Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/1996
04/03/1996EP0704898A2 Carrier film
04/03/1996EP0704897A2 Semiconductor device
04/03/1996EP0704896A2 Tape automated bonding type semiconductor device
04/03/1996EP0704895A2 Process for manufacturing semiconductor device and semiconductor wafer
04/03/1996EP0704893A2 Improved device planarity
04/03/1996EP0704889A2 Power semiconductors with monolithically integrated test resistor and its fabrication
04/03/1996EP0704888A2 Circuit structure with non-migrating silver contacts
04/03/1996EP0704887A2 A method and device for controlling tensile and compressive stresses and mechanical problems in thin films on substrates
04/03/1996EP0704811A2 Method and apparatus for use in simulation of electrical characteristics of electronic device
04/03/1996EP0704732A1 Integrated optoelectronic coupling and connector
04/03/1996EP0704289A1 Method for manufacturing thin plastic packages
04/03/1996EP0704092A1 Electronic memory device
04/03/1996CN1119788A Method and apparatus for a stress relieved electronic module
04/02/1996US5504653 Heat sinking assembly for electrical components
04/02/1996US5504652 Unitary heat sink for integrated circuits
04/02/1996US5504651 Cooling apparatus for electronic equipment
04/02/1996US5504650 Heat sink for cooling a heat producing element and application
04/02/1996US5504439 I/O interface cell for use with optional pad
04/02/1996US5504375 In a multilayer circuit
04/02/1996US5504373 Semiconductor memory module
04/02/1996US5504372 Adhesively sealed metal electronic package incorporating a multi-chip module
04/02/1996US5504370 Electronic system circuit package directly supporting components on isolated subsegments
04/02/1996US5504354 Interconnect substrate with circuits for field-programmability and testing of multichip modules and hybrid circuits
04/02/1996US5504043 Barrier layers and aluminum contacts
04/02/1996US5504042 Porous dielectric material with improved pore surface properties for electronics applications
04/02/1996US5504037 Method of forming optimized thin film metal interconnects in integrated circuit structures of apparatus to reduce circuit operational delay
04/02/1996US5504036 Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material provided on a support slice
04/02/1996US5503962 Chemical-mechanical alignment mark and method of fabrication
04/02/1996US5503882 Plasma oxide layer is placed between substrate upper surface and tetraethyl silicate oxide to reduce stress properties; spin-on-glass layer; capping layer to minimize water absorption
04/02/1996US5503777 Thixotropic conductive paste
04/02/1996US5503731 Second pair of electrodes to collect impurities; applying voltage so that at least one wiring line receives voltage for a different period of time than the others
04/02/1996US5503286 Depositing adhesive metallic layer overlying insulator, depositing chromium copper alloy layer, depositing solder bondable metallic layer, forming solder, etching using solder as mask, selectively etching adhesion layer
04/02/1996US5503122 Engine components including ceramic-metal composites
04/02/1996US5503016 Transducer assembly
04/02/1996CA2058672C Semiconductor device for improving high-frequency characteristics and avoiding chip cracking
04/02/1996CA2046615C A method of manufacturing a substrate for placement of electrical and/or electronic components
03/1996
03/31/1996CA2254329A1 Process for manufacturing semiconductor device and semiconductor wafer
03/28/1996WO1996009746A1 Compliant interface for a semiconductor chip
03/28/1996WO1996009744A2 Method and apparatus for filling a ball grid array
03/28/1996WO1996009647A1 Process for contacting an electronic component on a substrate
03/28/1996WO1996009646A1 Polymer stud grid array
03/28/1996WO1996009645A1 Semiconductor device and its mounting structure
03/28/1996WO1996009644A1 Container for ic trays, and base plate for mounting the container
03/28/1996WO1996008951A2 Downhole system
03/28/1996DE4433689A1 Large-area chip configuration with cavities in plastics package
03/28/1996DE19535282A1 Connecting electronic component to substrate with several contact faces
03/28/1996CA2199936A1 Method and apparatus for filling a ball grid array
03/27/1996EP0703624A1 Programable element in barrier metal device and method
03/27/1996EP0703617A2 High frequency monolithic integrated circuit
03/27/1996EP0703616A1 Manufacturing process of a marking on a semiconductor wafer comprising a buried structure
03/27/1996EP0703615A1 Tape carrier for increasing the number of terminals between the tape carrier and a substrate
03/27/1996EP0703614A2 Flip-clip with heat-conducting layer
03/27/1996EP0703613A2 Protecting electronic components in acidic and basic environments
03/27/1996EP0703612A1 Method for electrically insulating heat sinus in electronic power devices
03/27/1996EP0703611A1 Method for insulating metal leads using a low dielectric constant material, and structures formed therewith
03/27/1996EP0703610A1 Method of forming interconnection structures in a semiconductor device, using insulators made of porous dielectric materials, and structures thereby formed
03/27/1996EP0702847A1 Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board
03/27/1996EP0702618A1 Method and apparatus for producing ceramic-based electronic components
03/27/1996CN1119346A Semiconductor device and method for fabricating the same
03/27/1996CN1119342A Electronic package with multilevel connections
03/27/1996CN1031446C Making method for multi-layer electronic circuit
03/27/1996CN1031436C Manufacturing method of semiconductor device
03/26/1996US5502649 Method and apparatus for determining power supply wirings of a semiconductor device
03/26/1996US5502621 Mirrored pin assignment for two sided multi-chip layout
03/26/1996US5502619 Heat sink assembly for computer chips
03/26/1996US5502398 Semiconductor device burn-in apparatus
03/26/1996US5502337 Semiconductor device structure including multiple interconnection layers with interlayer insulating films
03/26/1996US5502336 Semiconductor device and manufacturing method thereof
03/26/1996US5502335 Semiconductor device with wiring layer
03/26/1996US5502334 Electroconductive adhesive, semiconductors
03/26/1996US5502333 Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit
03/26/1996US5502326 Semiconductor device provided having a programmable element with a high-conductivity buried contact region
03/26/1996US5502324 Semiconductor memory device
03/26/1996US5502323 Lateral type field effect transistor
03/26/1996US5502315 Electrically programmable interconnect structure having a PECVD amorphous silicon element
03/26/1996US5502289 Circuit assembly
03/26/1996US5502278 Encased electronic circuit with chip on a grid zone of conductive contacts
03/26/1996US5502007 Method of forming flat surface of insulator film of semiconductor device
03/26/1996US5502005 Production method of semiconductor device having a wiring layer containing gold
03/26/1996US5502004 Method for manufacturing a semiconductor device with heat treated diffusion layers
03/26/1996US5502002 Polyimide passivation of GaAs microwave monolithic integrated circuit flip-chip
03/26/1996US5502000 Method of forming a antifuse structure with increased breakdown at edges
03/26/1996US5501995 Method for manufacturing a gate electrode of a MOS transistor
03/26/1996US5501767 Method for gettering noble metals from mineral acid solution
03/26/1996US5501006 Method for connection of signals to an integrated circuit
03/26/1996US5501003 Method of assembling electronic packages for surface mount applications
03/26/1996CA2074975C Constant impedance transition between transmission structures of different dimensions
03/21/1996WO1996008842A1 Electronic system circuit package
03/21/1996WO1996008841A1 A high density integrated circuit assembly combining leadframe leads with conductive traces
03/21/1996DE4434382A1 Encapsulating or sealing microelectronic hybrid semiconductor circuits
03/21/1996DE19534469A1 Integrated circuit module terminal contact configuration for esp. BGA or PGA
03/20/1996EP0702408A2 Package for mounting a semiconductor device
03/20/1996EP0702407A2 Wiring pattern of semiconductor integrated circuit device
03/20/1996EP0702406A2 Press-contact type semiconductor devices
03/20/1996EP0702405A1 A pneumatically coupled heat sink assembly
03/20/1996EP0702404A2 Semiconductor device
03/20/1996EP0702402A1 Manufacturing method for integrated circuits and semiconductor wafer so obtained
03/20/1996EP0702379A1 Electronic and/or magnetic devices
03/20/1996EP0540519B1 Method for making a thermal compression bond
03/20/1996CN1118910A Radio frequency circuit and memory in thin flexible package
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