| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 07/23/1996 | US5537738 Methods of mechanical and electrical substrate connection |
| 07/23/1996 | CA2051836C Personal data card construction |
| 07/23/1996 | CA2045945C Structure and method for the fabrication of lpmcm semiconductor packages |
| 07/18/1996 | WO1996022008A1 Low-emi electronic apparatus, low-emi circuit board, and method of manufacturing the low-emi circuit board |
| 07/18/1996 | WO1996021948A1 Semiconductor device, tape carrier package, and display panel module |
| 07/18/1996 | WO1996021947A1 Chip carrier arrangement and chip carrier for producing a chip housing |
| 07/18/1996 | WO1996021946A1 Guard ring for integrated circuit package |
| 07/18/1996 | WO1996021944A1 Method and apparatus for capping metallization layer |
| 07/18/1996 | WO1996021930A1 Radiation shielding of plastic integrated circuits |
| 07/18/1996 | WO1996021693A1 Novel heat-fusible copolymer, and powder, film, laminated heat insulator, electronic module, and capacitor produced from said copolymer, and process for producing the same |
| 07/18/1996 | WO1996012752A3 Curable epoxy resin accelerated by boric acid and its analogs |
| 07/18/1996 | DE19601372A1 Semiconductor module for power semiconductor |
| 07/18/1996 | DE19600300A1 Ultra-fine wiring and insulation for IC |
| 07/18/1996 | DE19600048A1 Carrier plate for integrated circuit |
| 07/18/1996 | DE19500655A1 Chipträger-Anordnung sowie Chipträger zur Herstellung einer Chip-Gehäusung Chip carrier assembly and chip carrier for producing a chip-Gehäusung |
| 07/18/1996 | DE19500392A1 Integrated circuit structure (TI2> has diffusion zone formed in wall of groove fully enclosing silicon island in monocrystalline surface layer |
| 07/17/1996 | EP0722186A2 Laminated electronic part |
| 07/17/1996 | EP0721965A1 Flame retardent reaction system of epoxy compounds and phosphorous containing anhydrid hardeners |
| 07/17/1996 | EP0721662A1 Three-dimensional processor using transferred thin film circuits |
| 07/17/1996 | EP0721661A1 Method of manufacturing a semiconductor device for surface mounting, and semiconductor device for surface mounting |
| 07/17/1996 | EP0721660A1 Method for assembling an electronic package |
| 07/17/1996 | EP0721659A1 Patterned array of uniform metal microbeads |
| 07/17/1996 | EP0721588A1 Built-in electronic sensor for the characterization of physical quantities and method of production |
| 07/17/1996 | EP0644216B1 Naphthalene-ring resin, resin composition, and cured product thereof |
| 07/17/1996 | CN2231476Y Packing structure for electronic element |
| 07/16/1996 | US5537342 Encapsulation of electronic components |
| 07/16/1996 | US5537328 Method for laying out power supply wiring conductors in integrated circuits |
| 07/16/1996 | US5537325 Apparatus for and method of manufacturing semiconductor wafer |
| 07/16/1996 | US5537291 Cooling device for integrated circuit element |
| 07/16/1996 | US5537108 Method and structure for programming fuses |
| 07/16/1996 | US5536974 Semiconductor device with light reflecting substrate area |
| 07/16/1996 | US5536973 Semiconductor device including a semiconductor element mounted on a substrate using bump-shaped connecting electrodes |
| 07/16/1996 | US5536972 Power module |
| 07/16/1996 | US5536971 Semiconductor device having a hollow around a gate electrode and a method for producing the same |
| 07/16/1996 | US5536970 Noncracking, reliability, moisture resistance |
| 07/16/1996 | US5536969 IC carrier |
| 07/16/1996 | US5536968 Polysilicon fuse array structure for integrated circuits |
| 07/16/1996 | US5536909 Semiconductor connection components and methods with releasable lead support |
| 07/16/1996 | US5536907 Semiconductor package |
| 07/16/1996 | US5536906 Package for integrated circuits |
| 07/16/1996 | US5536855 Process for preparing glycidyl esters for use in electronics adhesives |
| 07/16/1996 | US5536685 Low heat loss and secure chip carrier for cryogenic cooling |
| 07/16/1996 | US5536682 Method for manufacturing a semiconductor device |
| 07/16/1996 | US5536681 Plasma enhanced oxidation, selective treatment with n2 plasma |
| 07/16/1996 | US5536679 Method for fabrication of semiconductor device capable of preventing short circuits |
| 07/16/1996 | US5536677 Masking semiconductor device using two masks, first with inwardly tapering sidewall, second with outwardly tapering sidewall, etching, depositing conductive material |
| 07/16/1996 | US5536584 Semiconductor integrated circuit, transistor and a thin film multilevel wiring board uses surface protective coating of polyimide |
| 07/16/1996 | US5536579 Design of high density structures with laser etch stop |
| 07/16/1996 | US5536362 Wire interconnect structures for connecting an integrated circuit to a substrate |
| 07/16/1996 | US5536293 Glass frit |
| 07/16/1996 | US5535818 Cooling system for electronic device |
| 07/16/1996 | US5535816 Heat sink |
| 07/16/1996 | US5535789 Lead wire forming apparatus capable of preventing the peeling of the solder from the lead wire |
| 07/16/1996 | US5535515 Method of manufacturing a stress-free heatsink assembly |
| 07/16/1996 | US5535510 Plastic encapsulated microelectronic device and method |
| 07/16/1996 | US5535509 Method of making a lead on chip (LOC) semiconductor device |
| 07/16/1996 | CA2060239C Glass-aluminum nitride composite material |
| 07/16/1996 | CA2045787C Protection of devices from electrostatic discharge and corrosion |
| 07/14/1996 | CA2140173A1 Top level via structure for programming prefabricated multi-level interconnect |
| 07/14/1996 | CA2140171A1 Contact programmable wiring and cell array architecture |
| 07/11/1996 | WO1996021246A1 Semiconductor device having a passivation layer |
| 07/11/1996 | WO1996021243A1 Method of etching conductive lines without undercutting |
| 07/11/1996 | WO1996021149A1 Covering layer for electrical conductors or semiconductors |
| 07/11/1996 | WO1996020969A1 Epoxy resin composition |
| 07/11/1996 | WO1996013056A3 Hermetically sealed hybrid ceramic integrated circuit package |
| 07/11/1996 | WO1996013055A3 Plastic encapsulation of IC device by two level epoxy encapsulation |
| 07/11/1996 | EP0729647A4 Diamond shaped gate mesh for cellular mos transistor array |
| 07/11/1996 | DE19500235A1 Abdeckschicht für elektrische Leiter oder Halbleiter Covering for electrical conductors or semiconductors |
| 07/11/1996 | CA2184735A1 An epoxy resin composition |
| 07/10/1996 | EP0721218A1 Power integrated circuit |
| 07/10/1996 | EP0721216A2 A soft metal conductor and method of making |
| 07/10/1996 | EP0721215A2 Forming array with metal scan lines to control semiconductor gatelines |
| 07/10/1996 | EP0721214A2 Circuitry with gate line crossing semiconductor line at two or more channels |
| 07/10/1996 | EP0721213A2 Array with metal scan lines controlling semiconductor gate lines |
| 07/10/1996 | EP0721212A1 Metal electronic package portion |
| 07/10/1996 | EP0721209A2 Method of testing semiconductor devices and conductive adhesive thereby used |
| 07/10/1996 | EP0721206A1 Bending device for the leads of an intermediary integrated circuit holder |
| 07/10/1996 | EP0720901A1 Process for encapsulating an electronic component, an electronic component thus encapsulated, and encapsulating material designed therefor |
| 07/10/1996 | EP0720768A1 A horizontally twisted-pair planar conductor line structure |
| 07/10/1996 | EP0502887B1 Metal pin grid array package including dielectric polymer sealant |
| 07/10/1996 | CN1126399A Photosensor |
| 07/10/1996 | CN1126371A Microwave integrated circuit passive element structure and method for reducing signal propagation losses |
| 07/10/1996 | CN1126369A Production of semiconductor units |
| 07/10/1996 | CN1032285C Method for manufacturing semiconductor device |
| 07/09/1996 | US5535296 Integrated optoelectronic coupling and connector |
| 07/09/1996 | US5535101 Leadless integrated circuit package |
| 07/09/1996 | US5535094 Integrated circuit package with an integral heat sink and fan |
| 07/09/1996 | US5534788 Integrated resistor for sensing electrical parameters |
| 07/09/1996 | US5534785 Integrated circuit bare chip carrier |
| 07/09/1996 | US5534732 Single twist layout and method for paired line conductors of integrated circuits |
| 07/09/1996 | US5534731 Layered low dielectric constant technology |
| 07/09/1996 | US5534729 Integrated circuit lead frame for coupling to non-neighboring bond pads |
| 07/09/1996 | US5534728 Semiconductor device having a corrosion-resistant metal wiring layer |
| 07/09/1996 | US5534727 Semiconductor device |
| 07/09/1996 | US5534726 Semiconductor device provided with status detecting function |
| 07/09/1996 | US5534725 Resin molded charge coupled device package and method for preparation thereof |
| 07/09/1996 | US5534666 Multi-layer wiring board having a base block and a stacking block connected by an adhesive layer |
| 07/09/1996 | US5534467 Semiconductor packages for high I/O semiconductor dies |
| 07/09/1996 | US5534466 Depositing release dielectric layer on carrier |
| 07/09/1996 | US5534464 Semiconductor device having a semiconductor chip mounted on an insulating body |