| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/17/1996 | EP0707341A1 Integrated circuit die comprising of metal patterns at the corners |
| 04/17/1996 | EP0707340A2 Fabrication and structures of circuit modules with flexible interconnect layers |
| 04/17/1996 | EP0707042A1 Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same |
| 04/17/1996 | EP0642703B1 Electric machine with semiconductor valves |
| 04/17/1996 | EP0597052B1 Transport robot for a machining or processing line for lead frames |
| 04/17/1996 | CN1120737A Semiconductor module with low inductance power |
| 04/17/1996 | CN1120736A Method and apparatus for directly joining a chip to a heat sink |
| 04/17/1996 | CN1120735A Thermally activated noise immune fuse |
| 04/17/1996 | CN1120734A 半导体封装及引线框架 Semiconductor package and leadframe |
| 04/16/1996 | US5508938 Special interconnect layer employing offset trace layout for advanced multi-chip module packages |
| 04/16/1996 | US5508888 Electronic component lead protector |
| 04/16/1996 | US5508884 System for dissipating heat energy generated by an electronic component and sealed enclosure used in a system of this kind |
| 04/16/1996 | US5508883 Air mixer cool plate |
| 04/16/1996 | US5508740 Solid-state imaging device having temperature sensor |
| 04/16/1996 | US5508565 Semiconductor device having a plurality of chips having identical circuit arrangement sealed in package |
| 04/16/1996 | US5508564 Semiconductor device having an improved packing density and high reliability |
| 04/16/1996 | US5508563 Semiconductor assembly having laminated semiconductor devices |
| 04/16/1996 | US5508561 Apparatus for forming a double-bump structure used for flip-chip mounting |
| 04/16/1996 | US5508560 Semiconductor module |
| 04/16/1996 | US5508559 Power circuit package |
| 04/16/1996 | US5508558 High density, high speed, semiconductor interconnect using-multilayer flexible substrate with unsupported central portion |
| 04/16/1996 | US5508557 Intended to be mounted on a circuit board |
| 04/16/1996 | US5508556 Leaded semiconductor device having accessible power supply pad terminals |
| 04/16/1996 | US5508476 Mounting arrangement for semiconductor devices |
| 04/16/1996 | US5508234 Microcavity structures, fabrication processes, and applications thereof |
| 04/16/1996 | US5508232 Method of manufacturing a semiconductor device |
| 04/16/1996 | US5508230 Method for making a semiconductor device with diamond heat dissipation layer |
| 04/16/1996 | US5508228 Coating a polymer on a substrate, coating bump with metallization layer, curing the polymer and etching the bump pattern from polymer material, overcoating a ductile gold metal on polymer bump |
| 04/16/1996 | US5508220 Method of forming antifuses having minimum areas |
| 04/16/1996 | US5508089 Multiple substrate and process for its production |
| 04/16/1996 | US5507092 L-type heat sink |
| 04/16/1996 | US5507085 Method and apparatus for automatically placing lids on component packages |
| 04/16/1996 | CA2028244C Aluminum nitride powder, sintered body and production thereof |
| 04/11/1996 | WO1996010902A1 An electromechanical press and method therefor |
| 04/11/1996 | WO1996010841A1 Global signal net |
| 04/11/1996 | DE4435579A1 Method for checking adhesive bond strength of chip carrier to card |
| 04/11/1996 | DE19537337A1 Integrated, microwave-semiconductor circuit |
| 04/11/1996 | DE19522660A1 Semiconductor isolated contact hole for submicron applications, e.g. DRAM |
| 04/10/1996 | EP0706265A2 Current detector circuit |
| 04/10/1996 | EP0706221A2 Semiconductor device comprising a plurality of semiconductor elements |
| 04/10/1996 | EP0706220A1 Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging |
| 04/10/1996 | EP0706219A1 Method and apparatus for a stress relieved electronic module |
| 04/10/1996 | EP0706217A2 IC contacts having improved electromigration characteristics and fabrication methods therefor |
| 04/10/1996 | EP0706216A2 Interlayer dielectric structure for semiconductor device |
| 04/10/1996 | EP0706215A2 Improvements in or relating to semiconductor devices and their manufacture |
| 04/10/1996 | EP0706214A2 Electronic module and chip card |
| 04/10/1996 | EP0706213A2 Single layer leadframe design with groundplane capability |
| 04/10/1996 | EP0706212A2 Heat sink fin assembly for an LSI package |
| 04/10/1996 | EP0706211A2 Connection structure for bilayers |
| 04/10/1996 | EP0706208A2 Semiconductor package integral with semiconductor chip and method of manufacturing thereof |
| 04/10/1996 | EP0706207A2 Process to reduce the surface recombination rate in silicon |
| 04/10/1996 | EP0705856A2 Epoxy resin composition for semiconductor encapsulation |
| 04/10/1996 | EP0705529A1 Method and apparatus for non-conductively interconnecting integrated circuits |
| 04/10/1996 | EP0705485A1 Electrically and thermally enhanced package using a separate silicon substrate |
| 04/10/1996 | EP0705484A2 Method of manufacturing a device whereby a support bar is provided with conductor tracks for electrically contacting a semiconductor element |
| 04/10/1996 | EP0539555B1 Arrangement for encasing a functional device, and a process for the production of same |
| 04/10/1996 | EP0433294B1 Method of producing a semiconductor device incorporating a superconductor |
| 04/10/1996 | EP0332658B1 Enhanced density modified isoplanar process |
| 04/10/1996 | CN2224464Y Double-side colling device for high-power silicon controlled rectifier |
| 04/10/1996 | CN1120242A Method and apparatus for transversly access of frame of IC guided line |
| 04/10/1996 | CN1120241A Refractory metal capped low resistivity metal conductor lines and vias formed using PVD and CVD |
| 04/10/1996 | CN1120051A Epoxy resin molding material for sealing electronic parts and sealed semiconductor device using the same |
| 04/09/1996 | US5506991 Printer port adapter with overlaid one-wire interface for electronic key |
| 04/09/1996 | US5506756 Tape BGA package die-up/die down |
| 04/09/1996 | US5506755 Multi-layer substrate |
| 04/09/1996 | US5506753 Method and apparatus for a stress relieved electronic module |
| 04/09/1996 | US5506752 Apparatus for cooling an integrated circuit chip |
| 04/09/1996 | US5506499 Multiple probing of an auxilary test pad which allows for reliable bonding to a primary bonding pad |
| 04/09/1996 | US5506452 Power semiconductor component with pressure contact |
| 04/09/1996 | US5506451 Flip-chip semiconductor devise having an electrode pad covered with non-metal member |
| 04/09/1996 | US5506450 Semiconductor device with improved electromigration resistance and method for making the same |
| 04/09/1996 | US5506449 Interconnection structure for semiconductor integrated circuit and manufacture of the same |
| 04/09/1996 | US5506448 Semiconductor integrated circuit device having an improved packaging structure |
| 04/09/1996 | US5506447 Hybrid integrated circuit |
| 04/09/1996 | US5506446 Electronic package having improved wire bonding capability |
| 04/09/1996 | US5506444 Tape carrier semiconductor device |
| 04/09/1996 | US5506443 Distributed quantity of carbon or fluorine at interface |
| 04/09/1996 | US5506428 Gate array LSI |
| 04/09/1996 | US5506425 Semiconductor device and lead frame combination |
| 04/09/1996 | US5506383 Wafer scale multi-chip module |
| 04/09/1996 | US5506177 Fabrication process for multilevel interconnections in a semiconductor device |
| 04/09/1996 | US5506174 Automated assembly of semiconductor devices using a pair of lead frames |
| 04/09/1996 | US5506172 Semiconductor processing method of forming an electrical interconnection between an outer layer and an inner layer |
| 04/09/1996 | US5506162 Method of producing a semiconductor integrated circuit device using a master slice approach |
| 04/09/1996 | US5506058 Mutlilayer glass ceramic substrate and method of fabricating the same |
| 04/09/1996 | US5504986 Method of manufacturing collinear terminated transmission line structure with thick film circuitry |
| 04/09/1996 | CA2065537C Process for manufacturing multi-layer glass ceramic substrate |
| 04/09/1996 | CA2043172C Method and structure for interconnecting different polysilicon zones on semi-conductor substrates for integrated circuits |
| 04/04/1996 | WO1996010326A1 Printed wiring board, method of producing the same and electronic devices |
| 04/04/1996 | WO1996010267A1 High voltage lateral dmos device with enhanced drift region |
| 04/04/1996 | WO1996010265A1 Chip packaging technique |
| 04/04/1996 | WO1996010046A1 Milled carbon fiber reinforced polymer composition |
| 04/04/1996 | DE4441898C1 Semiconductor component with electrically conductive contacts and/or tracks |
| 04/04/1996 | DE4435120A1 Protective coating for wafers used in prodn. of chips etc |
| 04/04/1996 | DE4435115A1 Lead on chip system using multi-layer tape |
| 04/04/1996 | DE4434846A1 Ceramic mould for mfr. of electronic circuits or heat-sink structures |
| 04/03/1996 | EP0704905A2 Silicon semiconductor device with junction breakdown prevention |
| 04/03/1996 | EP0704901A1 Tolerant integrated circuit to great manufacturing faults |
| 04/03/1996 | EP0704900A2 Film carrier semiconductor device |
| 04/03/1996 | EP0704899A2 Method of manufacturing chip-size package-type semiconductor device |