| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/26/1996 | EP0718884A2 Multilevel interconnection of semiconductor device and forming method thereof |
| 06/26/1996 | EP0718883A2 Apparatus dissipating heat from an electronic circuit |
| 06/26/1996 | EP0718882A1 Tab grid array for a semiconductor device |
| 06/26/1996 | EP0718879A1 Method of forming a landing pad structure in an integrated circuit |
| 06/26/1996 | EP0718824A1 Giant magnetoresistive information recording medium, and associated recording and reproducing method and apparatus |
| 06/26/1996 | EP0718255A2 Composite electronic coatings |
| 06/26/1996 | EP0431106B1 Packaged electronic circuit with a chip on a gridded area of conductive pads |
| 06/26/1996 | CN1125481A Method of evaluating siloxane used for forming insulation coating, coating fluid used for forming insulation coating, process for producing the fluid, process for forming insulation coating for....... |
| 06/26/1996 | CN1125319A A pneumatically coupled heat sink assembly |
| 06/26/1996 | CN1125218A Novel aryl ester compound, its production process, epoxy resin composition using said compound, and copper-clad laminate using the epoxy resin composition |
| 06/25/1996 | US5530658 System and method for packing heat producing devices in an array to prevent local overheating |
| 06/25/1996 | US5530295 Electronic package |
| 06/25/1996 | US5530294 Semiconductor contact that partially overlaps a conductive line pattern and a method of manufacturing same |
| 06/25/1996 | US5530293 Dielectric for covering an interconnecting wire |
| 06/25/1996 | US5530292 Semiconductor device having a plurality of chips |
| 06/25/1996 | US5530291 Electronic package assembly and connector for use therewith |
| 06/25/1996 | US5530290 Large scale IC personalization method employing air dielectric structure for extended conductor |
| 06/25/1996 | US5530289 Semiconductor device and method of manufacturing the same |
| 06/25/1996 | US5530288 Passive interposer including at least one passive electronic component |
| 06/25/1996 | US5530287 High density wire bond pattern for integratd circuit package |
| 06/25/1996 | US5530286 Semiconductor device |
| 06/25/1996 | US5530285 Low-impedance surface-mount device |
| 06/25/1996 | US5530284 Semiconductor leadframe structure compatible with differing bond wire materials |
| 06/25/1996 | US5530283 Lead frame and lead frame material |
| 06/25/1996 | US5530282 Semiconductor device having a multilayer interconnection structure |
| 06/25/1996 | US5530281 Wirebond lead system with improved wire separation |
| 06/25/1996 | US5530280 Process for producing crackstops on semiconductor devices and devices containing the crackstops |
| 06/25/1996 | US5530278 Semiconductor chip having a dam to prevent contamination of photosensitive structures thereon |
| 06/25/1996 | US5530270 Substrate for semiconductr device |
| 06/25/1996 | US5530204 Electronic-parts mounting board and electronic-parts mounting board frame |
| 06/25/1996 | US5530060 Vinyl terminated polysiloxane, hydrogenpolysiloxane, platinum group metal catalyst, alumina filler |
| 06/25/1996 | US5529959 Charge-coupled device image sensor |
| 06/25/1996 | US5529957 Method for blocking contamination and stabilizing chip capacitor during attachment using a tape strip |
| 06/25/1996 | US5529956 Multi-layer wiring structure in semiconductor device and method for manufacturing the same |
| 06/25/1996 | US5529955 Wiring forming method |
| 06/25/1996 | US5529954 Annealing in atmosphere containing a predetermined element which reacts with metal element in first film |
| 06/25/1996 | US5529953 Method of forming studs and interconnects in a multi-layered semiconductor device |
| 06/25/1996 | US5529950 Method for manufacturing a cubically integrated circuit arrangement |
| 06/25/1996 | US5529852 Containing aluminum oxide, calcium oxide, tungsten; adhesion, airtightness, thermoconductivity |
| 06/25/1996 | US5529846 Highly-oriented diamond film heat dissipating substrate |
| 06/25/1996 | US5529831 Noise filter; magnetic film comnprises an iron-metal-carbon system crystallite material |
| 06/25/1996 | US5529682 Heating previously metal-plated connectors until solderable metal flows to improve adhesion |
| 06/25/1996 | US5529634 Apparatus and method of manufacturing semiconductor device |
| 06/25/1996 | US5529504 Electrically anisotropic elastomeric structure with mechanical compliance and scrub |
| 06/25/1996 | US5529115 Integrated circuit cooling device having internal cooling conduit |
| 06/25/1996 | US5528825 Method of manufacture of hybrid integrated circuit |
| 06/25/1996 | CA2070308C Process of producing multiple-layer glass-ceramic circuit board |
| 06/25/1996 | CA2050378C Self-adjusting heat sink design for vlsi packages |
| 06/25/1996 | CA2050374C Heat sink for electronic circuitry |
| 06/25/1996 | CA2035816C Polyimides end-capped with diaryl substituted acetylene |
| 06/23/1996 | CA2162067A1 Method for integrating analog and digital functional components, and resulting semiconductor chip including an integrated dram |
| 06/20/1996 | WO1996019013A1 Method and support for connecting an integrated circuit to another support via balls |
| 06/20/1996 | WO1996019012A1 Forming polyimide coatings by screen printing |
| 06/20/1996 | WO1996018749A2 Hard disk drive components and methods of making same |
| 06/20/1996 | WO1996018748A2 Computer disk substrate, the process for making same, and the material made therefrom |
| 06/20/1996 | WO1996018589A1 Substrate of a ceramic material |
| 06/20/1996 | DE19546962A1 Metallisation structure e.g. of liq. crystal device |
| 06/19/1996 | EP0717442A1 Process and integrated circuit connection support to another support by means of bumps |
| 06/19/1996 | EP0717441A2 Method of solder bonding a body, e.g. a silicon chip, to another body |
| 06/19/1996 | EP0717440A2 Cooling device of multi-chip module |
| 06/19/1996 | EP0717125A1 Bonding of diamond to a substrate |
| 06/19/1996 | EP0597015B1 Anti-fuse structures and methods for making same |
| 06/18/1996 | US5528462 Direct chip connection using demountable flip chip package |
| 06/18/1996 | US5528458 Integrated circuit device and its manufacturing method |
| 06/18/1996 | US5528457 Method and structure for balancing encapsulation stresses in a hybrid circuit assembly |
| 06/18/1996 | US5528456 Package with improved heat transfer structure for semiconductor device |
| 06/18/1996 | US5528371 Measurement apparatus for measuring dimensions of semiconductor device and method of measuring the same |
| 06/18/1996 | US5528222 Radio frequency circuit and memory in thin flexible package |
| 06/18/1996 | US5528135 Sheet ceramic package having electrically independent products units |
| 06/18/1996 | US5528083 Thin film chip capacitor for electrical noise reduction in integrated circuits |
| 06/18/1996 | US5528081 High temperature refractory metal contact in silicon integrated circuits |
| 06/18/1996 | US5528080 Electrically conductive interconnection through a body of semiconductor material |
| 06/18/1996 | US5528079 Hermetic surface mount package for a two terminal semiconductor device |
| 06/18/1996 | US5528078 Film carrier and a method for manufacturing the same |
| 06/18/1996 | US5528077 Flexible tab semiconductor device |
| 06/18/1996 | US5528076 Leadframe having metal impregnated silicon carbide mounting area |
| 06/18/1996 | US5528075 Lead-on-chip integrated circuit apparatus |
| 06/18/1996 | US5528074 Microwave semiconductor device and integrated circuit including microwave semiconductor devices |
| 06/18/1996 | US5528073 Bus bar having reduced parasitic inductances and equal current path lengths |
| 06/18/1996 | US5528072 Integrated circuit having a laser connection of a conductor to a doped region of the integrated circuit |
| 06/18/1996 | US5528061 Semiconductor integrated circuit device having multi-contact wiring structure |
| 06/18/1996 | US5527999 Multilayer conductor for printed circuits |
| 06/18/1996 | US5527992 Cavity down mounting seam-welding ceramic package for semiconductor device |
| 06/18/1996 | US5527872 Electronic device with a spin-on glass dielectric layer |
| 06/18/1996 | US5527745 Method of fabricating antifuses in an integrated circuit device and resulting structure |
| 06/18/1996 | US5527743 Method for encapsulating an integrated circuit package |
| 06/18/1996 | US5527742 Process for coated bonding wires in high lead count packages |
| 06/18/1996 | US5527741 Fabrication and structures of circuit modules with flexible interconnect layers |
| 06/18/1996 | US5527740 Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities |
| 06/18/1996 | US5527739 Process for fabricating a semiconductor device having an improved metal interconnect structure |
| 06/18/1996 | US5527738 Method for forming contacts in semiconductor devices |
| 06/18/1996 | US5527737 Selective formation of low-density, low-dielectric-constant insulators in narrow gaps for line-to-line capacitance reduction |
| 06/18/1996 | US5527627 Ink composition for an ultra-thick thick film for thermal management of a hybrid circuit |
| 06/18/1996 | US5527620 Reduced gradient of tensile and compressive strength; durability |
| 06/18/1996 | US5527604 Metal base board and electronic equipment using the same |
| 06/18/1996 | US5527588 Micro heat pipe panels and method for producing same |
| 06/18/1996 | US5526875 Cooling device for CPU |
| 06/18/1996 | US5526874 Heat sink retention apparatus and method |
| 06/18/1996 | US5526867 Methods of forming electronic packages |
| 06/18/1996 | CA2062803C Heat sink assembly |