Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2013
09/19/2013WO2013137710A1 Microelectronic device attachment on a reverse microelectronic package
09/19/2013WO2013137401A1 Electronic component mounting substrate fabrication method and electronic component mounting substrate
09/19/2013WO2013137214A1 Ceramic substrate and process for producing same
09/19/2013WO2013137152A1 Gas supply method for semiconductor manufacturing apparatus, gas supply system and semiconductor manufacturing apparatus
09/19/2013WO2013137130A1 Sealant paste and sealing method
09/19/2013WO2013136896A1 Semiconductor device and method for manufacturing same
09/19/2013WO2013136895A1 Semiconductor device
09/19/2013WO2013136877A1 Power conversion device
09/19/2013WO2013136722A1 Metal-clad laminate plate, printed wiring board, semiconductor package, and semiconductor device
09/19/2013WO2013136685A1 Sealing resin composition and electronic device using same
09/19/2013WO2013136388A1 Semiconductor device
09/19/2013WO2013135791A1 Method, device, and system for a power circuit
09/19/2013WO2013134979A1 Heat radiation structure
09/19/2013WO2013134972A1 Led lamp strip and backlight module
09/19/2013WO2013072525A3 Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure
09/19/2013WO2013010512A3 Apparatus and method of electrical testing for flip chip
09/19/2013US20130244384 Soldering relief method and semiconductor device employing same
09/19/2013US20130244380 Semiconductor device and method for manufacturing the same
09/19/2013US20130242305 Imaging Overlay Metrology Target and Complimentary Overlay Metrology Measurement System
09/19/2013US20130241088 Curable silicone resin composition and optoelectronic device
09/19/2013US20130241087 Semiconductor apparatus and method for producing the same
09/19/2013US20130241086 Curable epoxy resin composition
09/19/2013US20130241085 Semiconductor device and method for fabricating the same
09/19/2013US20130241084 Semiconductor device
09/19/2013US20130241083 Joint Structure for Substrates and Methods of Forming
09/19/2013US20130241082 Power converter
09/19/2013US20130241080 Semiconductor Device and Method of Forming Interposer and Opposing Build-Up Interconnect Structure with Connecting Conductive TMV for Electrical Interconnect of FO-WLCSP
09/19/2013US20130241079 Novel conductor layout technique to reduce stress-induced void formations
09/19/2013US20130241078 Semiconductor chip and stacked semiconductor package having the same
09/19/2013US20130241077 Semiconductor Package and Methods of Formation Thereof
09/19/2013US20130241076 Electronic device with reduced non-device edge area
09/19/2013US20130241074 Adaptive patterning for panelized packaging
09/19/2013US20130241073 Semiconductor device and manufacturing method of semiconductor device
09/19/2013US20130241072 Semiconductor device and manufacturing method of semiconductor device
09/19/2013US20130241071 Semiconductor Device and Method of Forming Compliant Conductive Interconnect Structure in Flipchip Package
09/19/2013US20130241070 Overlapping contacts for semiconductor device
09/19/2013US20130241069 Semiconductor bonding structure body and manufacturing method of semiconductor bonding structure body
09/19/2013US20130241068 Semiconductor device and method for forming the same
09/19/2013US20130241067 Semiconductor device and a method of manufacturing the same
09/19/2013US20130241066 Barrier layer for integrated circuit contacts
09/19/2013US20130241065 Semiconductor device
09/19/2013US20130241064 Semiconductor structure and method of forming the same
09/19/2013US20130241063 Through-silicon via and fabrication method thereof
09/19/2013US20130241062 Integrated circuits and methods for processing integrated circuits with embedded features
09/19/2013US20130241060 Method and composition for electrodeposition of copper in microelectronics with dipyridyl-based levelers
09/19/2013US20130241059 Integrated Antennas in Wafer Level Package
09/19/2013US20130241058 Wire Bonding Structures for Integrated Circuits
09/19/2013US20130241057 Methods and Apparatus for Direct Connections to Through Vias
09/19/2013US20130241055 Multi-Chip Packages and Methods of Manufacturing the Same
09/19/2013US20130241054 Semiconductor apparatus and method of fabricating the same
09/19/2013US20130241053 Integrated circuit packaging system with conductive pillars and molded cavities and method of manufacture thereof
09/19/2013US20130241052 Methods and Apparatus for Solder on Slot Connections in Package on Package Structures
09/19/2013US20130241051 Controlled area solder bonding for dies
09/19/2013US20130241050 Integrated optoelectronic interconnects with side-mounted transducers
09/19/2013US20130241049 Methods and Apparatus of Guard Rings for Wafer-Level-Packaging
09/19/2013US20130241048 Semiconductor Device and Method for Forming Semiconductor Package Having Build-Up Interconnect Structure Over Semiconductor Die with Different CTE Insulating Layers
09/19/2013US20130241047 Power semiconductor module and power unit device
09/19/2013US20130241046 Ceramic heat sink material for pressure contact structure, semiconductor module using the same, and method for manufacturing semiconductor module
09/19/2013US20130241045 Packages and methods for packaging
09/19/2013US20130241044 Semiconductor package having protective layer and method of forming the same
09/19/2013US20130241043 Semiconductor module and semiconductor device
09/19/2013US20130241042 Semiconductor chip package, semiconductor module, and method for manufacturing same
09/19/2013US20130241041 Semiconductor packages with lead extensions and related methods
09/19/2013US20130241040 Semiconductor device and method of manufacturing the same
09/19/2013US20130241039 Semiconductor Device and Method of Mounting Cover to Semiconductor Die and Interposer with Adhesive Material
09/19/2013US20130241031 Programmable fuse structure and methods of forming
09/19/2013US20130241030 Semiconductor Device and Method of Forming Base Substrate with Recesses for Capturing Bumped Semiconductor Die
09/19/2013US20130241029 Semiconductor device and a method of manufacturing the same and designing the same
09/19/2013US20130241020 Solid image-pickup device with flexible circuit substrate
09/19/2013US20130240992 Esd protection element and esd protection device for use in an electrical circuit
09/19/2013US20130240954 Semiconductor integrated circuit chip and layout method for the same
09/19/2013US20130240922 Light-emitting element unit and light-emitting element package
09/19/2013US20130240917 Semiconductor package having a conductive layer for electrostatic discharge and display device including the same
09/19/2013US20130240912 Semiconductor device
09/19/2013US20130240909 Semiconductor device and method for manufacturing semiconductor device
09/19/2013US20130240884 Detection of environmental conditions in a semiconductor chip
09/19/2013US20130240883 Contact Test Structure and Method
09/19/2013US20130240882 Die, wafer and method of processing a wafer
09/19/2013US20130240366 Plated terminations
09/19/2013US20130240183 Electronic device and fan module
09/19/2013US20130240008 System and method for mounting photovoltaic modules
09/19/2013DE112011104406T5 Halbleitervorrichtung Semiconductor device
09/19/2013DE102013204344A1 Halbleitervorrichtung und Verfahren zum Herstellen selbiger A semiconductor device and method of manufacturing Selbiger
09/19/2013DE102013204252A1 Halbleiterbauelement Semiconductor device
09/19/2013DE102013102786A1 Halbleiterpackage und Verfahren zu dessen Ausbildung Semiconductor package and method of training
09/19/2013DE102013102457A1 Überspannungsschutzeinrichtung für verbindungshalbleiter-feldeffekttransistoren Surge protection device for compound semiconductor-field-effect transistors
09/19/2013DE102013102058A1 Chipanordnungen und Verfahren zum Bilden einer Chipanordnung Chip assemblies and methods for forming a chip assembly
09/19/2013DE102013004410A1 Die, Wafer und Verfahren zur Verarbeitung eines Wafers Those wafer and method of processing a wafer
09/19/2013DE102012204296A1 Electronic component, has power module and logic module electrically and mechanically connected with one another, and power module protruding power terminal and contact region from molding component
09/19/2013DE102012204006A1 Schaltungsträgeranordnung Circuit board assembly
09/19/2013DE102012105177A1 Induktionsspule für Post Passivation Interconnect Induction coil for post passivation Interconnect
09/19/2013DE102010028465B4 Verfahren zur Herstellung eines Halbleiterbauelements mit Metallgate und Halbleiterwiderständen, die auf der Grundlage eines Austauschgateverfahrens hergestellt sind A process for producing a semiconductor device with metal gate and semiconductor resistors which are formed on the basis of a replacement gate method
09/19/2013DE102009024371B4 Verfahren zur Herstellung einer Stromrichteranordnung mit Kühleinrichtung und Stromrichteranordnung Process for the preparation of a converter arrangement with cooling device and power converter arrangement
09/18/2013EP2639827A1 Electronic circuit and heat sink
09/18/2013EP2639826A2 Bonding components to each other using exothermic reactions by simultaneous current pulses
09/18/2013EP2639823A2 Controlled area solder bonding for dies
09/18/2013EP2638571A2 Contact pad and method of manufacturing the same
09/18/2013EP2638570A1 Adhesive compound and method for encapsulating an electronic assembly
09/18/2013EP2638569A1 Unitary housing for electronic device
09/18/2013EP2638568A1 Through silicon via with improved reliability
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