Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1996
10/01/1996US5560423 Flexible heat pipe for integrated circuit cooling apparatus
10/01/1996US5560241 Synthetic single crystal diamond for wire drawing dies
09/1996
09/26/1996WO1996029850A1 Clip for preventing heat sink for cpu/mpu from coming off
09/26/1996WO1996029743A1 Semiconductor device of the type sealed in glass having a silver-copper bonding layer between slugs and connection conductors
09/26/1996WO1996029740A1 Semiconductor device and production method therefor
09/26/1996WO1996029737A1 A high density integrated circuit assembly combining leadframe leads with conductive traces
09/26/1996WO1996029736A1 Silicon nitride circuit substrate
09/26/1996WO1996029735A1 Semiconductor device of the type sealed in glass comprising a semiconductor body connected to slugs by means of a silver-aluminium bonding layer
09/26/1996WO1996029730A1 Laminating method using laminating film-like organic die-bonding material, die-bonding method, laminating device, die-bonding device, semiconductor device and method for manufacturing semiconductor device
09/26/1996WO1996029553A1 Cooling system for electronics
09/26/1996WO1996022669A3 Radiation shielding of integrated circuits and multi-chip modules in ceramic and metal packages
09/26/1996DE19611407A1 Semiconductor hybrid circuit is encapsulated as single in-line or dual in-line package
09/26/1996DE19610853A1 Cooler appts. for electronic component, e.g. rectifier diode
09/26/1996DE19610852A1 Electronic component cooler appts. for rectifier diode and LSI chip
09/26/1996DE19610851A1 Cooler device for electronic component, e.g. rectifier diode
09/26/1996DE19510318A1 Epitaxial growth of cpd. semiconductor layers, esp. Gp=III nitride layers, on substrate
09/26/1996DE19507662A1 Power circuit cooling method for central processing unit of computer
09/26/1996CA2215501A1 Cooling system for electronics
09/25/1996EP0734066A1 Electronic power module
09/25/1996EP0734065A2 Chip sized semiconductor device
09/25/1996EP0734064A2 Material for forming wiring layer and wiring forming method
09/25/1996EP0734063A2 Integrated circuit micromodule obtained by continuous assembly of patterned strips
09/25/1996EP0734062A2 Heat sink for semiconductor device or similar
09/25/1996EP0734061A2 Hermetic sealing of integrated circuits or hybrid systems
09/25/1996EP0734059A2 Chip sized semiconductor device and a process for making it
09/25/1996EP0733906A1 Electronic die package assembly having a support and method
09/25/1996CN1132003A Semiconductor device
09/25/1996CN1131897A Circuit substrate having interconnection leads and fabrication process thereof
09/25/1996CN1131823A Power integrated circuit
09/25/1996CN1131817A Method for forming multilevel interconnections in semiconductor device
09/24/1996US5559817 Complaint layer metallization
09/24/1996US5559674 Heat sink and mounting structure for heat sink
09/24/1996US5559444 Method and apparatus for testing unpackaged semiconductor dice
09/24/1996US5559374 Hybrid integrated circuit
09/24/1996US5559373 Hermetically sealed surface mount diode package
09/24/1996US5559372 Thin soldered semiconductor package
09/24/1996US5559369 Ground plane for plastic encapsulated integrated circuit die packages
09/24/1996US5559367 Diamond-like carbon for use in VLSI and ULSI interconnect systems
09/24/1996US5559366 Lead frame for wire bonding
09/24/1996US5559365 Semiconductor device including a plurality of leads each having two end portions extending downward and upward
09/24/1996US5559364 Leadframe
09/24/1996US5559363 Off-chip impedance matching utilizing a dielectric element and high density interconnect technology
09/24/1996US5559362 Semiconductor device having double metal connection layers connected to each other and to the substrate in the scribe line area
09/24/1996US5559361 Semiconductor component
09/24/1996US5559359 Microwave integrated circuit passive element structure and method for reducing signal propagation losses
09/24/1996US5559316 Plastic-molded semiconductor device containing a semiconductor pellet mounted on a lead frame
09/24/1996US5559306 Electronic package with improved electrical performance
09/24/1996US5559305 Semiconductor package having adjacently arranged semiconductor chips
09/24/1996US5559056 Method and apparatus for capping metallization layer
09/24/1996US5559054 Method for ball bumping a semiconductor device
09/24/1996US5559047 Method of reliably manufacturing a semiconductor device having a titanium silicide nitride
09/24/1996US5559046 Semiconductor device having a hollow around a gate electrode and a method for producing the same
09/24/1996US5558928 Multi-layer circuit structures, methods of making same and components for use therein
09/24/1996US5558795 Module encapsulation by induction heating
09/24/1996US5558523 Pad on pad type contact interconnection technology for electronic apparatus
09/24/1996US5558271 Shaped, self-aligning micro-bump structures
09/24/1996US5558155 Cooling apparatus and assembling method thereof
09/24/1996US5557844 Method of preparing a printed circuit board
09/24/1996US5557842 Method of manufacturing a semiconductor leadframe structure
09/22/1996CA2172206A1 Electronic power module
09/19/1996WO1996028860A1 A package housing multiple semiconductor dies
09/19/1996WO1996028848A1 Low-emi device circuit and its structure
09/19/1996WO1996028847A1 Electronic device comprising means for compensating an undesired capacitance
09/19/1996WO1996028846A1 Heat sink
09/19/1996WO1996028845A1 Process for making a z-axis adhesive and establishing electrical interconnection therewith
09/19/1996DE19541334A1 Mfg. printed circuit assembly for construction of sub-assemblies in e.g. microwave electronic equipment
09/19/1996DE19513619C1 Power and control semiconductor combination
09/19/1996DE19509554A1 Multilayer circuit manufacturing method for ceramic capacitor
09/19/1996DE19509203A1 Semiconductor device manufacturing method
09/18/1996EP0732745A2 Microstrip microwave package
09/18/1996EP0732744A2 Resin sealing type semiconductor device and method of making the same
09/18/1996EP0732743A2 Heat sinks
09/18/1996EP0732742A2 Removable heat sink assembly for a chip package
09/18/1996EP0732741A2 Heat sinks
09/18/1996EP0732740A2 Semiconductor device with plastic encapsulation
09/18/1996EP0732739A1 Improvements in crystal substrate processing
09/18/1996EP0732736A2 Semiconductor package for flip-chip mounting process
09/18/1996EP0732107A2 Circuit substrate shielding device
09/18/1996EP0731984A1 Rectifier diode
09/18/1996EP0683967B1 Housing for an electronic circuit
09/18/1996EP0642698B1 Fluid-cooled power transistor arrangement
09/18/1996CN1131303A Non-contact type IC card and method and apparatus for manufacturing the same
09/17/1996US5557573 Entire wafer stress test method for integrated memory devices and circuit therefor
09/17/1996US5557534 Forming array with metal scan lines to control semiconductor gate lines
09/17/1996US5557504 Surface mountable integrated circuit package with detachable module
09/17/1996US5557503 Circuit card having a large module strain relief and heat sink support
09/17/1996US5557502 Structure of a thermally and electrically enhanced plastic ball grid array package
09/17/1996US5557501 Compliant thermal connectors and assemblies incorporating the same
09/17/1996US5557195 Method and apparatus for evaluating electrostatic discharge conditions
09/17/1996US5557150 Overmolded semiconductor package
09/17/1996US5557149 Semiconductor fabrication with contact processing for wrap-around flange interface
09/17/1996US5557148 Hermetically sealed semiconductor device
09/17/1996US5557147 Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the same
09/17/1996US5557145 Mounting construction and method of a semiconductor device by which deformation of leads is prevented
09/17/1996US5557144 Plastic packages for microwave frequency applications
09/17/1996US5557143 Semiconductor device having two staggered lead frame stages
09/17/1996US5557142 Shielded semiconductor device package
09/17/1996US5557137 Voltage programmable link having reduced capacitance
09/17/1996US5557136 Programmable interconnect structures and programmable integrated circuits
09/17/1996US5557074 Coaxial line assembly of a package for a high frequency element
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