Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
08/1996
08/29/1996WO1996026546A2 Charge-coupled imaging device having anti-blooming protection and two sets of readout registers
08/29/1996WO1996026544A1 Method of forming a dram bit line contact
08/29/1996WO1996026542A1 Semiconductor processing method of forming an electrically conductive contact plug
08/29/1996WO1996026541A1 Tunneling technology for reducing intra-conductive layer capacitance
08/29/1996WO1996026540A1 Semiconductor device
08/29/1996WO1996026030A1 Heat-sinking structures and electrical sockets for use therewith
08/29/1996WO1996018109A3 An integrated resistor for sensing electrical parameters
08/29/1996DE2858818C2 Data carrier with microprocessor
08/29/1996DE19607328A1 Semiconductor source voltage stabilisation device for internal logic cell
08/29/1996DE19529237C1 High power semiconductor circuit device
08/29/1996DE19506093A1 Diodenlaserbauelement Diode laser component
08/29/1996DE19506091A1 Cooling element in form of multiple substrate
08/29/1996CA2213515A1 Heat-sinking structures and electrical sockets for use therewith
08/28/1996EP0729187A2 Non-volatile semiconductor memory device and method of manufacturing the same
08/28/1996EP0729183A2 Thin packaging of multi-chip modules with enhanced thermal/power management
08/28/1996EP0729182A2 Chip carrier and method of manufacturing and mounting the same
08/28/1996EP0729181A2 Resin sealing type semiconductor device and method of making the same
08/28/1996EP0729180A2 Packaging multi-chip modules without wirebond interconnection
08/28/1996EP0729179A1 Pressure contact housing for semiconductor component
08/28/1996EP0729178A1 Rework process for semiconductor chips mounted on an organic substrate
08/28/1996EP0728716A1 Dielectric ceramic
08/28/1996EP0728405A1 Device for removing heat dissipated by an electronic or electro-mechanical component
08/28/1996EP0500690B1 Multi-layer lead frames for integrated circuit packages
08/28/1996CN1129993A A horizontally twisted-pair planar conductor line structure
08/28/1996CN1129853A A method for forming a plug in a semiconductor device
08/28/1996CN1032671C Self-shielding semiconductor components
08/27/1996US5550941 Optoelectronic interface module
08/27/1996US5550773 Semiconductor memory having thin film field effect selection transistors
08/27/1996US5550711 Ultra high density integrated circuit packages
08/27/1996US5550427 Substrate contact electrode having refractory metal bump structure with reinforcement sidewall film
08/27/1996US5550409 Semiconductor device having internal wire and method of fabricating the same
08/27/1996US5550408 Semiconductor device
08/27/1996US5550407 Package
08/27/1996US5550406 Multi-layer tab tape having distinct signal, power and ground planes and wafer probe card with multi-layer substrate
08/27/1996US5550405 Processing techniques for achieving production-worthy, low dielectric, low interconnect resistance and high performance ICS
08/27/1996US5550404 Electrically programmable antifuse having stair aperture
08/27/1996US5550403 Improved laminate package for an integrated circuit and integrated circuit having such a package
08/27/1996US5550402 Electronic module of extra-thin construction
08/27/1996US5550401 Lead on chip semiconductor device having bus bars and crossing leads
08/27/1996US5550400 Nonstoichiometric silicon nitride antifuse film between electrodes on substrate and floating gate electrode; field programmable gate arrays
08/27/1996US5550399 Integrated circuit with windowed fuse element and contact pad
08/27/1996US5550326 Heat dissipator for electronic components
08/27/1996US5550325 Printed-circuit board including circuit pattern having location to be cut if necessary
08/27/1996US5550282 Curable composition comprising partially trimerized prepolymer of aromatic dicyanate ester
08/27/1996US5550087 Process for bonding a semiconductor die to a variable die size inner lead layout
08/27/1996US5550086 Ceramic chip form semiconductor diode fabrication method
08/27/1996US5550083 Process of wirebond pad repair and reuse
08/27/1996US5550071 Method for forming micro contacts of semiconductor device
08/27/1996US5550068 Sidewall plating to deposit metal layers in deep cavities through window in masking layer to form gate, source, and drain electrodes
08/27/1996US5549925 Delidding leaking header, forming a vacuum, flowing a flow of helium to detect leakage, applying silicon resin sealant to form resealed leads, curing, and testing
08/27/1996US5549835 Apparatus equipped with a cooling block unit having sliding parts and a compound used to the same
08/27/1996US5549716 Process for manufacturing integrated circuits using an automated multi-station apparatus including an adhesive dispenser and apparatus therefor
08/27/1996US5549155 Integrated circuit cooling apparatus
08/27/1996US5548890 Lead frame processing method
08/27/1996US5548884 Method of manufacturing a known good die array
08/27/1996CA2051606C Multi-layer wiring board
08/25/1996CA2166925A1 Thin packaging of multi-chip modules with enhanced thermal/power management
08/22/1996WO1996025839A1 Multiple chip module mounting assembly and computer using same
08/22/1996WO1996025766A1 An improved antifuse with double via, spacer-defined contact and method of manufacture therefor
08/22/1996WO1996025763A2 Organic chip carriers for wire bond-type chips
08/22/1996WO1996025761A1 Integrated circuit interconnect using dual poly process
08/22/1996WO1996025535A1 Device having a switch comprising a chromium layer and method for depositing chromium layers by sputtering
08/22/1996WO1996018749A3 Hard disk drive components and methods of making same
08/22/1996DE19545518A1 Semiconductor substrate e.g. single crystal silicon wafer
08/22/1996DE19506010A1 Fire-resistant reaction resin system
08/21/1996EP0727872A1 Piezoelectric oscillator, voltage-controlled oscillator, and production method thereof
08/21/1996EP0727819A2 Stucked arranged semiconductor device and manufacturing method for the same
08/21/1996EP0727818A1 Zirconia-added alumina substrate with direct bonding of copper
08/21/1996EP0726925A1 Electrically conductive adhesives
08/21/1996EP0560832B1 Coin validators
08/21/1996EP0560787B1 Method of marking semiconductor chips manufactured together on a wafer and then separated.
08/21/1996CN1129367A 高压截断半导体器件 High-voltage cut-off semiconductor devices
08/21/1996CN1129357A Method and apparatus for retention of a fragile conductive trace with a protective clamp
08/21/1996CN1129339A Electrically conductive paste materials and applications
08/21/1996CN1032614C Method for making single or multiple layer circuit parttern
08/20/1996US5548487 Flat circuit module mounting using an elastic pad in a depression of a circuit board
08/20/1996US5548486 Pinned module
08/20/1996US5548482 Semiconductor integrated circuit apparatus including clamped heat sink
08/20/1996US5548161 Semiconductor apparatus capable of cooling a semiconductor element with low radiation efficiency
08/20/1996US5548160 Method and structure for attaching a semiconductor die to a lead frame
08/20/1996US5548159 Semiconductor device
08/20/1996US5548133 Insulated gate bipolar transistor
08/20/1996US5548118 Hybrid integrated circuit
08/20/1996US5548099 Method for making an electronics module having air bridge protection without large area ablation
08/20/1996US5548091 Semiconductor chip connection components with adhesives and methods for bonding to the chip
08/20/1996US5548090 Heat sink and printed circuit board combination
08/20/1996US5548087 Molded plastic packaging of electronic devices
08/20/1996US5547908 Titanium, magnesium, strontium oxide
08/20/1996US5547901 Aluminum film as oxidation barrier
08/20/1996US5547896 Direct etch for thin film resistor using a hard mask
08/20/1996US5547740 Solderable contacts for flip chip integrated circuit devices
08/20/1996US5547730 Device having a mounting board and method for applying a passivating gel
08/20/1996US5547713 Dual cure epoxy backseal formulation
08/20/1996US5547703 Method of forming si-o containing coatings
08/20/1996US5547028 Downhole system for extending the life span of electronic components
08/20/1996US5546655 Method of applying flex tape protective coating onto a flex product
08/20/1996CA2060979C Ceramic composite material and process for producing the same
08/15/1996WO1996025023A1 Method of forming a fluorinated silicon oxide layer using plasma chemical vapor deposition
08/15/1996WO1996024952A1 Layered structure with a silicide layer, and process for producing such a layered structure
08/15/1996WO1996024950A1 Process for shaping connection bumps on electrically-conductive microelectronic connection components for bumpless tab bonding
1 ... 2043 2044 2045 2046 2047 2048 2049 2050 2051 2052 2053 2054 2055 2056 2057 2058 2059 2060 2061 2062 2063 ... 2262