Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
10/1996
10/29/1996US5569272 Tissue-connective devices with micromechanical barbs
10/29/1996US5569056 Electrical connection device and process for the production thereof
10/29/1996US5568684 Method of encapsulating an electronic device
10/29/1996US5568683 Method of cooling a packaged electronic device
10/29/1996US5568682 Orthogonal grid circuit interconnect method
10/29/1996CA2105039C Semiconductor device and wafer structure having a planar buried interconnect by wafer bonding
10/28/1996CA2175142A1 Epoxy resin, resin composition, and resin-encapsulated semiconductor device
10/24/1996WO1996033511A2 Method of manufacturing a progammable semiconductor device in the form of an anti-fuse
10/24/1996WO1996007198A3 A lead frame having layered conductive planes
10/24/1996DE19614584A1 Air-bridge wiring appts. for semiconductor monolithic microwave integrated circuit
10/24/1996DE19534604C1 Field effect power semiconductor element
10/24/1996DE19514545A1 Micro-cooling device for multiple microelectronic components
10/24/1996DE19514544A1 Micro cooling mounting unit for electronic device
10/23/1996EP0739042A1 Method of fabrication of a solar module
10/23/1996EP0739034A2 Integrated circuit device and fabricating method thereof
10/23/1996EP0738759A1 Epoxy resin composition for sealing photosemiconductor device
10/23/1996EP0738426A1 Spacer-based antifuse structure for low capacitance and high reliability and method of fabrication thereof
10/23/1996EP0738424A1 Integrated circuit passivation process and structure
10/23/1996EP0613590B1 Die mounting with uniaxial conductive adhesive
10/23/1996CN1134039A Arrangement for avoiding stripping of welding backing metal
10/22/1996USRE35353 Process for manufacturing a multi-layer lead frame
10/22/1996US5568363 Surface mount components and semifinished products thereof
10/22/1996US5568345 Overvoltage protection circuit
10/22/1996US5568057 Method for performing a burn-in test
10/22/1996US5567990 Silicon chips, encapsulation with epoxy resins to form packages, promoters for curing, release agents of polyethylene and silica fillers
10/22/1996US5567989 Highly integrated semiconductor wiring structure
10/22/1996US5567988 Integrated circuit interconnect structure with back reflection suppressing electronic "speed bumps"
10/22/1996US5567987 Semiconductor device having a multi-layer metallization structure
10/22/1996US5567986 Heat sink
10/22/1996US5567985 Electronic apparatus with compliant metal chip-substrate bonding layer(s)
10/22/1996US5567984 Process for fabricating an electronic circuit package
10/22/1996US5567983 Semiconductor apparatus capable of cooling a semiconductor element with radiation efficiency
10/22/1996US5567982 Air-dielectric transmission lines for integrated circuits
10/22/1996US5567981 Bonding pad structure having an interposed rigid layer
10/22/1996US5567968 Semiconductor device having SOI structure and method for fabricating the same
10/22/1996US5567917 Metal base board and electronic equipment using the same
10/22/1996US5567749 Curable diglycidyl biphenyl and naphthalene compound with one or more polyphenol compound curing agent to form polyepoxides; waterproofing, noncracking
10/22/1996US5567657 Fabrication and structures of two-sided molded circuit modules with flexible interconnect layers
10/22/1996US5567656 Process for packaging semiconductor device
10/22/1996US5567655 Method for forming interior bond pads having zig-zag linear arrangement
10/22/1996US5567654 Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
10/22/1996US5567653 Process for aligning etch masks on an integrated circuit surface using electromagnetic energy
10/22/1996US5567651 Self-aligned cobalt silicide on MOS integrated circuits
10/22/1996US5567649 Method of forming a conductive diffusion barrier
10/22/1996US5567643 Method of forming contamination guard ring for semiconductor integrated circuit applications
10/22/1996US5567330 Electroconductive film on substrate with dielectric material, depositing second electroconductive film to form substructures then depositing a superconductive film for epitaxial growth and patterns, then forming metal pads
10/22/1996US5567210 Method for making an electrochemical cell
10/22/1996US5567177 Surface mount chip carrier
10/22/1996US5567165 Fluid actuated connector/carrier for electric part
10/22/1996US5566752 High heat density transfer device
10/22/1996US5566749 Stamped and formed heat sink
10/22/1996US5566448 Method of construction for multi-tiered cavities used in laminate carriers
10/22/1996US5566441 Attaching an electronic circuit to a substrate
10/22/1996CA2106152C Cooling structure for electronic circuit package
10/17/1996WO1996032740A1 Process for passivating a silicon carbide surface against oxygen
10/17/1996DE4424549C2 Verfahren zum Gehäusen eines Leistungshalbleiterbauelements und durch dieses Verfahren hergestelltes Gehäuse A method of housings of a power semiconductor device manufactured by this method and housing
10/17/1996DE19522173C1 Power semiconductor module
10/17/1996DE19514162A1 Temperature indicator giving accurate results in high loss conduction
10/17/1996DE19514079A1 Verfahren zum Passivieren einer Siliciumcarbid-Oberfläche gegenüber Sauerstoff Method for passivating a silicon carbide surface to oxygen
10/17/1996DE19511775C1 Trägermodul, insb. zum Einbau in einen kartenförmigen Datenträger, mit Schutz gegen die Untersuchung geheimer Bestandteile Carrier module, esp. For installation in a card-shaped disk with protection against the investigation secret ingredients
10/16/1996EP0738007A2 Metal-base multilayer circuit substrate
10/16/1996EP0738005A2 Method of forming a landing pad structure in an integrated circuit
10/16/1996EP0738002A2 Stabilization of sheet resistance of electrical conductors
10/16/1996EP0737657A2 Process for obtaining a metal coated, metallised aluminium nitride ceramic component and the so obtained metal coated component
10/16/1996EP0737363A1 Integrated microwave semiconductor device with active and passive components
10/16/1996EP0737362A1 Layered low dielectric constant technology
10/16/1996EP0737361A1 A leadframe for an integrated circuit package which electrically interconnects multiple integrated circuit die
10/16/1996CN1133498A Installation for circuit elements
10/16/1996CN1133492A Correction technology for reducing integrated circuit temperature deviation and whole temperature range stepout
10/16/1996CN1033019C Crystal composition and usage
10/15/1996US5566052 Electronic devices with electromagnetic radiation interference shields and heat sinks
10/15/1996US5566051 Ultra high density integrated circuit packages method and apparatus
10/15/1996US5565709 Encapsulated with cured resin, linear thermal expansion
10/15/1996US5565708 Semiconductor device comprising composite barrier layer
10/15/1996US5565707 Interconnect structure using a Al2 Cu for an integrated circuit chip
10/15/1996US5565706 LSI package board
10/15/1996US5565705 Electronic module for removing heat from a semiconductor die
10/15/1996US5565704 Memory card having two types of memory integrated circuits connected to two different shaped connectors
10/15/1996US5565703 Multi-level antifuse structure
10/15/1996US5565702 Antifuse element, semiconductor device having antifuse elements, and method for manufacturing the same
10/15/1996US5565529 Graft polymerization a metallacyclobutane polysiloxane or organometallic polymer with a polyimide, thermal crosslinking
10/15/1996US5565385 Semiconductor bond pad structure and increased bond pad count per die
10/15/1996US5565384 Semiconductors, reducing capacitance
10/15/1996US5565380 Interconnecting lines
10/15/1996US5565378 Process of passivating a semiconductor device bonding pad by immersion in O2 or O3 solution
10/15/1996US5565372 Method of manufacturing a self-aligned bit line contact to a semiconductor device
10/15/1996US5565267 Composite substrates for preparation of printed circuits
10/15/1996US5565262 Electrical feedthroughs for ceramic circuit board support substrates
10/15/1996US5565235 Process for selectively depositing a nickel-boron coating over a metallurgy pattern on a dielectric substrate
10/15/1996US5565008 Process of raising a semiconductor device out of a pallet using a positioning rod
10/15/1996US5564182 Method for installing axial multiple
10/15/1996US5564181 Method of fabricating a laminated substrate assembly chips-first multichip module
10/11/1996CA2173681A1 Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith
10/10/1996WO1996031906A1 Multi-layer lead frame
10/10/1996WO1996031905A1 A solder bump structure for a microelectronic substrate
10/10/1996WO1996024625A3 Amorphous copolymers of tetrafluoroethylene and hexafluoropropylene
10/10/1996DE19507130A1 Silicon carbide device passivation with reduced field strength and barrier current
10/09/1996EP0737027A2 Integrated circuit testing board having constrained thermal expansion characteristics
10/09/1996EP0737025A1 Printed wiring board
10/09/1996EP0736913A2 Integrated electro-optic package
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