Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/1996
03/19/1996US5500785 Circuit board having improved thermal radiation
03/19/1996US5500560 Semiconductor device having low resistance values at connection points of conductor layers
03/19/1996US5500559 Semiconductor device and method for manufacturing the same
03/19/1996US5500558 Semiconductor device having a planarized surface
03/19/1996US5500557 Structure and method for fabricating integrated circuits
03/19/1996US5500556 Packaging structure for microwave circuit
03/19/1996US5500555 Multi-layer semiconductor package substrate with thermally-conductive prepeg layer
03/19/1996US5500553 Semiconductor device having polysilicon resistors with a specific resistance ratio resistant to manufacturing processes
03/19/1996US5500544 Dynamic random access memory cell and method for fabricating the same
03/19/1996US5500395 Method for manufacturing an aluminum nitride sintered body
03/19/1996US5500392 Planar process using common alignment marks for well implants
03/19/1996US5500382 Self-aligned contact process
03/19/1996US5500301 Optical recording media
03/19/1996US5500294 Modified acrylonitrile-butadiene copolymer
03/19/1996US5500280 Elastomer-based connector sheet
03/19/1996US5500278 Used for hybrid integrated circuit
03/19/1996US5500080 Self-alignment, semiconductors, integrated circuits with conduction wiring
03/19/1996US5499929 Socket connector for electronic devices
03/19/1996US5499668 Process for making electronic device
03/19/1996US5499450 Method of manufacturing a multiple pin heatsink device
03/19/1996US5499445 Method of making a multi-layer to package
03/14/1996WO1996008129A1 Device for removing heat dissipated by an electronic or electro-mechanical component
03/14/1996WO1996008037A1 Printed circuit substrate having unpackaged integrated circuit chips directly mounted thereto and method of manufacture
03/14/1996WO1996007985A1 Radio frequency circuit and memory in thin flexible package
03/14/1996WO1996007983A1 Support element
03/14/1996WO1996007982A1 Circuit with a chip card module and a coil connected therewith
03/14/1996WO1996007686A1 Epoxy resin mixtures for prepregs and composites
03/14/1996WO1996007684A1 Epoxy resin mixtures for prepregs and composites
03/14/1996WO1996007662A1 Novel acylphosphine oxides
03/14/1996DE4446533C1 Ceramic composites prodn. with improved interlayer adhesion
03/14/1996DE4432188A1 Halogen-free epoxy resin compsn. for electronics encapsulation
03/14/1996DE4432057A1 Vorrichtung zur Ableitung der thermischen Verlustleistung eines elektronischen oder elektromechanischen Bauelementes A device for dissipating the thermal power loss of an electronic or electromechanical component
03/14/1996DE19533291A1 Encapsulated h.f. semiconductor device contg. FET
03/14/1996DE19533272A1 Test contact e.g. for ball-grid array (BGA) type IC modules
03/14/1996CA2197787A1 Novel acylphosphine oxides
03/13/1996EP0701284A1 A semiconductor chip kerf clear method and resultant semiconductor chip and electronic module formed from the same
03/13/1996EP0701283A2 Semiconductor device with amorphous carbon layer and method of fabricating the same
03/13/1996EP0701282A2 Interconnect structure having reduced peak localized current density and method of fabricating an interconnect level in a semiconductor device
03/13/1996EP0701281A2 Substrate with bondable layer
03/13/1996EP0701280A2 Lead frame and process of producing it
03/13/1996EP0701279A1 An electronic package having active means to maintain its operating temperature constant
03/13/1996EP0701278A2 Semiconductor device and method for manufacturing same
03/13/1996EP0701277A2 Interconnection method using a porous insulator for line to line capacitance reduction
03/13/1996EP0701121A1 Method of evaluating siloxane used for forming insulation coating, coating fluid used for forming insulation coating, process for producing the fluid, process for forming insulation coating for semiconductor device, and process for producing semiconductor device by applying the above process
03/13/1996EP0700947A2 Epoxy resin composition and resin-encapsulated semiconductor device
03/13/1996EP0700752A1 Method of patterning a coating on a substrate
03/13/1996EP0700581A1 Process for the production of a seal providing mechanical strength between a substrate and a chip hybridized by beads on the substrate
03/13/1996EP0673547A4 Electronic package sealed with a dispensable adhesive.
03/13/1996EP0650658A4 Electronic package having controlled epoxy flow.
03/13/1996EP0452506B1 METHOD OF PRODUCING A FLEXIBLE CIRCUIT BOARD FOR MOUNTING IC's
03/13/1996CN1118566A Panel assembly structure capable of connecting wiring line with electrode at fine pitch and integrated circuit mounting tape and manufacturing method thereof
03/13/1996CN1118520A Method for forming muti-layered metallic wire
03/13/1996CN1118382A Process for producing metal-bonded-ceramic material or components, metal-bonded-ceramic material or components produced by that method, and electronic circuit substrates fabricated from said material
03/12/1996US5499160 High density integrated circuit module with snap-on rail assemblies
03/12/1996US5498970 Top load socket for ball grid array devices
03/12/1996US5498909 Semiconductor device and method of manufacturing such semiconductor device
03/12/1996US5498906 Capacitive coupling configuration for an intergrated circuit package
03/12/1996US5498905 Layered features for co-fired module integration
03/12/1996US5498903 Surface mountable integrated circuit package with integrated battery mount
03/12/1996US5498902 Semiconductor device and its manufacturing method
03/12/1996US5498901 Lead frame having layered conductive planes
03/12/1996US5498900 For use in radiation environments
03/12/1996US5498895 Process ESD protection devices for use with antifuses
03/12/1996US5498768 Process for forming multilayer wiring
03/12/1996US5498767 Method for positioning bond pads in a semiconductor die layout
03/12/1996US5498595 Intermetallics on substrates with superconductor layers and oxygen ions in plasma followed by heat treatment
03/12/1996US5498574 Process of fabricating semiconductor device having flattening stage for inter-level insulating layer without deterioration of device characteristics
03/12/1996US5498572 Contactors
03/12/1996US5498571 Method of manufacturing a semiconductor device having reliable multi-layered wiring
03/12/1996US5497547 Method and apparatus for cooling a molded-plastic integrated-circuit package
03/12/1996US5497545 Method of making electrical connections in the manufacture of wiring sheet assemblies
03/10/1996CA2153441A1 Radio frequency circuit and memory in thin flexible package
03/09/1996CA2157148A1 Epoxy resin composition and resin-encapsulated semiconductor device
03/07/1996WO1996007204A1 Ultra-thin composite package for integrated circuits
03/07/1996WO1996007198A2 A lead frame having layered conductive planes
03/07/1996DE4431606A1 Chip card module with copper coil on a carrier
03/07/1996DE4431604A1 Schaltungsanordnung mit einem Chipkartenmodul und einer damit verbundenen Spule Circuit arrangement having a smart card module and an associated coil
03/07/1996DE4430990A1 Residue removal from back of chips
03/07/1996DE19531975A1 Integrierte Mikrowellenschaltung und Verfahren zum Herstellen der integrierten Mikrowellenschaltung Microwave integrated circuit and method of manufacturing the microwave integrated circuit
03/06/1996EP0700100A2 Optocoupler package leadframe and method thereof
03/06/1996EP0700087A2 Semiconductor device and method of manufacturing the same
03/06/1996EP0700086A2 Integrated circuit package with improved heat dissipation
03/06/1996EP0700085A2 Lead frame and lead frame material
03/06/1996EP0700084A1 Device to fasten electronic devices to a heatsink and method of mounting to a printed circuit board
03/06/1996EP0700083A2 Aluminium alloy base semiconductor packages
03/06/1996EP0699670A2 Aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition
03/06/1996EP0390891B1 Method of forming holes in ceramic ic packages
03/05/1996US5497381 Bitstream defect analysis method for integrated circuits
03/05/1996US5497291 Power semiconductor device including terminal plates located between two substrates that functions as electrical connectors and mechanical supports
03/05/1996US5497034 IC wiring connecting method and apparatus
03/05/1996US5497033 Embedded substrate for integrated circuit modules
03/05/1996US5497032 Semiconductor device and lead frame therefore
03/05/1996US5497031 Semiconductor device having semiconductor chip with backside electrode
03/05/1996US5497030 Lead frame and resin-molded-type semiconductor device
03/05/1996US5497027 Multi-chip module packaging system
03/05/1996US5497025 Aluminum, titanium nitride
03/05/1996US5497024 GaAs MIS device
03/05/1996US5497022 Semiconductor device and a method of manufacturing thereof
03/05/1996US5497013 Semi-conductor chip having interdigitated gate runners with gate bonding pads
03/05/1996US5496971 Circuit arrangement for multilayer printed circuit board
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