| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/09/1996 | US5534463 Method for forming a wiring layer |
| 07/09/1996 | US5534462 Method for forming a plug and semiconductor device having the same |
| 07/09/1996 | US5534461 Method for manufacturing a semiconductor device having planarized wiring |
| 07/09/1996 | US5534458 Method of manufacturing a semiconductor device with high dielectric capacitor having sidewall spacers |
| 07/09/1996 | US5534453 Washing, heat treatment |
| 07/09/1996 | US5534451 Method for fabricating a reduced area metal contact to a thin polysilicon layer contact structure having low ohmic resistance |
| 07/09/1996 | US5534356 Anodized aluminum substrate having increased breakdown voltage |
| 07/09/1996 | US5534331 Method of manufacturing a multi-layered ceramic circuit board containing layers of reduced dielectric constant |
| 07/09/1996 | US5534094 Method for fabricating multi-layer thin film structure having a separation layer |
| 07/09/1996 | US5533664 Method of manufacturing a semiconductor device |
| 07/09/1996 | US5533257 Method for forming a heat dissipation apparatus |
| 07/09/1996 | US5533256 Method for directly joining a chip to a heat sink |
| 07/09/1996 | CA2042823C Multilayer interconnection substrate |
| 07/04/1996 | WO1996020550A1 Lead frame for handling crossing bonding wires |
| 07/04/1996 | WO1996020502A1 Electronic package for isolated circuits |
| 07/04/1996 | WO1996020501A1 An integrated circuit package encapsulated by fiber laden molding material and its method of manufacturing |
| 07/04/1996 | WO1996020500A1 Method of contacting a chip |
| 07/04/1996 | WO1996020497A1 Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material glued on a support wafer |
| 07/04/1996 | WO1996020252A1 Mouldings made of polyurethane hot-melt-type adhesives |
| 07/04/1996 | WO1996020145A1 Method of producing ceramic composite bodies |
| 07/04/1996 | DE4446027A1 Formteile aus PU-Schmelzklebstoffen Molded polyurethane hot melt adhesives |
| 07/04/1996 | DE4438449A1 Direct contacting method for component to carrier |
| 07/04/1996 | DE19548984A1 System for fuse couplers in integrated circuit |
| 07/04/1996 | DE19522364C1 Semiconductor transistor bonding pad arrangement |
| 07/03/1996 | EP0720420A1 Heat sink and connector for cooling an electronic component by a fluid isolated from it |
| 07/03/1996 | EP0720419A1 A circuit board for liquid crystal display, a circuit module, a liquid crystal display device using them, and a method for producing the same |
| 07/03/1996 | EP0720260A1 Getter housing for electronic packages |
| 07/03/1996 | EP0720234A2 Vertical power MOSFET having thick metal layer to reduce distributed resistance and method of fabricating the same |
| 07/03/1996 | EP0720232A1 Multi-chip module |
| 07/03/1996 | EP0720231A2 Multilayered Al-alloy structure for metal conductors |
| 07/03/1996 | EP0720230A2 Fuse structure for an integrated circuit device |
| 07/03/1996 | EP0720229A2 Double density fuse bank for the laser break-link programming of an integrated circuit |
| 07/03/1996 | EP0720228A2 Semiconductor connection structure and method |
| 07/03/1996 | EP0720227A2 Electrical connection structure on an integrated circuit device comprising a plug with an enlarged head |
| 07/03/1996 | EP0720226A2 Semiconductor device comprising contact bumps |
| 07/03/1996 | EP0720225A2 Lateral power MOSFET having metal strap layer to reduce distributed resistance and method of fabricating the same |
| 07/03/1996 | EP0720224A1 Method and device for fixing two elements such as an integrated circuit radiator to a printed circuit card |
| 07/03/1996 | EP0720223A1 Process for the production of a semiconductor device having better interface adhesion between dielectric layers |
| 07/03/1996 | EP0720219A2 Conductive runner fabrication for an integrated circuit |
| 07/03/1996 | EP0720214A2 Method of treating metal nitride films to reduce silicon migration therein |
| 07/03/1996 | EP0720212A2 Method of manufacturing semiconductor devices |
| 07/03/1996 | EP0720123A2 Non-contact type IC card and method and apparatus for manufacturing the same |
| 07/03/1996 | EP0719976A1 Heat insulating board and heat insulating method using same |
| 07/03/1996 | EP0719453A1 Flip chip in metal electronic packages |
| 07/03/1996 | EP0719452A1 Bonded wafer process incorporating diamond insulator |
| 07/03/1996 | EP0719451A1 Filling holes and the like in substrates |
| 07/03/1996 | EP0694220A4 Solder-bearing lead |
| 07/03/1996 | CN1125999A Electromigration resistant metallization structures for microcircuit interconnections with RF-reactively sputtered titanium tungsten and gold |
| 07/03/1996 | CN1125998A Method for providing electrical interconnections between adjacent circuit board layers of a multi-layer circuit board |
| 07/03/1996 | CN1125897A Method and device for correcting IC guiding wire |
| 07/02/1996 | US5532934 Floorplanning technique using multi-partitioning based on a partition cost factor for non-square shaped partitions |
| 07/02/1996 | US5532910 Hybrid integrated circuit and process for producing same |
| 07/02/1996 | US5532906 Wiring substrate |
| 07/02/1996 | US5532905 Thermally enhanced leadframe for packages that utilize a large number of leads |
| 07/02/1996 | US5532667 Low-temperature-cofired-ceramic (LTCC) tape structures including cofired ferromagnetic elements, drop-in components and multi-layer transformer |
| 07/02/1996 | US5532520 Semiconductor wafer with alignment marks |
| 07/02/1996 | US5532519 Cube wireability enhancement with chip-to-chip alignment and thickness control |
| 07/02/1996 | US5532517 Hybrid integrated circuit device with heat suppression means provided in the vicinity of solder bonding areas |
| 07/02/1996 | US5532516 Semiconductor device |
| 07/02/1996 | US5532515 Semiconductor connecting device |
| 07/02/1996 | US5532514 High frequency semiconductor device |
| 07/02/1996 | US5532513 Enclosure for a semiconductor device |
| 07/02/1996 | US5532506 Integrated circuit adapted for improved thermal impedance |
| 07/02/1996 | US5532501 Semiconductor device having wiring take-out cells |
| 07/02/1996 | US5532189 Method of making semiconductor package |
| 07/02/1996 | US5532186 Process for manufacturing bumped tab tape |
| 07/02/1996 | US5532174 Wafer level integrated circuit testing with a sacrificial metal layer |
| 07/02/1996 | US5532031 Input/output, bonding strength |
| 07/02/1996 | US5531945 Process for the production of base board for printed wiring |
| 07/02/1996 | US5531860 Structure and method for providing a lead frame with enhanced solder wetting leads |
| 07/02/1996 | US5531608 IC retainer in IC socket |
| 07/02/1996 | US5531603 Device for aligning contacting portions of contacts in IC socket |
| 07/02/1996 | US5531329 IC carrier to which an IC can be mounted with the leads thereof supported in a non-contacting state |
| 07/02/1996 | US5531022 Method of forming a three dimensional high performance interconnection package |
| 07/02/1996 | US5531021 Method of making solder shape array package |
| 07/02/1996 | US5531014 Electromechanical press and method of operating |
| 07/02/1996 | CA2091859C Cooling system for a package with electronic circuit components |
| 07/02/1996 | CA2073911C Stepped multilayer interconnection apparatus and method of making the same |
| 06/30/1996 | CA2166043A1 Process for encapsulating an electronic component, an electronic component thus encapsulated, and encapsulating material designed therefor |
| 06/28/1996 | CA2162095A1 Getter housing for electronic packages |
| 06/27/1996 | WO1996019832A1 Electrostatic discharge protection device |
| 06/27/1996 | WO1996019830A1 Novel processing techniques for achieving production-worthy, low dielectric, low interconnect resistance and high performance ic |
| 06/27/1996 | WO1996019829A1 Device for superheating steam |
| 06/27/1996 | WO1996019828A1 Wirebond lead system with improved wire separation |
| 06/27/1996 | WO1996019827A1 A method of bonding heat sink elements to a solid-state power component and a solid-state power component equipped with an integral heat sink |
| 06/27/1996 | WO1996019826A1 A method of fabricating integrated circuits using bilayer dielectrics |
| 06/27/1996 | WO1996013059A3 Hermetically sealed microwave integrated circuit package with ground plane fused to package frame |
| 06/27/1996 | DE4446566A1 Mehrpoliges, oberflächenmontierbares, elektronisches Bauelement Multi-pole surface mount electronic component |
| 06/27/1996 | DE4446471A1 Chipkontaktierungsverfahren und damit hergestellte elektronische Schaltung Chipkontaktierungsverfahren and thus produced electronic circuit |
| 06/27/1996 | DE4444680A1 Multilayer substrate esp. for power semiconductor component |
| 06/27/1996 | DE19548489A1 Protection circuit for input=output circuit |
| 06/27/1996 | DE19547370A1 Mfg. metallic microstructures |
| 06/27/1996 | DE19546569A1 Solder connection method for large scale integration and power semiconductor |
| 06/27/1996 | DE19531602A1 Connection structure in semiconductor component |
| 06/27/1996 | CA2206243A1 Electrostatic discharge protection device |
| 06/26/1996 | EP0718917A2 Electrical interconnect contact system |
| 06/26/1996 | EP0718905A1 Surface mountable microwave IC package |
| 06/26/1996 | EP0718888A2 Method for integrating analog and digital functional components, and resulting semiconductor chip including an integrated DRAM |
| 06/26/1996 | EP0718886A1 Semiconductor power module |
| 06/26/1996 | EP0718885A2 Structure for protecting air bridges on semiconductor chips from damage |