Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1996
10/09/1996EP0736903A2 Three-dimensional multi-chip module having stacked semiconductor chips and process of fabrication thereof
10/09/1996EP0736902A2 Integrated circuit device and method for fabricating integrated circuit device
10/09/1996EP0736901A1 Multiple colour marking of integrated circuit packages
10/09/1996EP0736896A2 Process for making low-leakage contacts
10/09/1996EP0736225A1 Method of attaching integrated circuit dies by rolling adhesives onto semiconductor wafers
10/09/1996CN2237280Y Axial plastic sealed two-way trigger diode
10/09/1996CN1132935A Semiconductor device and method of manufacturing the same
10/09/1996CN1132934A Semiconductor device
10/09/1996CN1132933A Heat sink
10/09/1996CN1132932A Getter housing for electronic packages
10/08/1996US5563773 Semiconductor module having multiple insulation and wiring layers
10/08/1996US5563768 Heat source cooling apparatus and method utilizing mechanism for dividing a flow of cooling fluid
10/08/1996US5563449 Semiconductor circuit chips with silicon chip substrates, pad layers, aluminum or alloy, adhesion layer of tungsten alloy and metal interconnector layer
10/08/1996US5563447 High power semiconductor switch module
10/08/1996US5563446 Surface mount peripheral leaded and ball grid array package
10/08/1996US5563445 Semiconductor device
10/08/1996US5563443 Packaged semiconductor device utilizing leadframe attached on a semiconductor chip
10/08/1996US5563442 For an electronic package
10/08/1996US5563441 Lead frame assembly including a semiconductor device and a resistance wire
10/08/1996US5563439 Variable operation speed MOS transistor
10/08/1996US5563380 Apparatus for mounting integrated circuit chips on a Mini-Board
10/08/1996US5563103 Method for manufacturing thermoplastic resin molded semiconductor
10/08/1996US5563102 Method of sealing integrated circuits
10/08/1996US5563101 Substrate for semiconductor apparatus
10/08/1996US5563100 Fabrication method of semiconductor device with refractory metal silicide formation by removing native oxide in hydrogen
10/08/1996US5563099 Providing aluminum alloy conductor having metal layer, covering with insulator, heating to form intermetallic between alloy and metal layer, forming opening in insulator, filling with second metal conductor
10/08/1996US5563089 Method of forming a bit line over capacitor array of memory cells and an array of bit line over capacitor array of memory cells
10/08/1996US5563076 Process for adjusting heights of plural semiconductor devices on a circuit board
10/08/1996US5562993 Semiconductor device with identification information
10/08/1996US5562973 Ceramic multi-layer wiring board
10/08/1996US5562971 Multilayer printed wiring board
10/08/1996US5562837 Method for connecting electronic circuits in a multi-chip module having a co-fired substrate and multi-chip module obtained thereby
10/08/1996US5562760 Copper on printed circuits
10/08/1996US5562492 Contact aligning structure in IC socket
10/08/1996US5562489 For use with a semiconductor chip package
10/08/1996US5562473 Socket apparatus having improved contact system
10/08/1996US5561984 Application of micromechanical machining to cooling of integrated circuits
10/03/1996WO1996031101A1 A method to prevent intrusions into electronic circuitry
10/03/1996WO1996031100A1 Package of electronic device
10/03/1996WO1996030974A1 Method of encapsulating a crystal oscillator
10/03/1996WO1996030944A2 Support module
10/03/1996WO1996030943A1 Thin profile integrated circuit package
10/03/1996WO1996030942A1 Components for housing an integrated circuit device
10/03/1996WO1996030935A2 Method of manufacturing an electronic multilayer component
10/03/1996WO1996030933A2 Solder bump fabrication methods and structure including a titanium barrier layer
10/03/1996WO1996030932A2 Microcircuit via interconnect
10/03/1996WO1996030867A1 Card-like data substrate and lead frame for use therein
10/03/1996CA2211913A1 Microcircuit via interconnect
10/02/1996EP0735806A1 Package board
10/02/1996EP0735640A1 Protection circuit for semiconductor devices
10/02/1996EP0735586A2 Semi-conductor structures
10/02/1996EP0735585A2 Integrated circuit interconnection employing tungsten/aluminum layers
10/02/1996EP0735584A2 Integrated circuit multi-level interconnection technique
10/02/1996EP0735583A2 Semi-conductor integrated circuits
10/02/1996EP0735582A1 Package for mounting an IC-chip
10/02/1996EP0735581A1 DRAM trench capacitor with insulating collar
10/02/1996EP0735579A1 Structure and method of coupling substrates
10/02/1996EP0735152A1 Molybdenum-tungsten material for wiring, molybdenum-tungsten target for wiring, process for producing the same, and molybdenum-tungsten wiring thin film
10/02/1996EP0734588A1 Integrated circuit package
10/02/1996EP0734587A1 Thin cavity down ball grid array package based on wirebond technology
10/02/1996EP0734586A1 Method for fabricating self-assembling microstructures
10/02/1996EP0438444B1 Aluminum alloy semiconductor packages
10/02/1996EP0424530B1 Resin-sealed semiconductor device
10/02/1996DE19611240A1 Conductive printing paste contg. silver@-based powder
10/02/1996DE19611239A1 Conductive paste for connections in ceramic electronic devices
10/02/1996DE19610302A1 Semiconductor encapsulation with numerous, external, intermediate connectors
10/02/1996DE19514548C1 Verfahren zur Herstellung einer Mikrokühleinrichtung A process for producing a micro cooling device
10/02/1996CN1132570A Patterned array of uniform metal microbeads
10/02/1996CN1132462A Multi-strand substrate for ball-grid array assemblies and method
10/02/1996CN1132412A 半导体器件 Semiconductor devices
10/02/1996CN1132410A Semiconductor device and method of manufacturing the same
10/01/1996US5561789 Power bus having power slits and holes embodied therein, and method for making the same
10/01/1996US5561623 Semiconductor storage device
10/01/1996US5561594 Circuit connection in an electrical assembly
10/01/1996US5561593 Z-interface-board
10/01/1996US5561592 Hybrid integrated circuit module
10/01/1996US5561591 Multi-signal rail assembly with impedance control for a three-dimensional high density integrated circuit package
10/01/1996US5561590 Heat transfer sub-assembly incorporating liquid metal surrounded by a seal ring
10/01/1996US5561373 Method and device for detecting electrostatic stress applied to a product semiconductor device during each production process
10/01/1996US5561329 Curable silicone compositions which contain either microparticles of a fluororesin which exhibits low adhesion to cured composition or microparticles of a material coated with the fluororesin
10/01/1996US5561327 Multilayer interconnection structure for a semiconductor device
10/01/1996US5561326 Large scale integrated circuit device
10/01/1996US5561325 Mounting structure and fastener for heat sink
10/01/1996US5561324 Semiconductor chip mounting sector
10/01/1996US5561323 Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
10/01/1996US5561322 Semiconductor chip package with enhanced thermal conductivity
10/01/1996US5561321 Ceramic-metal composite structure and process of producing same
10/01/1996US5561320 Silver spot/palladium plate lead frame finish
10/01/1996US5561319 Integrated circuit structure including CMOS devices protected by patterned nitride passivation and method for the fabrication thereof
10/01/1996US5561318 Porous composites as a low dielectric constant material for electronics applications
10/01/1996US5561315 Programmable semiconductor device with high breakdown voltage and high-density programmable semiconductor memory having such a semiconductor device
10/01/1996US5561303 Semiconductor structure
10/01/1996US5561265 Integrated circuit packaging
10/01/1996US5561174 Mixture of liquid epoxy resin, a polydimethylsiloxane and dispersant containing liquid epoxy reacted with a polydimethylsiloxane containing amino, carboxyl, ether, and/or phenyl groups; heat and stress resistance, noncracking
10/01/1996US5561086 Techniques for mounting semiconductor dies in die-receiving areas having support structure having notches
10/01/1996US5561085 Structure for protecting air bridges on semiconductor chips from damage
10/01/1996US5561084 Forming aluminum multilayer interconnections consisting of aluminum or aluminum alloy films having small specific resistance
10/01/1996US5561083 Method of making multilayered Al-alloy structure for metal conductors
10/01/1996US5561082 Heat treatment
10/01/1996US5560934 Cleavable diepoxide for removable epoxy compositions
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