Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1996
08/15/1996WO1996024944A1 Methods of mechanical and electrical substrate connection
08/15/1996WO1996024854A1 Top load socket for ball grid array devices
08/15/1996WO1996024625A2 Amorphous copolymers of tetrafluoroethylene and hexafluoropropylene
08/15/1996WO1996018748A3 Computer disk substrate, the process for making same, and the material made therefrom
08/14/1996EP0726642A1 High frequency surface mount transformer-diode power module
08/14/1996EP0726621A2 Anisotropically conductive composite medium and devices interconnected thereby
08/14/1996EP0726620A2 Apparatus for providing controlled impedance in an electrical contact
08/14/1996EP0726599A2 Method of manufacturing semiconductor device having multilayer wiring structure, with improved version of step of forming interlayer dielectric layer
08/14/1996EP0726597A2 Direct etch for thin film resistor using a hard mask
08/14/1996EP0726330A1 Heat sinks and process for producing the same
08/14/1996DE19605254A1 Multi-stage CVD process for semiconductor device mfr.
08/14/1996DE19504684A1 Semiconductor device with silicone ladder resin film
08/14/1996DE19504543A1 Verfahren zur Formung von Anschlußhöckern auf elektrisch leitenden mikroelektronischen Verbindungselementen zum lothöcker-freien Tab-Bonden A method for forming bumps on connection electrically conductive microelectronic connection elements for free solder bump TAB bonding
08/14/1996DE19504378A1 Multiple layer ceramic substrate for electronic circuit
08/14/1996CN1128901A Method for mfg. encapsulated substrate type semiconductor device
08/13/1996US5546417 Semiconductor architecture and application thereof
08/13/1996US5546297 Apparatus for modifying an electrical signal
08/13/1996US5546279 Flexible wiring board having a terminal array extending along a whole edge of its substrate and a connection structure of the flexible wiring board with a circuit board
08/13/1996US5546275 Electrical module mounting apparatus
08/13/1996US5546049 Frequency scalable pre-matched transistor
08/13/1996US5545927 Seed layers of chromium and copper
08/13/1996US5545925 Semiconductor device having a metallic silicide layer for improved operational rates
08/13/1996US5545924 Three dimensional package for monolithic microwave/millimeterwave integrated circuits
08/13/1996US5545923 Semiconductor device assembly with minimized bond finger connections
08/13/1996US5545922 Dual sided integrated circuit chip package with offset wire bonds and support block cavities
08/13/1996US5545921 Personalized area leadframe coining or half etching for reduced mechanical stress at device edge
08/13/1996US5545920 Leadframe-over-chip having off-chip conducting leads for increased bond pad connectivity
08/13/1996US5545919 Semiconductor device and method of fabricating the same
08/13/1996US5545915 Semiconductor device having field limiting ring and a process therefor
08/13/1996US5545912 Electronic device enclosure including a conductive cap and substrate
08/13/1996US5545906 Non-volatile semiconductor memory device with contamination protection layers
08/13/1996US5545904 Personalizable gate array devices
08/13/1996US5545850 Guard ring for integrated circuit package
08/13/1996US5545846 Laser bond header
08/13/1996US5545598 Consists of atleast one of molybdenum and tungsten and 1 or more weight percent ceramic; used for integrated circuits
08/13/1996US5545593 Method of aligning layers in an integrated circuit device
08/13/1996US5545590 Intermetallic collar of aluminum copper is formed by single or multiple step
08/13/1996US5545572 Method for fabricating electrostatic discharge protecting transistor
08/13/1996US5545570 Method of inspecting first layer overlay shift in global alignment process
08/13/1996US5545473 Porous fluoropolymer with thermally conductive particles embedded within; for thermal conduction between electronic components
08/13/1996US5545291 Transferring shaped block with fluid
08/13/1996US5545050 IC socket
08/13/1996US5544696 Enhanced nucleate boiling heat transfer for electronic cooling and thermal energy transfer
08/13/1996US5544412 Method for coupling a power lead to a bond pad in an electronic module
08/13/1996CA2096983C Radiator assembly for substrate
08/08/1996WO1996024164A1 Integrated circuits with borderless vias
08/08/1996WO1996024163A1 Process for producing a glass-coated article and article produced thereby
08/08/1996WO1996024162A1 Chip housing and process for producing it
08/08/1996WO1996024159A1 Semiconductor device
08/08/1996WO1996023612A1 Methods of making multi-layer laminate substrates for electronic device packaging
08/08/1996DE19604451A1 Semiconductor module mfr. appts. for circuit board press forming
08/08/1996DE19600393A1 Heat deformation absorbent conductive frame for semiconductor device
08/08/1996DE19542883A1 Electronic chip package with conductive tracks on inside of cover
08/08/1996DE19531691A1 Contact connection device for semiconductor multi layer wiring structure
08/08/1996DE19512191C1 Plastic card-form data carrier for use as smart card or memory card
08/08/1996DE19503641A1 Schichtstruktur mit einer Silicid-Schicht, sowie Verfahren zur Herstellung einer solchen Schichtstruktur Layered structure with a silicide layer, and methods for producing such layered structure
08/08/1996CA2169003A1 Apparatus for providing controlled impedance in an electrical contact
08/07/1996EP0725448A2 Superconducting ceramics elongated body and method of manufacturing the same
08/07/1996EP0725445A1 Comb-shaped field effect transistor
08/07/1996EP0725441A2 Microwave monolithic integrated circuit package with improved RF ports
08/07/1996EP0725440A2 Silicon carbide metal diffusion barrier layer
08/07/1996EP0725439A2 Electronic parts with metal wiring and manufacturing method thereof
08/07/1996EP0725438A2 Capacitor built-in type substrate
08/07/1996EP0725437A2 Semiconductor device, method of fabricating the same and copper leads
08/07/1996EP0725433A2 leadframe and method of fabrication
08/07/1996EP0725431A2 Method for forming ordered titanium nitride and titanium silicide upon a semiconductor wafer using a three step anneal process
08/07/1996EP0725428A2 Thin film multi-layer oxygen diffusion barrier consisting of aluminum on refractory metal
08/07/1996EP0725407A1 Three-dimensional integrated circuit inductor
08/07/1996EP0724930A1 Device comprising solder bumps formed on a substrate and process for producing these solder bumps
08/07/1996EP0724778A1 Anodized aluminum electronic package components
08/07/1996CN1128405A Method for forming micro contacts of semiconductor device
08/06/1996US5544070 Programmed programmable device and method for programming antifuses of a programmable device
08/06/1996US5544069 Structure having different levels of programmable integrated circuits interconnected through bus lines for interconnecting electronic components
08/06/1996US5544018 Electrical interconnect device with customizeable surface layer and interwoven signal lines
08/06/1996US5544017 Multichip module substrate
08/06/1996US5544013 CPU radiating flange mounting device
08/06/1996US5543946 Liquid crystal device and display apparatus with multilayer electrodes
08/06/1996US5543664 Ultra high density integrated circuit package
08/06/1996US5543663 Semiconductor device and BGA package
08/06/1996US5543662 Integrated circuit package
08/06/1996US5543661 Semiconductor ceramic package with terminal vias
08/06/1996US5543660 Stackable vertical thin package/plastic molded lead-on-chip memory cube
08/06/1996US5543658 Method of manufacturing resin-sealed semiconductor device, lead frame used in this method for mounting plurality of semiconductor elements, and resin-sealed semiconductor device
08/06/1996US5543657 Electronic package
08/06/1996US5543656 Metal to metal antifuse
08/06/1996US5543651 Semiconductor integrated circuit device
08/06/1996US5543640 Logical three dimensional interconnections between integrated circuit chips using a two dimensional multi-chip module
08/06/1996US5543632 Circuit for controllable driving a load
08/06/1996US5543586 Apparatus having inner layers supporting surface-mount components
08/06/1996US5543585 Direct chip attachment (DCA) with electrically conductive adhesives
08/06/1996US5543584 Substrate having active or passive electrical components on surface with protective coating; printed circuits
08/06/1996US5543364 Hydrogen out venting electronic package
08/06/1996US5543363 Process for adhesively attaching a semiconductor device to an electrode plate
08/06/1996US5543361 Process for forming titanium silicide local interconnect
08/06/1996US5543360 Method of making a semiconductor device with sidewall etch stopper and wide through-hole having multilayered wiring structure
08/06/1996US5543359 Method of forming a titanium silicide film involved in a semiconductor device
08/06/1996US5543357 Process of manufacturing a semiconductor device by filling a via hole in an interlayered film of the device with wiring metal
08/06/1996US5543343 Method fabricating an integrated circuit
08/06/1996US5543340 Method for manufacturing offset polysilicon thin-film transistor
08/06/1996US5543187 Amorphous metal - ceramic composite material
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