Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1996
11/07/1996WO1996034744A1 Fabrication of leads on semiconductor connection components
11/07/1996WO1996026546A3 Charge-coupled imaging device having anti-blooming protection and two sets of readout registers
11/07/1996WO1996025763A3 Organic chip carriers for wire bond-type chips
11/07/1996DE19542606A1 MIS transistor with three-layer, transistor insulating film
11/07/1996DE19523010A1 ASIC circuitry with power transistor and its energising circuit
11/07/1996DE19515189A1 Chip-Abdeckung Chip cover
11/07/1996DE19515188A1 Chip-Abdeckung Chip cover
11/07/1996DE19515187A1 Chip-Abdeckung Chip cover
11/06/1996EP0741507A1 Arrangement for integrated circuits and a method for mounting the same
11/06/1996EP0741417A2 Heterostructure field effect device having refractory ohmic contact directly on channel layer and method of making
11/06/1996EP0741411A2 Method of fabricating multi-chip packages
11/06/1996EP0741410A2 Semiconductor device and method for manufacturing the same
11/06/1996EP0741409A2 Heat sink for semiconductor devices
11/06/1996EP0741407A2 Process for filling openings in insulating layers and integrated circuit having such insulating layers
11/06/1996EP0741369A1 Method for coating an electric component and device for carrying out the method
11/06/1996EP0741193A1 Method of making flowable tungsten/copper composite powder
11/06/1996EP0740853A1 Semiconductor device with a carrier body on which a substrate with a semiconductor element is fastened by means of a glue layer and on which a pattern of conductor tracks is fastened
11/06/1996EP0740852A1 Methods and apparatus for producing integrated circuit devices
11/06/1996EP0740850A1 Hermetically sealed hybrid ceramic integrated circuit package
11/06/1996CN1135268A Contact structure for interconnections, interposer, semiconductor assembly and method
11/06/1996CN1135095A Semiconductor device and its related integrated circuit
11/06/1996CN1135094A Method for mfg. semiconductor device
11/06/1996CN1134962A Aqueous silver composition
11/05/1996US5572409 Apparatus including a programmable socket adapter for coupling an electronic component to a component socket on a printed circuit board
11/05/1996US5572405 Thermally enhanced ball grid array package
11/05/1996US5572404 Heat transfer module incorporating liquid metal squeezed from a compliant body
11/05/1996US5572346 Tape carrier for LCD driver package with anchor holes on either side of and spaced 0.2 mm to 10 mm from the chip mounting site
11/05/1996US5572072 Semiconductor device having a multi-layer metallization structure
11/05/1996US5572071 Semiconductor device having a multi-layer metallization structure
11/05/1996US5572070 Integrated circuit packages with heat dissipation for high current load
11/05/1996US5572069 Conductive epoxy grid array semiconductor packages
11/05/1996US5572068 Integrated double-chip semiconductor package and method for fabricating same
11/05/1996US5572067 For resisting propagation/formation of cracks in a circuit
11/05/1996US5572066 Lead-on-chip semiconductor device and method for its fabrication
11/05/1996US5572065 Hermetically sealed ceramic integrated circuit heat dissipating package
11/05/1996US5572064 Input-output drive reduction in a semiconductor integrated circuit
11/05/1996US5572062 Antifuse with silicon spacers
11/05/1996US5572061 ESD protection device for antifuses with top polysilicon electrode
11/05/1996US5572050 Fuse-triggered antifuse
11/05/1996US5571761 Strontium or barium titanate ceramics for semiconductors
11/05/1996US5571757 Aluminum-oxygen-carbon-nitrogen
11/05/1996US5571754 Method of fabrication of endcap chip with conductive, monolithic L-connect for multichip stack
11/05/1996US5571752 Method of forming a planar contact with a void
11/05/1996US5571751 Interconnect structures for integrated circuits
11/05/1996US5571746 Method of forming a back end capacitor with high unit capacitance
11/05/1996US5571741 Membrane dielectric isolation IC fabrication
11/05/1996US5571740 Method of making a capped modular microwave integrated circuit
11/05/1996US5571576 Method of forming a fluorinated silicon oxide layer using plasma chemical vapor deposition
11/05/1996US5571428 Semiconductor leadframe and its production method and plastic encapsulated semiconductor device
11/05/1996US5571034 Method of making an array of electrical components with leads attached and the product thereof
11/05/1996US5570506 Polyimide with low thermal expansion
11/05/1996US5570504 Multi-Layer circuit construction method and structure
11/05/1996US5570502 Fabricating metal matrix composites containing electrical insulators
11/05/1996CA2056737C Via resistors within multi-layer, 3-dimensional structure/substrates
11/05/1996CA2055802C Cooling structure for electronics devices
10/1996
10/31/1996WO1996034518A1 Precision clamp, and method for clamping thyristors and similar electronic power components
10/31/1996WO1996034413A1 Encapsulation of transmitter and receiver modules
10/31/1996WO1996034412A1 Protective coating combination for lead frames
10/31/1996WO1996034411A1 Chip cover
10/31/1996WO1996034410A1 Chip cover
10/31/1996WO1996034409A1 Chip cover
10/31/1996WO1996033863A1 Anodized aluminum substrate having increased breakdown voltage
10/31/1996WO1996027210A3 Electronic component comprising a thin-film structure with passive elements
10/31/1996DE19608858A1 Elektrisches Bauteil Electrical component
10/31/1996DE19515073A1 Clip for fastening electronic component, such as transistor, on to base
10/31/1996CA2216903A1 Encapsulation of transmitter and receiver modules
10/30/1996EP0740343A2 Structure of chip on chip mounting preventing crosstalk noise
10/30/1996EP0740342A2 Semiconductor device and wiring method
10/30/1996EP0740341A1 Connecting legs for electronic device
10/30/1996EP0740340A2 Structure and process for mounting semiconductor chip
10/30/1996EP0740338A2 Composite integrated circuit device
10/30/1996EP0740336A2 Method for fabricating semiconductor device having buried contact structure
10/30/1996EP0740332A2 Improvements in or relating to semiconductor integrated circuit devices
10/30/1996EP0739877A2 Epoxy resin, resin composition, and resin-encapsulated semiconductor device
10/30/1996EP0739541A1 Chamfered electronic package component
10/30/1996EP0739539A1 Process for filling contact holes
10/30/1996EP0739499A1 Method of forming polyimide patterns on substrates
10/30/1996CN1134604A Producing method for semiconductor device
10/30/1996CN1134603A Method for forming metal wiring of semiconductor device
10/30/1996CN1134601A Organic chip carriers for wire bond-type chips
10/30/1996CN1134397A Aluminum nitride body having graded metallurgy
10/29/1996US5570293 Method and device for manufacturing a semiconductor chip
10/29/1996US5570274 High density multichip module packaging structure
10/29/1996US5570273 Surface mountable integrated circuit package with low-profile detachable module
10/29/1996US5570272 Apparatus for encapsulating an integrated circuit package
10/29/1996US5570271 For use with an electrical component
10/29/1996US5570046 Lead frame with noisy and quiet VSS and VDD leads
10/29/1996US5569964 Semiconductor device
10/29/1996US5569961 Semiconductor device having a multi-layer metallization structure
10/29/1996US5569960 Electronic component, electronic component assembly and electronic component unit
10/29/1996US5569958 Electrically conductive, hermetic vias and their use in high temperature chip packages
10/29/1996US5569957 Low inductance conductor topography for MOSFET circuit
10/29/1996US5569956 Interposer connecting leadframe and integrated circuit
10/29/1996US5569955 High density integrated circuit assembly combining leadframe leads with conductive traces
10/29/1996US5569952 Semiconductor device with a semiconductor element provided in a mesa structure
10/29/1996US5569950 Device to monitor and control the temperature of electronic chips to enhance reliability
10/29/1996US5569948 Semiconductor device having a contact plug and contact pad
10/29/1996US5569879 Integrated circuit micromodule obtained by the continuous assembly of patterned strips
10/29/1996US5569625 Process for manufacturing a plural stacked leadframe semiconductor device
10/29/1996US5569618 Method for planarizing insulating film
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