Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/1996
05/29/1996EP0714132A2 System and method for manufacturing gate oxide capacitors including wafer backside dielectric and implantation electron flood gun current control, and gate oxide capacitor made by same
05/29/1996EP0714131A1 Inductive signal transfer device between the chip layers of a vertical integrated circuit
05/29/1996EP0714130A1 Capacitive signal transfer device between the chip layers of a vertical integrated circuit
05/29/1996EP0714129A2 Semiconductor device
05/29/1996EP0714128A2 Improvements in and relating to integrated circuits
05/29/1996EP0714127A2 Semiconductor package
05/29/1996EP0714126A1 Compliant layer metallization
05/29/1996EP0714125A2 Semiconductor device and fabrication method
05/29/1996EP0714124A2 Method for bonding a first substrate to a second substrate and application of the method to the fabrication of a three dimensional circuit device
05/29/1996EP0713930A1 Aqueous silver composition
05/29/1996CN1123514A Laminar stackable circuit board structure and manufacture
05/29/1996CN1123469A 半导体器件 Semiconductor devices
05/29/1996CN1123468A Attaching heat sinks directly to chip carrier modules using flexible-epoxy
05/29/1996CN1031912C Base board of circuit
05/28/1996US5521440 Antifuse structure in an integrated circuit
05/28/1996US5521439 Combination and method for coupling a heat sink to a semiconductor device
05/28/1996US5521438 Having stress relief layer of soft metal
05/28/1996US5521437 Semiconductor power module having an improved composite board and method of fabricating the same
05/28/1996US5521436 Semiconductor device with a foil-sealed lid
05/28/1996US5521435 Semiconductor device and a fabrication process thereof
05/28/1996US5521433 IC card including a substrate having improved strength and heat radiation properties
05/28/1996US5521432 Semiconductor device having improved leads comprising palladium plated nickel
05/28/1996US5521431 Semiconductor device with lead frame of molded container
05/28/1996US5521430 Semiconductor apparatus and its manufacturing method
05/28/1996US5521429 Surface-mount flat package semiconductor device
05/28/1996US5521428 Flagless semiconductor device
05/28/1996US5521427 Printed wiring board mounted semiconductor device having leadframe with alignment feature
05/28/1996US5521426 Reduced capacitance lead frame for lead on chip package
05/28/1996US5521425 Tape automated bonded (TAB) circuit
05/28/1996US5521424 Semiconductor device having a silicon oxide film containing fluorine atoms
05/28/1996US5521423 Dielectric structure for anti-fuse programming element
05/28/1996US5521420 Electrical apparatus
05/28/1996US5521419 Semiconductor device having field shield element isolating structure and method of manufacturing the same
05/28/1996US5521416 Semiconductor device having gate electrode and impurity diffusion layer different in conductivity type and method of manufacturing the same
05/28/1996US5521413 Semiconductor device having a solid metal wiring with a contact portion for improved protection
05/28/1996US5521406 Integrated circuit with improved thermal impedance
05/28/1996US5521332 High dielectric layer-containing alumina-based wiring substrate and package for semiconductor device
05/28/1996US5521124 Method of fabricating plastic transfer molded semiconductor silicone bridge rectifiers with radial terminals
05/28/1996US5521122 Process of manufacturing a multichip module using a temporary support base
05/28/1996US5521120 Method for the formation of tin barrier layer with preferential (111) crystallographic orientation
05/28/1996US5521118 Sidewall strap
05/28/1996US5521116 Sidewall formation process for a top lead fuse
05/28/1996US5521104 Applying protective coating to dielectrics and metal connectors before dry etching
05/28/1996US5521034 Substrate with color recorded on surface and metal plate or foil and photosensitive polyimide precursor
05/28/1996US5520878 Aluminum nitride body and method for forming said body utilizing a vitreous sintering additive
05/28/1996US5520244 Micropost waste heat removal system
05/28/1996US5519938 Process for producing a heat sink fin
05/28/1996US5519936 Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
05/23/1996WO1996015577A1 Laminated bus assembly and coupling apparatus for a high power electrical swtiching converter
05/23/1996WO1996015555A1 Multi-layer lead frame for a semiconductor device
05/23/1996WO1996015554A1 Transistor structure with specific gate and pad areas
05/23/1996WO1996015553A1 Transistor structure with specific gate and pad areas
05/23/1996WO1996015552A1 Forming a planar surface over a substrate by modifying the topography of the substrate
05/23/1996WO1996015551A1 Mounting electronic components to a circuit board
05/23/1996WO1996015459A1 Mounting spring elements on semiconductor devices, and wafer-level testing methodology
05/23/1996WO1996015458A1 Probe card assembly and kit, and methods of using same
05/23/1996WO1996015191A1 Epoxy resin composition for sealing photosemiconductor device
05/23/1996DE4441052A1 Carrier element for electronic module for insertion into e.g. smart card
05/23/1996DE4441044A1 Fastener for securing electrical power components to heat sink
05/23/1996DE4440721A1 Carrier element for integrated circuit components in e.g. cheque and credit cards
05/23/1996DE19542622A1 Thin-walled cable mfr. with micro-wiring preventing cross-talk interference and external electromagnetic influence
05/23/1996DE19542411A1 Semiconductor device
05/23/1996DE19524739A1 Inhomogeneous composition bump contact for surface mounted device flip-chip technology
05/22/1996EP0713359A1 Printed circuit boards with selectively filled plated through holes
05/22/1996EP0713357A1 Thick film paste
05/22/1996EP0713252A2 Circuit elements mounting
05/22/1996EP0713251A2 Semiconductor conversion device
05/22/1996EP0713250A2 Material for semiconductor substrate, process for producing the same, and semiconductor device with such substrate
05/22/1996EP0712534A1 Three dimensional package for monolithic microwave/millimeterwave integrated circuits
05/22/1996EP0559855B1 Flat module
05/22/1996EP0506859B1 Flip chip technology using electrically conductive polymers and dielectrics
05/22/1996CN1122955A Method for the fabrication of a semiconductor device
05/21/1996US5519720 Semiconductor light emitting device
05/21/1996US5519658 Semiconductor integrated circuit device and methods for production thereof
05/21/1996US5519650 Semiconductor device having an improved immunity to a short-circuit at a power supply line
05/21/1996US5519632 Automatic DCS routing for multilayer packages to minimize coupled noise
05/21/1996US5519582 Magnetic induction coil for semiconductor devices
05/21/1996US5519580 Electronic package
05/21/1996US5519576 For supporting an integrated circuit
05/21/1996US5519575 CPU cooling fan mounting structure
05/21/1996US5519574 Electronic component cooling apparatus
05/21/1996US5519332 Carrier for testing an unpackaged semiconductor die
05/21/1996US5519254 Multilayer aluminum wiring in semiconductor IC
05/21/1996US5519253 Coaxial switch module
05/21/1996US5519251 Semiconductor device and method of producing the same
05/21/1996US5519250 Reliability of metal leads in high speed LSI semiconductors using both dummy leads and thermoconductive layers
05/21/1996US5519248 Circuits for ESD protection of metal-to-metal antifuses during processing
05/21/1996US5519233 Microchip capacitor and thin film resistor as circuit elements in internal impedance matching circuit of microwave transistor
05/21/1996US5519231 Pressure-connection type semiconductor device having a thermal compensator in contact with a semiconductor base substrate in an alloy-free state
05/21/1996US5519176 Substrate and ceramic package
05/21/1996US5518964 Microelectronic mounting with multiple lead deformation and bonding
05/21/1996US5518962 Planarized interlayer insulating film formed of stacked BPSG film and ozone-teos NSG film in semiconductor device and method for forming the same
05/21/1996US5518961 Semiconductor integrated circuit device with wiring microstructure formed on gates and method of manufacturing the same
05/21/1996US5518960 Method of manufacturing a wiring layer including amorphous silicon and refractory metal silicide
05/21/1996US5518957 Method for making a thin profile semiconductor package
05/21/1996US5518947 Method of forming a semiconductor memory device having silicon nitride overlying only in peripheral circuit area
05/21/1996US5518936 Forming metal layer on dielectric substrate, doping surface of metal, then oxidizing surface of metal yields new dielectric layer having greater surface resistance
05/21/1996US5518805 Hillock-free multilayer metal lines for high performance thin film structures
05/21/1996US5518758 Arrangement for the conduction away of heat and a process for the production thereof
05/21/1996US5518684 Method of making a molded lead frame
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