| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 05/01/1996 | EP0710058A2 Inhibiting short-circuits between electrically conductive paths |
| 05/01/1996 | EP0709897A1 Semiconductor device |
| 05/01/1996 | EP0709888A2 Low inductance conductor topography for MOSFET circuit |
| 05/01/1996 | EP0709887A2 An interconnect structure using Al2Cu for an integrated circuit chip |
| 05/01/1996 | EP0709886A1 Anisotropic film conductor for microconnections |
| 05/01/1996 | EP0709885A2 Circuit pack with integrated closed-loop cooling system |
| 05/01/1996 | EP0709884A2 Microelectronic device having a package with internal ducting for the passage of cooling fluid |
| 05/01/1996 | EP0709883A1 Semiconductor package fabricated by using tape automated bonding |
| 05/01/1996 | EP0709882A2 Semiconductor device with passivation layer made out of benzocyclobutene polymer and silicon powder |
| 05/01/1996 | EP0709817A1 Marking tag to be fastened to an electrical or electronical component by snap-fitting |
| 05/01/1996 | EP0709804A1 Process of fabricating contactless cards |
| 05/01/1996 | EP0709682A1 Electronic device enclosure including a conductive cap and substrate |
| 05/01/1996 | EP0708985A1 Apparatus for encapsulating with plastic a lead frame with chips |
| 05/01/1996 | EP0568692B1 Power fet with shielded channels |
| 05/01/1996 | CN1121649A Contacting system for electrical devices |
| 05/01/1996 | CN1121642A Fabricating method for semiconductor device having a double-layered silicide structure |
| 05/01/1996 | CN1121499A Metallized ceramic substrate having smooth plating layer and method for producing the same |
| 05/01/1996 | CA2161823A1 Circuit pack with integrated closed loop cooling system |
| 05/01/1996 | CA2161153A1 Low inductance conductor topography for mosfet circuit |
| 05/01/1996 | CA2160495A1 Closed loop liquid circuit pack cooling |
| 04/30/1996 | US5513072 Power module using IMS as heat spreader |
| 04/30/1996 | US5512786 Package for housing semiconductor elements |
| 04/30/1996 | US5512785 Semiconducter device having an emitter terminal separated from a base terminal by a composite nitride/oxide layer |
| 04/30/1996 | US5512784 Surge protector semiconductor subassembly for 3-lead transistor aotline package |
| 04/30/1996 | US5512783 Semiconductor chip packages |
| 04/30/1996 | US5512781 Semiconductor package device for super high-frequency band |
| 04/30/1996 | US5512780 Inorganic chip-to-package interconnection circuit |
| 04/30/1996 | US5512779 Semiconductor memory device having silicon nitride overlying only peripheral circuit areas |
| 04/30/1996 | US5512778 Semicondcutor device with improved contact |
| 04/30/1996 | US5512776 Interdigitated IMPATT devices |
| 04/30/1996 | US5512775 Semiconductor device |
| 04/30/1996 | US5512711 Multilayer ceramic substrates |
| 04/30/1996 | US5512710 For an electronic device |
| 04/30/1996 | US5512628 Adhesive tape for electronic parts and liquid adhesive |
| 04/30/1996 | US5512613 Cured composition comprising reaction product of diepoxide having acetal linkages, cyclic dicarboxylic anhydride curing agent, 1,3-diaza compound, hydroxy functional initiator; removable in acidic solvents |
| 04/30/1996 | US5512516 Contact structure for connecting an electrode to a semiconductor device and a method of forming the same |
| 04/30/1996 | US5512515 Reacting mixture of tri(or di-)alkyl aluminum compounds, copper complexes and mono-, di- or tri-silanes near heated substrate surface yields smooth, uniform thin film |
| 04/30/1996 | US5512513 Method of fabricating semiconductor device with water protective film |
| 04/30/1996 | US5512512 Contact hole filling in a semiconductor device by irradiation with plasma of inert gas ions |
| 04/30/1996 | US5512508 Method and apparatus for improvement of interconnection capacitance |
| 04/30/1996 | US5512397 Stepper scanner discretionary lithography and common mask discretionary lithography for integrated circuits |
| 04/30/1996 | US5512353 Conductive layers of copper or an alloy containing copper; ceramic layers comprise a complex oxide or an oxide solid solution containing copper |
| 04/30/1996 | US5512154 Apparatus for selectively electroplating apertured metal or metallized products |
| 04/30/1996 | US5512147 Method of making an electrolyte for an electrochemical cell |
| 04/25/1996 | WO1996012299A1 Integrated circuit package |
| 04/25/1996 | WO1996012298A1 Thin cavity down ball grid array package based on wirebond technology |
| 04/25/1996 | WO1996012296A1 Semiconductor device and its manufacture |
| 04/25/1996 | WO1996012295A1 A novel via hole profile and method of fabrication |
| 04/25/1996 | WO1996012050A1 Method of manufacturing a thin silicon-oxide layer |
| 04/25/1996 | WO1996011895A1 Method of treating an anti-reflective coating on a substrate |
| 04/25/1996 | DE4437794A1 Power semiconductor element, e.g. MOSFET, IGBT, with integrated temp. sensor |
| 04/25/1996 | DE4437461A1 Integrated temp. sensor using MOSFETs |
| 04/25/1996 | DE19538664A1 Tiefstkältetechnische Vorrichtung für eine optronische und/oder elektronische Einrichtung und für Einrichtungen, die eine derartige Vorrichtung enthalten Tiefstkältetechnische device for an optronic and / or electronic device and equipment containing such a device |
| 04/25/1996 | DE19529645A1 Alignment precision measuring mark for e.g. MOS transistor |
| 04/24/1996 | EP0708584A1 Socket for electrical device |
| 04/24/1996 | EP0708582A1 Electrically conductive paste materials and applications |
| 04/24/1996 | EP0708515A1 Protective circuit for protecting load against excessive input voltage |
| 04/24/1996 | EP0708481A2 Improved flip chip high power monolithic integrated circuit thermal bumps and fabrication method |
| 04/24/1996 | EP0707952A1 Ceramic multilayered composite, process for its preparation and module |
| 04/24/1996 | EP0707743A1 Lead frame including an inductor or other such magnetic component |
| 04/24/1996 | EP0707742A1 Interconnect structures for integrated circuits |
| 04/24/1996 | EP0707741A1 Surface mount and flip chip technology |
| 04/24/1996 | EP0544915B1 Package structure of semiconductor device and manufacturing method therefor |
| 04/24/1996 | CN2225721Y Light emitting diode with adapting base |
| 04/24/1996 | CN1121261A Lead frame and semiconductor device |
| 04/23/1996 | US5510958 Electronic circuit module having improved cooling arrangement |
| 04/23/1996 | US5510956 Electronic part unit or assembly having a plurality of electronic parts enclosed within a metal enclosure member mounted on a wiring layer |
| 04/23/1996 | US5510758 Multilayer microstrip wiring board with a semiconductor device mounted thereon via bumps |
| 04/23/1996 | US5510655 Silicon wafers containing conductive feedthroughs |
| 04/23/1996 | US5510654 Semiconductor device and method of fabricating same |
| 04/23/1996 | US5510653 Semiconductor device including silicon ladder resin layer |
| 04/23/1996 | US5510652 Polishstop planarization structure |
| 04/23/1996 | US5510651 Semiconductor device having a reducing/oxidizing conductive material |
| 04/23/1996 | US5510650 Low mechanical stress, high electrical and thermal conductance semiconductor die mount |
| 04/23/1996 | US5510649 Ceramic semiconductor package having varying conductive bonds |
| 04/23/1996 | US5510646 Titanium, tungsten intermetallic |
| 04/23/1996 | US5510645 Semiconductor structure having an air region and method of forming the semiconductor structure |
| 04/23/1996 | US5510629 Multilayer antifuse with intermediate spacer layer |
| 04/23/1996 | US5510446 Heating primary reaction mixture in presence of strong acid; vacuum concentration or steam distillation |
| 04/23/1996 | US5510298 Method of interconnect in an integrated circuit |
| 04/23/1996 | US5510296 Manufacturable process for tungsten polycide contacts using amorphous silicon |
| 04/23/1996 | US5510293 Method of making reliable metal leads in high speed LSI semiconductors using thermoconductive layers |
| 04/23/1996 | US5510292 Vapor phase etching of tungsten nitride film using a fluorine compound |
| 04/23/1996 | US5510197 Lead frame material and lead frame for semiconductor device |
| 04/23/1996 | US5510189 Adhesive tape for electronic parts and liquid adhesive |
| 04/23/1996 | US5510139 Process for assembly and bonding of electronic components on an insulating support |
| 04/23/1996 | US5510138 Formulating hot melt coating composition which is solid or semisolid at room temperature, heating to melt, depositing on substrate, allowing to cool and solidify to form conformal protective coating |
| 04/23/1996 | US5510074 Injection molding thermoplastic |
| 04/23/1996 | US5509465 Heat-dissipating device for a central processing unit chip |
| 04/23/1996 | US5509203 Method for manufacturing a sheet formed connector for inspection of an integrated circuit |
| 04/23/1996 | US5509200 Method of making laminar stackable circuit board structure |
| 04/21/1996 | CA2159234A1 Electrically conductive paste materials and applications |
| 04/19/1996 | CA2160740A1 Socket for electronic device |
| 04/18/1996 | WO1996003772A3 Method of manufacturing a semiconductor device for surface mounting, and semiconductor device for surface mounting |
| 04/18/1996 | DE4437035A1 Method and appts. for producing thin, metallic structures on insulating carrier materials |
| 04/18/1996 | DE4436644A1 Prodn. of metallised ceramic substrate printed circuit board |
| 04/18/1996 | DE19538050A1 Thin film field effect transistor for liquid crystal display |
| 04/18/1996 | DE19538019A1 Verfahren zur Bildung einer Metallverdrahtung einer Halbleitereinrichtung A method of forming a metal wiring of a semiconductor device |
| 04/18/1996 | DE19537358A1 Integrated circuit holding and transport support |
| 04/18/1996 | DE19514908C1 Large scale solar panels for building and vehicles |