Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/1996
06/13/1996WO1996018213A1 Multilayer solar cells with bypass diode protection
06/13/1996WO1996018109A2 An integrated resistor for sensing electrical parameters
06/13/1996DE4446703A1 Bond interface for joining partly metallised glass or ceramic substrate
06/13/1996DE19543245A1 Semiconductor device with flame sprayed heat conducting layer
06/13/1996DE19521389A1 Semiconductor integrated circuit mfg.
06/12/1996EP0716450A1 Semiconductor housing comprising a plurality of chips
06/12/1996EP0716449A2 Method for direct attachment of an on-chip bypass capacitor in an integrated circuit
06/12/1996EP0716448A1 Method for marking integrated circuits with a laser, and marking apparatus therefor
06/12/1996EP0716447A2 Metal layers formed as a composite of sub-layers and devices including same
06/12/1996EP0716446A2 Film carrier tape for semiconductor devices
06/12/1996EP0716445A2 Semiconductor device
06/12/1996EP0716444A1 Radiating plate and cooling method using same
06/12/1996CN2229103Y IC radiator
06/11/1996US5526231 Cooling unit for power semiconductors
06/11/1996US5526230 3D interconnection process for electronic component packages and resulting 3D components
06/11/1996US5525941 Magnetic and electromagnetic circuit components having embedded magnetic material in a high density interconnect structure
06/11/1996US5525841 Power gaAs fet having internal matching circuit
06/11/1996US5525840 Semiconductor device having an alignment mark
06/11/1996US5525839 Method of packing an IC die in a molded plastic employing an ultra-thin die coating process
06/11/1996US5525838 Semiconductor device with flow preventing member
06/11/1996US5525837 Reliable metallization with barrier for semiconductors
06/11/1996US5525836 Used in mounting and interconnecting an integrated circuit
06/11/1996US5525835 Semiconductor chip module having an electrically insulative thermally conductive thermal dissipator directly in contact with the semiconductor element
06/11/1996US5525834 Integrated circuit package
06/11/1996US5525830 Multilayer
06/11/1996US5525817 Bipolar transistor
06/11/1996US5525761 Copper-based paste containing refractory metal additions for densification control
06/11/1996US5525760 Fan-fold shielded electrical leads
06/11/1996US5525753 Multilayer laminate product and process
06/11/1996US5525644 Potted electrical components and methods of making the same
06/11/1996US5525548 Process of fixing a heat sink to a semiconductor chip and package cap
06/11/1996US5525547 Method of fabricating a molded semiconductor device having blocking banks between leads
06/11/1996US5525546 Semiconductor device and method of manufacturing thereof
06/11/1996US5525545 Semiconductor chip assemblies and components with pressure contact
06/11/1996US5525544 Semiconductor device with a MOS structure and a manufacturing method thereof
06/11/1996US5525428 Sintered compact containing copper, tungsten and(or)molybdenum; heat dissipation member
06/11/1996US5525374 Infiltering metal in molten state in sintered ceramic body to fill the void space by capillary action, cooling
06/11/1996US5525204 Applying a solder mask after plating process
06/11/1996US5524422 Cyanate functionality of compound react with moisture to form chemical intermediate, heating to a specific temperature to formed intermediate, releases carbon dioxide with in the package
06/11/1996US5524339 Method for protecting gallium arsenide mmic air bridge structures
06/06/1996WO1996017504A1 Ceramic package and method for forming the same
06/06/1996WO1996017389A1 Temperature compensation circuit for ic chip
06/06/1996WO1996017387A1 Method and apparatus for interconnecting solar cells
06/06/1996WO1996017383A1 Plastic housing designed to accommodate electronic and/or micromechanical components and into which conductor tracks pass
06/06/1996WO1996017382A1 Solder bumps for mounting flip-chips, and method of producing such bumps
06/06/1996WO1996017378A1 Electrical contact structures from flexible wire
06/06/1996WO1996008951A3 Downhole system
06/06/1996CA2206097A1 Plastic housing designed to accommodate electronic and/or micromechanical components and into which conductor tracks pass
06/05/1996EP0715488A1 Metal-foil-clad composite ceramic board and process for the production thereof
06/05/1996EP0715355A2 Cap to close off open via holes in PCBs
06/05/1996EP0715354A2 Insulator for integrated circuits and process
06/05/1996EP0715353A2 Board for a semiconductor chip
06/05/1996EP0715352A1 Substrate, semiconductor device, element-mounted device and preparation of substrate
06/05/1996EP0715351A1 Semiconductor power component
06/05/1996EP0715343A1 Semiconductor device and its manufacture
06/05/1996EP0715328A1 Protective device
06/05/1996EP0715314A1 Window and preparation thereof
06/05/1996EP0714553A1 Method of forming electrically conductive polymer interconnects on electrical substrates
06/05/1996EP0681741A4 Electronic chip carrier package and method of making thereof.
06/05/1996EP0528001B1 Batch assembly methods for packaging of chips
06/05/1996CN1123911A Method for detecting wafer defects
06/04/1996US5523918 CPU heat dissipating apparatus
06/04/1996US5523629 Plastic encapsulated microelectronic device
06/04/1996US5523628 Apparatus and method for protecting metal bumped integrated circuit chips during processing and for providing mechanical support to interconnected chips
06/04/1996US5523627 Wiring pattern of semiconductor integrated circuit device
06/04/1996US5523626 Semiconductor device and fabrication process therefor
06/04/1996US5523625 Semiconductor integrated circuit device having partially constricted lower wiring for preventing upper wirings from short-circuit
06/04/1996US5523622 Semiconductor integrated device having parallel signal lines
06/04/1996US5523621 Semiconductor device having a multilayer ceramic wiring substrate
06/04/1996US5523619 Integrated circuit structure
06/04/1996US5523618 Electronic integrated circuit label
06/04/1996US5523617 For use in a semiconductor package
06/04/1996US5523616 Semiconductor device having laminated tight and coarse insulating layers
06/04/1996US5523615 Porous dielectric material with improved pore surface properties for electronics applications
06/04/1996US5523612 Method of manufacturing an antifuse with doped barrier metal layer and resulting antifuse
06/04/1996US5523608 Solid state imaging device having a solid state image sensor and its peripheral IC mounted on one package
06/04/1996US5523604 Amorphous silicon layer for top surface of semiconductor device
06/04/1996US5523598 Semiconductor integrated circuit device
06/04/1996US5523597 Electronic device achieving a reduction in alpha particle emissions from boron-based compounds essentially free of boron-10
06/04/1996US5523595 Humidity resistant titanium oxynitride film; corroosion resistance
06/04/1996US5523586 Burn-in socket used in a burn-in test for semiconductor chips
06/04/1996US5523260 Method for heatsinking a controlled collapse chip connection device
06/04/1996US5523259 Method of forming metal layers formed as a composite of sub-layers using Ti texture control layer
06/04/1996US5523254 Method for production of SOI transistor device and SOI transistor
06/04/1996US5523253 Array protection devices and fabrication method
06/04/1996US5523252 Method for fabricating and inspecting semiconductor integrated circuit substrate, and semi-finished product used for the sustrate
06/04/1996US5523137 Adhesive paper for tape automated bonding
06/04/1996US5523049 Molding with filler of thermoconductive particles; debinding; densifying into monolithic structure
06/04/1996US5522520 Annealing laminate of titanium nitride-titanium-silicon dioxide films to diffuse nitrogen and oxygen into titanium prior to dry-etching
06/04/1996US5522452 Liquid cooling system for LSI packages
06/04/1996US5522215 Substrate cooling apparatus
06/04/1996US5522133 Coining method for bonding pad surface
06/04/1996US5522132 Microwave surface mount package
05/1996
05/30/1996WO1996016532A1 Compliant thermal connectors, methods and assemblies
05/30/1996WO1996016444A1 Integrated circuit device
05/30/1996WO1996016443A1 Semiconductor device with a carrier body on which a substrate with a semiconductor element is fastened by means of a glue layer and on which a pattern of conductor tracks is fastened
05/30/1996WO1996016442A1 Core metal soldering knob for flip-chip technology
05/30/1996WO1996016440A1 Interconnection elements for microelectronic components
05/30/1996WO1996016378A1 Active security device with electronic memory
05/30/1996WO1996015982A1 Aluminium nitride granules
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