Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1996
08/06/1996US5542601 Rework process for semiconductor chips mounted in a flip chip configuration on an organic substrate
08/06/1996US5542468 CPU heat dissipator hook-up apparatus
08/06/1996US5542176 Radiation plate and method of producing the same
08/06/1996US5542174 Method and apparatus for forming solder balls and solder columns
08/06/1996CA2077286C Electrical connecting method
08/02/1996CA2168506A1 Method for applying bonding pads on a substrate and apparatus comprising said pads
08/01/1996WO1996023398A1 Thermal management system
08/01/1996WO1996023397A1 Printed circuit board and heat sink arrangement
08/01/1996WO1996023396A1 Stackable modules and multimodular assemblies
08/01/1996WO1996023321A1 Glass bonding layer for a ceramic circuit board support substrate
08/01/1996WO1996023320A1 High performance integrated circuit package
08/01/1996WO1996023018A1 Reaction resin system with a phosphorus-containing component
08/01/1996WO1996022949A1 Low dielectric loss glasses
08/01/1996WO1996022882A1 Conductive via fill inks for ceramic multilayer circuit boards on support substrates
08/01/1996WO1996022881A1 Electrical feedthroughs for ceramic circuit board support substrates
08/01/1996DE19546953A1 Semiconductor digital=analogue converter
08/01/1996DE19542043A1 Bleifreie Niedertemperaturlegierung und Verfahren zur Bildung einer mechanisch überlegenen Verbindung unter Verwendung dieser Legierung A lead-free low-temperature alloy and method of forming a mechanically superior compound using this alloy
08/01/1996DE19502157A1 Electronic module carrier element for mfr. of smart cards
07/1996
07/31/1996EP0724296A2 Field effect transistor having comb-shaped electrode assemblies
07/31/1996EP0724294A2 Semiconductor device mounted on tub having central slit pattern and peripheral slit pattern for absorbing thermal stress
07/31/1996EP0724293A2 Gate compacting structure of power MOS transistor
07/31/1996EP0724292A2 Method for forming multilevel interconnections in a semiconductor device
07/31/1996EP0724290A2 Electronic package
07/31/1996EP0724289A2 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
07/31/1996EP0723704A1 Layout for radio frequency power transistors
07/31/1996EP0723703A1 Edge connectable metal package
07/31/1996EP0723702A1 A fine pitch lead frame and method for manufacturing same
07/30/1996US5541814 Personalizable multi-chip carrier including removable fuses
07/30/1996US5541812 Bus communication system for stacked high density integrated circuit packages having an intermediate lead frame
07/30/1996US5541811 Shielding and cooling arrangement
07/30/1996US5541565 High frequency microelectronic circuit enclosure
07/30/1996US5541525 Carrier for testing an unpackaged semiconductor die
07/30/1996US5541452 IC card
07/30/1996US5541451 Packaged semiconductor device with external leads having anchor holes provided at polyamide/glass sealed regions
07/30/1996US5541450 Low-profile ball-grid array semiconductor package
07/30/1996US5541449 Semiconductor chip carrier affording a high-density external interface
07/30/1996US5541448 Electronic circuit card
07/30/1996US5541447 Lead frame
07/30/1996US5541446 Integrated circuit package with improved heat dissipation
07/30/1996US5541445 High performance passivation for semiconductor devices
07/30/1996US5541441 Metal to metal antifuse
07/30/1996US5541434 Semiconductor device incorporating a contact for electrically connecting adjacent portions within the semiconductor device
07/30/1996US5541368 Laminated multi chip module interconnect apparatus
07/30/1996US5541248 Hydrogen silsesquioxane resin, phosphor filler
07/30/1996US5541135 Sputtering titanium tungsten over substrates, sputtering copper with photoresist pattern, electrodeposition of copper, covering with indicator, stripping and etching, plating lead and etching
07/30/1996US5541007 Containing scandium, low resistivity, breakage resistant, integrated circuits
07/30/1996US5541005 Semiconductor substrate
07/30/1996US5540948 Method of coating a substrate with ceramic coating
07/30/1996US5540779 Apparatus for manufacture of multi-layer ceramic interconnect structures
07/30/1996US5540378 Method for the assembly of an electronic package
07/30/1996US5540369 Detaching linerless labels
07/30/1996US5539976 System for manufacture of hybrid integrated circuit
07/30/1996CA2091910C Chip carrier with protective coating for circuitized surface
07/30/1996CA2048170C Micropin array and production method thereof
07/25/1996WO1996022669A2 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
07/25/1996WO1996022622A1 Silicon segment programming method and apparatus
07/25/1996WO1996022620A1 Conductive epoxy flip-chip
07/25/1996WO1996022619A1 Array of electrical components with leads attached
07/25/1996WO1996022401A1 Copper-tungsten alloys and process for producing the same
07/25/1996WO1996022172A1 Method and cutting insert for threading
07/25/1996WO1996013858A3 Integrated microwave semiconductor device with active and passive components
07/25/1996DE4345316A1 Outer rotor motor or outer armature motor
07/25/1996CA2210975A1 Array of electrical components with leads attached
07/24/1996EP0723388A1 Printed circuit board
07/24/1996EP0723294A2 Semiconductor device having a bond pad and a process for forming the device
07/24/1996EP0723293A1 Semiconductor device with a heat sink and method of producing the heat sink
07/24/1996EP0723292A2 Semiconductor device
07/24/1996EP0723291A2 Zirconia-added alumina substrate with direct bonding of copper
07/24/1996EP0722618A1 Two-phase component cooler
07/24/1996EP0552278B1 Flame retardant epoxy molding compound and process for encapsulating a device
07/24/1996CN1127429A Semiconductor device structure
07/23/1996US5539617 Liquid-coolant cooling element
07/23/1996US5539324 Universal wafer carrier for wafer level die burn-in
07/23/1996US5539301 Monolithically integrated power output stage
07/23/1996US5539257 Semiconductor integrated circuit device
07/23/1996US5539256 Semiconductor device having an interconnection of a laminate structure and a method for manufacturing the same
07/23/1996US5539255 Semiconductor structure having self-aligned interconnection metallization formed from a single layer of metal
07/23/1996US5539253 Resin-sealed semiconductor device
07/23/1996US5539252 Fastener with onboard memory
07/23/1996US5539251 Semiconductor device
07/23/1996US5539250 Plastic-molded-type semiconductor device
07/23/1996US5539248 Semiconductor device with improved insulating/passivating layer of indium gallium fluoride (InGaF)
07/23/1996US5539244 Power semiconductor device
07/23/1996US5539243 Semiconductor device having spaces and having reduced parasitic capacitance
07/23/1996US5539241 Monolithic passive component
07/23/1996US5539232 MOS composite type semiconductor device
07/23/1996US5539231 Semiconductor device
07/23/1996US5539227 Multi-layer wiring
07/23/1996US5539223 Wiring structure of source line used in semicustom integrated circuit
07/23/1996US5539220 Pressure contact semiconductor device in a flat package
07/23/1996US5539218 Epoxy resin, acid anhydride, catalyst and filler
07/23/1996US5539186 Temperature controlled multi-layer module
07/23/1996US5539153 Method of bumping substrates by contained paste deposition
07/23/1996US5539151 Reinforced sealing technique for an integrated-circuit package
07/23/1996US5538924 Method of forming a moisture guard ring for integrated circuit applications
07/23/1996US5538920 Method of fabricating semiconductor device
07/23/1996US5538919 Method of fabricating a semiconductor device with high heat conductivity
07/23/1996US5538789 Adherent layer of thermosetting resin capable of b-stage curing
07/23/1996US5538433 Electrical connector comprising multilayer base board assembly
07/23/1996US5537739 Method for electoconductively connecting contacts
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