| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/15/1996 | WO1996004329A1 Flowable sealing resin composition |
| 02/15/1996 | WO1996004327A1 Phosphorus-modified epoxide resins, process for producing the same and their use |
| 02/15/1996 | WO1995024730A3 Apparatus having inner layers supporting surface-mount components |
| 02/15/1996 | DE4427309A1 Herstellung eines Trägerelementmoduls zum Einbau in Chipkarten oder andere Datenträgerkarten Producing a carrier element module for integration into smart cards or other media cards |
| 02/15/1996 | DE19530690A1 Sandwich panel with integral heat conducting pipes |
| 02/14/1996 | EP0696882A1 Printed circuit board with bi-metallic heat spreader |
| 02/14/1996 | EP0696819A1 Diamond-like carbon for use in VLSI and ULSI interconnect systems |
| 02/14/1996 | EP0696818A2 Semiconductor element with insulating package |
| 02/14/1996 | EP0696812A1 Thermally activated noise immune fuse |
| 02/14/1996 | EP0696630A2 Heat conductive material and method for producing the same |
| 02/14/1996 | EP0504314B1 Polymeric compositions crosslinked with bistriazene compounds |
| 02/14/1996 | EP0504265B1 Crosslinkable fluorinated polymer compositions |
| 02/14/1996 | CN1116772A Design of high density structures with laser etch stop |
| 02/14/1996 | CN1116770A Method and apparatus for improving interfacial adhesion between a polymer and a metal |
| 02/13/1996 | US5491654 Static random access memory device having thin film transistor loads |
| 02/13/1996 | US5491610 For actively cooling a semiconductor chip module |
| 02/13/1996 | US5491449 Dual-sided push-pull amplifier |
| 02/13/1996 | US5491364 Reduced stress terminal pattern for integrated circuit devices and packages |
| 02/13/1996 | US5491363 Low boiling point liquid coolant cooling structure for electronic circuit package |
| 02/13/1996 | US5491362 Package structure having accessible chip |
| 02/13/1996 | US5491361 Hydrogen out venting electronic package |
| 02/13/1996 | US5491360 Electronic package for isolated circuits |
| 02/13/1996 | US5491355 Self-aligned contact formation |
| 02/13/1996 | US5491352 Semiconductor device having peripheral metal wiring |
| 02/13/1996 | US5491304 Connector for integrated circuit chips |
| 02/13/1996 | US5491301 Shielding method and circuit board employing the same |
| 02/13/1996 | US5491111 Method of making a semiconductor diode |
| 02/13/1996 | US5491110 Metal semiconductor package with an external plastic seal |
| 02/13/1996 | US5491109 Method for the construction of highly integrated semiconductor connecting device |
| 02/13/1996 | US5491100 Method for manufacturing a semiconductor device having a contact window structure |
| 02/13/1996 | US5491034 Incorporating copper for highter cupture strength |
| 02/13/1996 | US5491005 Gold thin film vapor growing method |
| 02/13/1996 | US5490895 Coating board with adhesive mixture of polybutadiene, epoxy novolak resin, and alumina, placing aluminum sheet in contact with the surface, curing |
| 02/13/1996 | US5490796 IC socket equipped with dust discharge means |
| 02/13/1996 | US5490628 Method of producing a device |
| 02/13/1996 | US5490558 L-type heat sink |
| 02/13/1996 | US5490324 Method of making integrated circuit package having multiple bonding tiers |
| 02/08/1996 | WO1996003772A2 Method of manufacturing a semiconductor device for surface mounting, and semiconductor device for surface mounting |
| 02/08/1996 | WO1996003771A1 Method of manufacturing a composite structure for use in electronic devices and structure, manufactured by said method |
| 02/08/1996 | WO1996003611A1 Flexible heat pipe for integrated circuit cooling apparatus |
| 02/08/1996 | WO1996003466A1 Paste or printable ink compositions |
| 02/08/1996 | DE4427456A1 Phosphormodifizierte Epoxidharze, Verfahren zu ihrer Herstellung und ihre Verwendung Phosphorus-modified epoxy resins, process for their preparation and their use |
| 02/08/1996 | DE19527368A1 Semiconductor device fabrication method |
| 02/07/1996 | EP0696160A2 Cooling device for electrical or electronic components having a main board and cooling elements, and method for making the same |
| 02/07/1996 | EP0696063A2 Thermally conductive material |
| 02/07/1996 | EP0696060A2 Method of making a wiring and a contact structure of a semiconductor device |
| 02/07/1996 | EP0696056A2 Double mask hermetic passivation structure |
| 02/07/1996 | EP0696055A2 Electronic assemblies and methods of treatment |
| 02/07/1996 | EP0695943A2 Temporary package for bare die test and-burn-in |
| 02/07/1996 | EP0695732A2 Metallized ceramic substrate having smooth plating layer and method for producing the same |
| 02/07/1996 | EP0695631A1 Process for forming opencentered multilayer ceramic substrates |
| 02/07/1996 | EP0695463A1 Electromigration resistant metallization structures for microcircuit interconnections with rf-reactively sputtered titanium tungsten and gold |
| 02/07/1996 | CN2219544Y Jointing piece for fixing base of rectifier |
| 02/07/1996 | CN1116418A Detaching linerless labels |
| 02/07/1996 | CN1116400A Cooling structure of unit |
| 02/07/1996 | CN1116363A Method for forming a dielectric layer on a high temperature metal layer |
| 02/06/1996 | US5490042 Programmable silicon circuit board |
| 02/06/1996 | US5490040 Surface mount chip package having an array of solder ball contacts arranged in a circle and conductive pin contacts arranged outside the circular array |
| 02/06/1996 | US5489805 Slotted thermal dissipater for a semiconductor package |
| 02/06/1996 | US5489802 Pressure contact type semiconductor device and heat compensator |
| 02/06/1996 | US5489801 Integrated circuit which containing a heat exchanger element |
| 02/06/1996 | US5489800 Dual channel small outline optocoupler package and method thereof |
| 02/06/1996 | US5489797 Local interconnect structure |
| 02/06/1996 | US5489752 Process for dissipating heat from a semiconductor package |
| 02/06/1996 | US5489749 Semiconductor connection components and method with releasable lead support |
| 02/06/1996 | US5489637 Low temperature flexible die attach adhesive and articles using same |
| 02/06/1996 | US5489465 Edge seal technology for low dielectric/porous substrate processing |
| 02/06/1996 | US5489059 Semiconductor device having an universal die size inner lead layout |
| 02/06/1996 | US5488765 Method of measuring characteristics of a multilayer electronic component |
| 02/06/1996 | CA2037505C Semiconductor element |
| 02/06/1996 | CA2017743C Ultra-tall indium or alloy bump array for ir detector hybrids and micro-electronics |
| 02/01/1996 | WO1996003020A1 Integrally bumped electronic package components |
| 02/01/1996 | WO1996002945A1 Electrostatic discharge protection device |
| 02/01/1996 | WO1996002944A1 An anti-fuse structure and method for making same |
| 02/01/1996 | WO1996002943A1 Thermally enhanced leadframe |
| 02/01/1996 | WO1996002942A1 Molded plastic semiconductor package including heat spreader |
| 02/01/1996 | WO1996002941A1 Metal cover for ceramic package and method of making same |
| 02/01/1996 | WO1996002940A1 Device reliability of mos devices using silicon rich plasma oxide films |
| 02/01/1996 | WO1996002939A1 Method of introducing material in holes |
| 02/01/1996 | WO1996002938A1 Filling holes and the like in substrates |
| 02/01/1996 | WO1996002848A1 Three axis packaging |
| 02/01/1996 | CA2194776A1 Electrostatic discharge protection device |
| 02/01/1996 | CA2171092A1 Filling holes and the like in substrates |
| 01/31/1996 | EP0694968A2 Multi-chip module semiconductor device |
| 01/31/1996 | EP0694967A2 Microwave integrated circuit passive element structure and method for reducing signal propagation losses |
| 01/31/1996 | EP0694966A1 Package for an electronic semiconductor circuit |
| 01/31/1996 | EP0694965A1 BGA package for integrated circuits and method for manufacturing |
| 01/31/1996 | EP0694964A2 Semiconductor device and package structure therefor and power inverter having semiconductor device |
| 01/31/1996 | EP0694220A1 Solder-bearing lead |
| 01/31/1996 | EP0694212A1 Improved thermally conductive interface |
| 01/31/1996 | CN1115909A High voltage-resisting surface structure for high-voltage device |
| 01/31/1996 | CN1115899A Semiconductor equipment with multi-layered coductor configuration |
| 01/31/1996 | CN1030886C Sealed electronic package providing in-situ metallization |
| 01/30/1996 | US5488542 MCM manufactured by using thin film multilevel interconnection technique |
| 01/30/1996 | US5488350 Method of heating and sensing temperature |
| 01/30/1996 | US5488288 Circuit arrangement integrated in a semiconductor circuit |
| 01/30/1996 | US5488257 Multilayer molded plastic package using mesic technology |
| 01/30/1996 | US5488256 Semiconductor device with interconnect substrates |
| 01/30/1996 | US5488255 Cooling device for semiconductor packages, having flexible film heat expulsion means |
| 01/30/1996 | US5488254 Plastic-molded-type semiconductor device |