Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1996
05/21/1996US5518674 Method of forming thin film flexible interconnect for infrared detectors
05/21/1996US5518071 Heat sink apparatus
05/21/1996US5517756 Method of making substrate member having electrical lines and apertured insulating film
05/21/1996US5517753 Adjustable spacer for flat plate cooling applications
05/21/1996US5517751 Multilayer microelectronic wiring module and method for forming the same
05/17/1996WO1996014665A1 Ballast monitoring for radio frequency power transistors
05/17/1996WO1996014662A1 Microelectronic integrated circuit structure and method using three directional interconnect routing based on hexagonal geometry
05/17/1996WO1996014661A1 Spacer-based antifuse structure for low capacitance and high reliability and method of fabrication thereof
05/17/1996WO1996014659A1 Method for forming contact pins for semiconductor dice and interconnects
05/17/1996WO1996014657A1 Integrated circuit passivation process and structure
05/17/1996WO1996009744A3 Method and apparatus for filling a ball grid array
05/17/1996CA2204382A1 Ballast monitoring for radio frequency power transistors
05/15/1996EP0712160A2 Improvements in or relating to semiconductor devices
05/15/1996EP0712159A2 Structure of resin molded type semiconductor
05/15/1996EP0712158A2 Resin sealing type semiconductor device with cooling member and method of making the same
05/15/1996EP0712157A2 Semiconductor chip package with enhanced thermal conductivity
05/15/1996EP0712156A2 Process for producing multilevel metallization in an integrated circuit
05/15/1996EP0712153A2 Packaging electrical circuits
05/15/1996EP0712142A2 Electronic thick film component multiple terminal and method of making the same
05/15/1996EP0712137A2 Programmable semiconductor memory
05/15/1996EP0711738A2 Ceramic green sheet and method for producing ceramic substrate
05/15/1996EP0711456A1 Coated bonding wires in high lead count packages
05/15/1996EP0555407B1 Stacked configuration for integrated circuit devices
05/15/1996CN2227378Y Separation type mult-hole cooling conducting line
05/15/1996CN1122517A Producing method of semiconductor diode with laminar material strecture
05/14/1996US5517127 Additive structure and method for testing semiconductor wire bond dies
05/14/1996US5517107 On-chip variance detection for integrated circuit devices
05/14/1996US5517060 Semiconductor device having improved backing conductive layers
05/14/1996US5517058 Semiconductor package and method with vertically extended electrode leads
05/14/1996US5517057 Electronic modules with interconnected surface metallization layers
05/14/1996US5517056 Molded carrier ring leadframe having a particular resin injecting area design for gate removal and semiconductor device employing the same
05/14/1996US5517055 Input-output drive reduction in a semiconductor integrated circuit
05/14/1996US5517046 High voltage lateral DMOS device with enhanced drift region
05/14/1996US5517042 Semiconductor device having multi-level wiring structure
05/14/1996US5517040 Personalizable semiconductor chips for analog and analog/digital circuits
05/14/1996US5517015 Communication module
05/14/1996US5516874 Used between layers in electronic packaging with polyimides and copper
05/14/1996US5516838 Flame retardant silicone compositions
05/14/1996US5516726 Method of manufacturing local interconnection for semiconductors
05/14/1996US5516725 Contact alloy having capacity when in combination with a substrate compound to exist as a two phase binary equilibrium reciprocal system; sputtering; annealing
05/14/1996US5516705 Method of forming four layer overvoltage protection device
05/14/1996US5516596 A coating of hydrogen silsesquisiloxane resin on refractory fibers, heat treatment to form ceramics
05/14/1996US5516031 Soldering method and apparatus for use in connecting electronic circuit devices
05/14/1996US5515984 Method for etching PT film
05/14/1996US5515912 Cooling apparatus of electronic devices
05/09/1996WO1996013858A2 Integrated microwave semiconductor device with active and passive components
05/09/1996WO1996013857A1 Stable high voltage semiconductor device structure
05/09/1996WO1996013856A1 Layered low dielectric constant technology
05/09/1996WO1996013855A1 A leadframe for an integrated circuit package which electrically interconnects multiple integrated circuit die
05/09/1996WO1996013854A1 Thermally and electrically enhanced plastic pin grid array (ppga) package
05/09/1996WO1996013853A1 Coating solution comprising siloxane polymer and process for producing the same
05/09/1996WO1996013350A1 Heat sink and method of fabricating
05/09/1996DE19540894A1 Verfahren zur Verhinderung der Absorption von Feuchtigkeit in eine Störstellen enthaltende Isolationsschicht A method for preventing absorption of moisture in an impurity-containing insulating layer
05/08/1996EP0711104A1 Packaged semiconductor, semiconductor device made therewith and method for making same
05/08/1996EP0710987A1 An image sensor
05/08/1996EP0710982A2 Personalized area leadframe coining or half etching for reduced mechanical stress at device edge
05/08/1996EP0710981A2 Improvements in or relating to electronic devices
05/08/1996EP0710432A1 Process for manufacturing printed circuit foils or semifinished products for printed circuit foils, and thus manufactured printed circuit foils and semifinished products
05/08/1996EP0710430A1 Processing low dielectric constant materials for high speed electronics
05/08/1996EP0710401A1 Tamper resistant integrated circuit structure
05/08/1996EP0710400A1 Structures for preventing reverse engineering of integrated circuits
05/08/1996EP0710178A1 Conformal thermally conductive interface material
05/08/1996CN1122167A Package for electronic element
05/08/1996CN1122052A Semiconductor packaging and the method of production thereof
05/07/1996US5515452 Optical character recognition illumination method and system
05/07/1996US5515232 Static protection circuit for a semiconductor integrated circuit device
05/07/1996US5514974 Test device and method for signalling metal failure of semiconductor wafer
05/07/1996US5514913 Resin-encapsulated semiconductor device having improved adhesion
05/07/1996US5514912 Method for connecting semiconductor material and semiconductor device used in connecting method
05/07/1996US5514911 Highly integrated semiconductor device contact structure
05/07/1996US5514910 Semiconductor device having multi-level interconnection structure
05/07/1996US5514909 Aluminum alloy electrode for semiconductor devices
05/07/1996US5514908 Semiconductors
05/07/1996US5514906 Apparatus for cooling semiconductor chips in multichip modules
05/07/1996US5514905 Semiconductor device
05/07/1996US5514900 In an integrated circuit
05/07/1996US5514895 Semiconductor integrated circuit device
05/07/1996US5514885 Charge coupled device
05/07/1996US5514838 Circuit structure with non-migrating silver contacts
05/07/1996US5514832 Microcavity structures, fabrication processes, and applications thereof
05/07/1996US5514627 Increasing the resistance of a light emitting diode and other semiconductor devices to extremes of temperature
05/07/1996US5514623 Method of making layout design to eliminate process antenna effect
05/07/1996US5514606 Formation of stable source, drain and gate contacts while eliminating critical processing steps
05/07/1996US5514475 Heat-resistant electrical insulating layer
05/07/1996US5514451 Conductive via fill inks for ceramic multilayer circuit boards on support substrates
05/07/1996US5514449 Interconnect substrate comprising a metal-polymer composite incorporating microelectronic circuitry
05/07/1996US5514334 Workable, stable
05/07/1996US5514327 Copper posts which fit together with posts of another structure
05/07/1996US5514242 Depositing multiple layers of diamond having different thermal conductivities and mounting an electronic component thereon
05/02/1996WO1996013142A1 Cooler for electrical subassemblies
05/02/1996WO1996013066A1 Method of attaching integrated circuit dies by rolling adhesives onto semiconductor wafers
05/02/1996WO1996013062A1 Apparatus and method of manufacturing stacked wafer array
05/02/1996WO1996013059A2 Hermetically sealed microwave integrated circuit package with ground plane fused to package frame
05/02/1996WO1996013056A2 Hermetically sealed hybrid ceramic integrated circuit package
05/02/1996WO1996013055A2 Plastic encapsulation of ic device by two level epoxy encapsulation
05/02/1996WO1996013054A2 Integrated circuit package and method of making the same
05/02/1996WO1996012924A1 Piezoelectric cooling device
05/02/1996WO1996012752A2 Curable epoxy resin accelerated by boric acid and its analogs
05/02/1996DE4437971A1 Kühleinrichtung für elektrische Baugruppen Cooling device for electrical assemblies
05/02/1996DE4345203C2 Semiconductor device with improved operational speed
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