DE19526511A1 PCB mounting applications of an encapsulated semiconductor package |
| 01/25/1996 | DE19525388A1 Semiconductor chip electronic component with current input and output conductor |
| 01/24/1996 | EP0693797A2 Pad on type contact interconnection technology for electronic apparatus |
| 01/24/1996 | EP0693784A1 Safeguard for integrated output power stages employing multiple bond-wires |
| 01/24/1996 | EP0693782A1 Method for reducing process antenna effect |
| 01/24/1996 | EP0693780A2 Method and apparatus for directly joining a chip to a heat sink |
| 01/24/1996 | EP0693779A2 Resin sealing type semiconductor device and method of making the same |
| 01/24/1996 | EP0693778A2 Semiconductor device with integral heatsink |
| 01/24/1996 | EP0693777A1 Injection moulded BGA-package |
| 01/24/1996 | EP0693776A2 Highly heat-radiating ceramic package |
| 01/24/1996 | EP0693736A2 Board for IC card and manufacturing method therefor |
| 01/24/1996 | EP0685144A4 Microminiature stirling cycle cryocoolers and engines. |
| 01/24/1996 | EP0632950B1 Integrated circuit test socket |
| 01/24/1996 | EP0594654B1 Machine tool with curved drive, especially for stamping and shaping the connecting pins of integrated circuits |
| 01/24/1996 | CN1115562A Electromagnetic interference supressing body having low electromagnetic transparency and reflection, and electronic device having the same |
| 01/24/1996 | CN1115498A Heat-pipe type cooling apparatus |
| 01/24/1996 | CN1115497A Method for repairing a defect-generated cell using a laser |
| 01/24/1996 | CN1115414A Photomask for the measurement of resolution of exposure equipment |
| 01/23/1996 | US5486981 Heat dissipating assembly |
| 01/23/1996 | US5486980 Heat sink apparatus for attachment to an electronic device package |
| 01/23/1996 | US5486939 Thin-film structure with insulating and smoothing layers between crossing conductive lines |
| 01/23/1996 | US5486786 Process monitor for CMOS integrated circuits |
| 01/23/1996 | US5486776 Antifuse-based programmable logic circuit |
| 01/23/1996 | US5486722 For a semiconductor device |
| 01/23/1996 | US5486721 Metal base element, outer layer of palladium and multilayer nickel phosphorous alloy |
| 01/23/1996 | US5486720 EMF shielding of an integrated circuit package |
| 01/23/1996 | US5486719 Semiconductor device including insulating film arrangement having low reflectance |
| 01/23/1996 | US5486715 High frequency MOS device |
| 01/23/1996 | US5486707 Antifuse structure with double oxide layers |
| 01/23/1996 | US5486493 Planarized multi-level interconnect scheme with embedded low-dielectric constant insulators |
| 01/23/1996 | US5486427 Patterned array of uniform metal microbeads |
| 01/23/1996 | US5486223 Metal matrix compositions and method of manufacture thereof |
| 01/23/1996 | US5485906 Coin validators |
| 01/23/1996 | US5485671 Method of making a two-phase thermal bag component cooler |
| 01/23/1996 | CA2031459C Surface structure of ceramics substrate and method of manufacturing the same |
| 01/20/1996 | CA2154138A1 Epoxy resin composition, process for producing the same and resin-sealed semiconductor device |
| 01/18/1996 | WO1996001496A1 Method of manufacturing a semiconductor device with a moisture impermeable barrier layer |
| 01/18/1996 | WO1996001495A1 Method, carrier and mould parts for encapsulating a chip |
| 01/18/1996 | DE19517975A1 Polysilizium-Feldringstruktur für Leistungs-IC's Polysilicon field ring structure for power ICs |
| 01/18/1996 | DE19509198A1 Semiconductor device for dynamic random access memory |
| 01/17/1996 | EP0692928A1 Programmable lead conditioner |
| 01/17/1996 | EP0692824A2 Improvements in and relating to semiconductor devices |
| 01/17/1996 | EP0692823A1 Ball grid array package for an integated circuit |
| 01/17/1996 | EP0692822A1 Clamping device for discoidal semiconductor |
| 01/17/1996 | EP0692821A2 Method of manufacturing semiconductor layer |
| 01/17/1996 | EP0692820A1 Manufacturing one sided resin sealed semiconductor devices and a carrier used for it |
| 01/17/1996 | EP0692144A1 A pedestal lead frame for supporting a semiconductor chip |
| 01/17/1996 | EP0692143A1 Plastic encapsulated integrated circuit package with fully slotted dambar |
| 01/17/1996 | EP0692142A1 Liquid metal heat conducting member and integrated circuit package incorporating same |
| 01/17/1996 | CN1115169A Fastening base board |
| 01/17/1996 | CN1115118A Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material provided on a support slice |
| 01/17/1996 | CN1115116A Method for forming a metallic barrier layer in semiconductor device |
| 01/16/1996 | US5485352 Element joining pad for semiconductor device mounting board |
| 01/16/1996 | US5485351 Socket assembly for integrated circuit chip package |
| 01/16/1996 | US5485039 Semiconductor substrate having wiring conductors at a first main surface electrically connected to plural pins at a second main surface |
| 01/16/1996 | US5485038 Microelectronic circuit substrate structure including photoimageable epoxy dielectric layers |
| 01/16/1996 | US5485037 Integrated circuit package |
| 01/16/1996 | US5485036 Local ground plane for high frequency circuits |
| 01/16/1996 | US5485035 Method for planarization of an integrated circuit |
| 01/16/1996 | US5485032 Antifuse element with electrical or optical programming |
| 01/16/1996 | US5485031 Antifuse structure suitable for VLSI application |
| 01/16/1996 | US5485020 Semiconductor device including a thin film transistor and a wiring portion having the same layered structure as and being integral with a source region or drain region of the transistor |
| 01/16/1996 | US5484964 Surface mounting pin grid arrays |
| 01/16/1996 | US5484963 Ceramic substrate provided with metallized layers for connection with chip, circuit board, or the like |
| 01/16/1996 | US5484959 High density lead-on-package fabrication method and apparatus |
| 01/16/1996 | US5484262 For cooling an electronic component having an exposed surface |
| 01/16/1996 | US5484097 Fabrication of hybrid semiconductor devices |
| 01/16/1996 | US5484013 Heat sink fan |
| 01/16/1996 | US5483740 Method of making homogeneous thermoplastic semi-conductor chip carrier package |
| 01/16/1996 | CA2084685C Solder interconnections and methods for making same |
| 01/16/1996 | CA2052302C Prevention of inspection of secret data stored in encapsulated integrated circuit chip |
| 01/11/1996 | WO1996001035A1 Ducted opposing bonded fin heat sink blower multi-microprocessor cooling system |
| 01/11/1996 | WO1996000980A1 Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities |
| 01/11/1996 | DE4424014A1 Forming contact sockets on semiconductors components |
| 01/10/1996 | EP0691803A1 Heat radiating member made of highly oriented graphite |
| 01/10/1996 | EP0691682A2 Fired body for and manufacture of a substrate |
| 01/10/1996 | EP0691681A2 Semiconductor packaging |
| 01/10/1996 | EP0691680A1 Package for electronic element |
| 01/10/1996 | EP0691555A1 Laser module |
| 01/10/1996 | EP0691414A1 Fine palladium alloy wire for semiconductor element wire bonding |
| 01/10/1996 | EP0690955A1 High power dissipating packages with matched heatspreader heatsink assemblies |
| 01/10/1996 | EP0526656B1 Wiring board |
| 01/10/1996 | EP0500965B1 Semiconductor device having heat radiating fin assembly and case for containing the same |
| 01/10/1996 | CN1114786A A flexible wiring board having a terminal array extending along a whole edge of its substrate and a connection structure of the flexible wiring board with a circuit board |
| 01/09/1996 | US5483636 Automated diagnosis using wafer tracking databases |