| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/05/1996 | US5496967 Package for holding IC chip |
| 03/05/1996 | US5496777 Method of arranging alignment marks |
| 03/05/1996 | US5496775 Tower, integrated circuit |
| 03/05/1996 | US5496771 Method of making overpass mask/insulator for local interconnects |
| 03/05/1996 | US5496619 Assembly formed from conductive paste and insulating paste |
| 03/05/1996 | US5496435 Semiconductor lead frame lead stabilization |
| 03/05/1996 | US5495889 Cooling device for power electronic components |
| 03/05/1996 | US5495668 Manufacturing method for a supermicro-connector |
| 03/05/1996 | US5495667 Method for forming contact pins for semiconductor dice and interconnects |
| 03/01/1996 | CA2157149A1 Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition |
| 02/29/1996 | WO1996006458A1 Layout for radio frequency power transistors |
| 02/29/1996 | WO1996006457A1 Semiconductor device with at least one semiconductor component |
| 02/29/1996 | WO1996006321A1 Heat sink |
| 02/29/1996 | WO1996006123A1 Polyurethanes with improved resistance to tear propagation |
| 02/29/1996 | DE4430050A1 Lead frame for LOC assembly in inner lead region |
| 02/29/1996 | DE19506664A1 Electric control apparatus for vehicle IC engine electromechanical mechanism |
| 02/29/1996 | CA2174219A1 Layout for radio frequency power transistors |
| 02/28/1996 | EP0699018A1 Socket apparatus |
| 02/28/1996 | EP0698922A1 Leadframe for supporting integrated semiconductor devices |
| 02/28/1996 | EP0698921A2 Layered features for co-fired module integration |
| 02/28/1996 | EP0698920A2 A method for assembling integrated circuits upon printed circuit boards |
| 02/28/1996 | EP0698294A1 Logical three-dimensional interconnections between integrated circuit chips using a two-dimensional multi-chip module package |
| 02/28/1996 | EP0698293A1 Semiconductor components with supply terminals for high integration density |
| 02/28/1996 | EP0698292A1 A molded lead frame and method of making same |
| 02/28/1996 | EP0698291A1 Plastic encapsulated integrated circuit package and method of manufacturing the same |
| 02/28/1996 | EP0698290A1 Power semiconductor device with stress buffer layer |
| 02/28/1996 | EP0698289A1 Contact structure for vertical chip connections |
| 02/28/1996 | EP0698288A1 Process for producing vertically connected semiconductor components |
| 02/28/1996 | EP0606216B1 Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias |
| 02/28/1996 | CN2221257Y Fork lead of H-type mixed integrated circuit |
| 02/28/1996 | CN1117770A Improved thermally conductive interface |
| 02/28/1996 | CN1117666A Electronic components and method of manufacturing same |
| 02/28/1996 | CN1117655A Electroplated solder terminal |
| 02/28/1996 | CN1117654A Temporary package for bare die test and burn-in |
| 02/28/1996 | CN1117652A Vernier |
| 02/28/1996 | CN1117478A Ceramic substrates for hybrid integrated circuits |
| 02/27/1996 | US5495450 Method and assembly for mounting an electronic device having an optically erasable surface |
| 02/27/1996 | US5495398 Circuit assembly |
| 02/27/1996 | US5495392 CPU heat dissipating apparatus |
| 02/27/1996 | US5495179 Carrier having interchangeable substrate used for testing of semiconductor dies |
| 02/27/1996 | US5495126 Radiators |
| 02/27/1996 | US5495125 Molded semiconductor device |
| 02/27/1996 | US5494858 Method for forming porous composites as a low dielectric constant layer with varying porosity distribution electronics applications |
| 02/27/1996 | US5494854 Enhancement in throughput and planarity during CMP using a dielectric stack containing HDP-SiO2 films |
| 02/27/1996 | US5494853 Method to solve holes in passivation by metal layout |
| 02/27/1996 | US5494757 Blend of a piperazinylethylamidocarbonyl-containing butadiene-acrylonitrile terpolymer and a maleimide resin |
| 02/27/1996 | US5494753 A heat-generating source in contact with a heat sink material consisting of graphite that is isotopically pure |
| 02/27/1996 | US5494713 Anodic oxidation, sealing pores, silicon-containing coating film by chemical vapor deposition |
| 02/27/1996 | US5494169 IC carrier |
| 02/27/1996 | US5494098 Fan driven heat sink |
| 02/27/1996 | US5493769 Method of manufacturing electronic component and measuring characteristics of same |
| 02/27/1996 | US5493768 For trimming excess portions from a leadframe strip package |
| 02/27/1996 | CA2056781C Multichip module |
| 02/22/1996 | WO1996005615A1 Plastic substrate for electronic circuits with bondable contact pins |
| 02/22/1996 | WO1996005614A1 Flip chip bonding with non-conductive adhesive |
| 02/22/1996 | WO1996005613A1 Semiconductor device |
| 02/22/1996 | WO1996005612A1 A fine pitch lead frame and method for manufacturing same |
| 02/22/1996 | WO1996005602A1 Thermally conductive gel materials |
| 02/22/1996 | WO1996005017A1 Method of marking works |
| 02/22/1996 | WO1996004810A1 Heat dissipating assembly |
| 02/22/1996 | DE4429345A1 Polyurethane mit verbessertem Weiterreiß-Widerstand Polyurethanes with improved tear resistance |
| 02/22/1996 | DE4429289A1 Integrated circuit for e.g. suppressing high frequency interference signal |
| 02/22/1996 | DE4429002A1 Integrated circuit chip connection system of cranked leads |
| 02/22/1996 | DE19517424A1 Layout method for integrated circuit |
| 02/21/1996 | EP0697735A1 Single twist layout and method for paired line conductors of integrated circuits |
| 02/21/1996 | EP0697731A2 Flat package for semiconductor IC |
| 02/21/1996 | EP0697730A2 High aspect ratio low resistivity lines/vias by surface diffusion |
| 02/21/1996 | EP0697729A2 Contact structure using barrier metal and method of manufacturing the same |
| 02/21/1996 | EP0697728A1 MOS-technology power device chip and package assembly |
| 02/21/1996 | EP0697727A2 Method of bumping substrates |
| 02/21/1996 | EP0697726A2 Heat sink comprising synthetic diamond film |
| 02/21/1996 | EP0697725A2 Ceramic composition for circuit substrat and its fabrication |
| 02/21/1996 | EP0697724A1 Process for the production of a base board for printed wiring boards |
| 02/21/1996 | EP0697722A2 Method for planarizing the dielectrics a semiconductor devices |
| 02/21/1996 | EP0697708A1 Semiconductor fuse devices |
| 02/21/1996 | EP0697018A1 Glycidyl esters for use in electronics adhesives and process for their preparation |
| 02/21/1996 | CN1117205A Wiring structure of semiconductor device and method and method for manufacturing the same |
| 02/20/1996 | US5493476 Bus communication system for stacked high density integrated circuit packages with bifurcated distal lead ends |
| 02/20/1996 | US5493475 Cooling device for an integrated circuit |
| 02/20/1996 | US5493153 Plastic-packaged semiconductor device having a heat sink matched with a plastic package |
| 02/20/1996 | US5493152 Conductive via structure for integrated circuits and method for making same |
| 02/20/1996 | US5493151 Semiconductor device, lead frame and method for manufacturing semiconductor devices |
| 02/20/1996 | US5493150 For use in mounting an ic in an ic socket |
| 02/20/1996 | US5493148 Semiconductor device whose output characteristic can be adjusted by functional trimming |
| 02/20/1996 | US5493147 Antifuse circuit structure for use in a field programmable gate array and method of manufacture thereof |
| 02/20/1996 | US5493146 Anti-fuse structure for reducing contamination of the anti-fuse material |
| 02/20/1996 | US5493144 Field progammable device with contact openings |
| 02/20/1996 | US5493137 Semiconductor device |
| 02/20/1996 | US5492958 Formed from hydrogen silsesquioxane resin and metallic filler |
| 02/20/1996 | US5492866 Process for correcting warped surface of plastic encapsulated semiconductor device |
| 02/20/1996 | US5492865 Method of making structure for suppression of field inversion caused by charge build-up in the dielectric |
| 02/20/1996 | US5492653 Aqueous silver composition |
| 02/20/1996 | US5492586 Method for fabricating encased molded multi-chip module substrate |
| 02/20/1996 | US5492266 Fine pitch solder deposits on printed circuit board process and product |
| 02/20/1996 | US5492235 Process for single mask C4 solder bump fabrication |
| 02/20/1996 | US5492233 Manufacturing method for lead frame |
| 02/15/1996 | WO1996004682A1 Electronic circuit package |
| 02/15/1996 | WO1996004681A1 Direct chip attach |
| 02/15/1996 | WO1996004611A1 Production of a support element module for embedding into smart cards or other data carrier cards |
| 02/15/1996 | WO1996004516A1 Microcomponent sheet architecture |