Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/1996
09/17/1996US5557066 Plastic molding compound, loading compound and wetting agents
09/17/1996US5556814 Method of forming wirings for integrated circuits by electroplating
09/17/1996US5556811 Method of optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereon
09/17/1996US5556810 Method for manufacturing a semiconductor device wherein a semiconductor chip is connected to a lead frame by metal plating
09/17/1996US5556807 Advance multilayer molded plastic package using mesic technology
09/17/1996US5556805 Method for producing semiconductor device having via hole
09/17/1996US5556506 Plasma ignitor, etching
09/17/1996US5556023 Method of forming solder film
09/17/1996US5555928 Liquid cooled cooling device
09/12/1996WO1996028005A1 A movable heat pipe apparatus for reducing heat build up in electronic devices
09/12/1996WO1996027932A1 Power supply circuit and corresponding mounting configuration
09/12/1996WO1996027903A1 Heat sink for integrated circuit packages
09/12/1996WO1996027901A1 Improved semiconductor contacts to thin conductive layers
09/12/1996WO1996027900A1 Method of production of semiconductor device and sealing pellet used for the method
09/12/1996WO1996027774A1 Heat sink assemblies
09/12/1996DE19609118A1 Resistance paste used in mfr. of ceramic circuit substrate
09/12/1996DE19608904A1 Highly pure silicone ladder polymer with high mol.wt. and prepolymer
09/12/1996DE19608484A1 Circuit substrate with highly reliable bonding
09/12/1996CA2214421A1 Heat sink assemblies
09/12/1996CA2211880A1 A movable heat pipe apparatus for reducing heat build up in electronic devices
09/11/1996EP0731525A2 Three-wire-line vertical interconnect structure for multilevel substrates
09/11/1996EP0731507A1 Electrode materials
09/11/1996EP0731506A2 Package for semiconductor device
09/11/1996EP0731505A2 Semiconductor leadframe structure and method of manufacturing the same
09/11/1996EP0730781A1 A lead frame having layered conductive planes
09/11/1996EP0668010B1 Device for bending leads of a lead frame
09/11/1996CN1130958A 多芯片模块 A multi-chip module
09/11/1996CN1130807A Lead frame and manufacturing method thereof
09/10/1996US5555488 Integrated circuit device having improved post for surface-mount package
09/10/1996US5554889 Homogenous alloy of aluminum, copper and tungsten
09/10/1996US5554888 Semiconductor device wiring structure
09/10/1996US5554887 Plastic molded semiconductor package
09/10/1996US5554886 Lead frame and semiconductor package with such lead frame
09/10/1996US5554885 Semiconductor device including means for dispersing and absorbing tensile forces acting on film tape
09/10/1996US5554881 Constitution of an electrode arrangement in a semiconductor element
09/10/1996US5554864 Semiconductor device having improved coverage with increased wiring layers
09/10/1996US5554824 IC package and packaging method for the same
09/10/1996US5554823 Packaging device and its manufacturing method
09/10/1996US5554709 Moisture-curing alkoxysilane-terminated polyurethanes
09/10/1996US5554684 Forming polyimide coating by screen printing
09/10/1996US5554569 Method and apparatus for improving interfacial adhesion between a polymer and a metal
09/10/1996US5554554 Process for fabricating two loads having different resistance levels in a common layer of polysilicon
09/10/1996US5554305 Applying and ablating specified material over a substrate
09/10/1996US5553394 Radial jet reattachment nozzle heat sink module for cooling electronics
09/06/1996WO1996027282A1 A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology
09/06/1996WO1996027280A1 Thermally and electrically enhanced ball grid package
09/06/1996WO1996027212A1 An improved laser ablateable material
09/06/1996WO1996027210A2 Electronic component comprising a thin-film structure with passive elements
09/06/1996WO1996027209A1 Arrangement of electronic components on a carrier strip
09/06/1996CA2214109A1 An improved laser ablateable material
09/06/1996CA2189233A1 A low cost, high performance package for microwave circuits in the up to 90 ghz frequency range using bga i/o rf port format and ceramic substrate technology
09/05/1996DE19607974A1 Wiring arrangement switching body with associated circuit board and body
09/05/1996DE19507547A1 Assembly of semiconductor chips using double-sided supporting plate
09/05/1996DE19507132A1 Anordnung von elektronischen Bauelementen auf einem Trägerstreifen Arrangement of electronic components on a carrier strip
09/04/1996EP0730332A1 Semiconductor component with electrostatic discharge protection structure
09/04/1996EP0730298A2 A dielectric, a manufacturing method thereof, and semiconductor device using the same
09/04/1996EP0730297A1 Metal wiring layer for semiconductor device and method for manufacturing the same
09/04/1996EP0730296A2 Leadframe for plastic-encapsulated semiconductor device, semiconductor device using the same, and manufacturing method for the leadframe
09/04/1996EP0730295A2 Semiconductor device with good thermal behaviour
09/04/1996EP0730294A2 Semiconductor device fabricating method of semiconductor device, and die-bonding method of semiconductor device
09/04/1996EP0729669A1 Dual-sided push-pull amplifier
09/04/1996EP0729659A1 Improved semiconductor architecture and application therefor
09/04/1996EP0729652A1 Contact structure for interconnections, interposer, semiconductor assembly and method
09/04/1996EP0729650A1 Solderable connector for high density electronic assemblies
09/04/1996EP0729647A1 Diamond shaped gate mesh for cellular mos transistor array
09/04/1996EP0729646A1 Electronic system circuit package
09/04/1996EP0729645A1 A high density integrated circuit assembly combining leadframe leads with conductive traces
09/04/1996EP0729644A1 Multi-chip electronic package module utilizing an adhesive sheet
09/04/1996CN1130440A Heat insulating plate and heat insulating method using same
09/04/1996CN1130421A Heat insulation plate and heat insulating method using same
09/04/1996CN1130306A Semiconductor and its producing method
09/04/1996CN1130257A Ic carrier
09/03/1996US5553163 Polytomous segmentation process
09/03/1996US5552999 Digital histogram generator systems and methods
09/03/1996US5552966 Semiconductor device having an interconnecting circuit board and method for manufacturing same
09/03/1996US5552963 Bus communication system for stacked high density integrated circuit packages
09/03/1996US5552951 Semiconductor package electrostatic discharge damage protection
09/03/1996US5552639 Resin molded type semiconductor device having a conductor film
09/03/1996US5552638 Semiconductors
09/03/1996US5552637 Semiconductor device
09/03/1996US5552636 Discrete transitor assembly
09/03/1996US5552635 High thermal emissive semiconductor device package
09/03/1996US5552634 Method and apparatus for dissipating heat in an electronic device
09/03/1996US5552632 Plate-shaped external storage device and method of producing the same
09/03/1996US5552631 Semiconductor device assembly including power or ground plane which is provided on opposite surface of insulating layer from signal traces, and is exposed to central opening in insulating layer for interconnection to semiconductor die
09/03/1996US5552630 Thin film transistor having metallic light shield
09/03/1996US5552628 Semiconductor device and method of manufacturing the same
09/03/1996US5552627 Electrically programmable antifuse incorporating dielectric and amorphous silicon interlayers
09/03/1996US5552623 Dynamic random access memory
09/03/1996US5552615 Active matrix assembly with double layer metallization over drain contact region
09/03/1996US5552607 Imager device with integral address line repair segments
09/03/1996US5552563 Shielded low noise multi-lead contact
09/03/1996US5552503 For use in the microelectronics industry, polyacetylenes
09/03/1996US5552345 Die separation method for silicon on diamond circuit structures
09/03/1996US5552341 Semiconductor device and method for manufacturing the same
09/03/1996US5552232 Aluminum nitride body having graded metallurgy
09/03/1996US5552181 Method for supplying liquid material and process for forming thin films using the liquid material supplying method
09/03/1996US5552107 Aluminum nitride body having graded metallurgy
09/03/1996US5551216 Method and apparatus for filling a ball grid array
08/1996
08/29/1996WO1996026560A1 Diode laser component with cooling element and diode laser module
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