Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/1996
11/26/1996US5578697 Polyimide precursor, bismaleimide-based cured resin precursor and electronic parts having insulating members made from these precursors
11/26/1996US5578660 Epoxy resin composition
11/26/1996US5578531 Mulilayer semiconductors formed with recesses, projections and insulating layers of silicon oxide layer over fluorine surfaces, polishing the layers
11/26/1996US5578527 Connection construction and method of manufacturing the same
11/26/1996US5578526 Method for forming a multi chip module (MCM)
11/26/1996US5578525 Semiconductor device and a fabrication process thereof
11/26/1996US5578524 Silicon and silicon dioxide with wires and insulation layers, buffer layers, etching and forming wire layer filling
11/26/1996US5578523 Method for forming inlaid interconnects in a semiconductor device
11/26/1996US5578519 Method for forming align key pattern in semiconductor device
11/26/1996US5578517 Method of forming a highly transparent silicon rich nitride protective layer for a fuse window
11/26/1996US5578423 Method for the preparation of a pattern overlay accuracy-measuring mark
11/26/1996US5578401 Photomask for the measurement of resolution of exposure equipment
11/26/1996US5578367 Metal base board and electronic equipment using the same
11/26/1996US5578366 Metal base board and electronic equipment using the same
11/26/1996US5578166 Etching a conductive film after forming a mask pattern on metal conductor and ion milling
11/26/1996US5578151 Manufacture of a multi-layer interconnect structure
11/26/1996US5577656 Method of packaging a semiconductor device
11/26/1996US5577617 Advanced technique for packaging multiple number of electrically stackable high voltage transistors in one package
11/26/1996US5577319 Method of encapsulating a crystal oscillator
11/26/1996CA2095609C Leadless pad array chip carrier
11/21/1996WO1996036996A1 Heat sink and retainer for electronic integrated circuits
11/21/1996WO1996036995A1 A heatsink and a method and an assembly for forming the same
11/21/1996WO1996036994A1 A heatsink and a method and an assembly for forming the same
11/21/1996WO1996036496A1 Semiconductor device
11/21/1996WO1996036456A1 Ic package processing and measuring method and apparatus therefor
11/21/1996WO1996036450A2 Fabricating metal matrix composites containing electrical insulators
11/21/1996WO1996030932A3 Microcircuit via interconnect
11/21/1996DE19620021A1 U=shaped trench MOS semiconductor power transistor device
11/21/1996DE19543540C1 Vertically integrated semiconductor component
11/20/1996EP0743681A2 Wiring board for electronic devices with high-density terminals and method for producing same
11/20/1996EP0743680A2 A conductor paste for plugging through-holes in ceramic circuit boards
11/20/1996EP0743679A2 Gold wire for chip bonding
11/20/1996EP0743677A2 Dummy Wafer
11/20/1996EP0742955A1 Improved low-cost package for electronic components
11/20/1996EP0742898A1 Device for imaging a three-dimensional object
11/20/1996CN1136366A Layout for radio frequency power transistors
11/20/1996CN1136221A Shell of semiconductor pressure contactor
11/20/1996CN1136220A Chip carrier and method of manufacturing and mounting the same
11/20/1996CN1136219A Manufacture of semiconductor device
11/19/1996US5576937 Connector including a connector body, an annular air-tight material and a closure plate to seal an IC
11/19/1996US5576934 Mounting unit for a multilayer hybrid circuit having power components including a copper coated ceramic center board
11/19/1996US5576933 Clamping heat sink for an electric device
11/19/1996US5576932 Method and apparatus for cooling a heat source
11/19/1996US5576648 Temperature stable circuit for controlled current discharge during the driving of an inductive load
11/19/1996US5576578 High voltage insulating disk
11/19/1996US5576577 Multi-layer lead-frame for a semiconductor device
11/19/1996US5576576 Above via metal-to-metal antifuse
11/19/1996US5576575 Semiconductor conversion device
11/19/1996US5576518 Via-structure of a multilayer interconnection ceramic substrate
11/19/1996US5576517 Low Dielectric constant materials for high speed electronics
11/19/1996US5576246 Personalized area leadframe coining or half etching for reduced mechanical stress at device edge
11/19/1996US5576236 Process for coding and code marking read-only memory
11/19/1996US5576223 Method of defect determination and defect engineering on product wafer of advanced submicron technologies
11/19/1996US5575872 Method for forming a ceramic circuit substrate
11/19/1996US5575610 Transport-by-suction type die
11/14/1996WO1996036205A1 Enhanced heat sink
11/14/1996WO1996036176A2 Image display apparatus with line number conversion
11/14/1996WO1996036075A2 Miniature semiconductor device for surface mounting
11/14/1996WO1996036074A1 Semiconductor device
11/14/1996WO1996036072A2 Method of manufacturing a device, by which method a substrate with semiconductor element and conductor tracks is glued to a support body with metallization
11/14/1996WO1996036071A2 Method of manufacturing a semiconductor device suitable for surface mounting
11/14/1996DE19531496C1 Power semiconductor module with high packing density, esp. current resetter
11/14/1996DE19516548A1 Abdeckkappe für elektronisches Bauelement Cap for electronic component
11/13/1996EP0742682A2 Low-profile socketed integrated circuit packaging system
11/13/1996EP0742681A2 Circuit card having a large module strain relief and heat sink support
11/13/1996EP0742639A2 Microwave oscillator, an antenna therefor and methods of manufacture
11/13/1996EP0742593A2 Semiconductor device with multilevel structured insulator and fabrication method thereof
11/13/1996EP0742589A1 Bond pad option for integrated circuits
11/13/1996EP0742585A1 Method and compositions for diffusion patterning tape on substrate
11/13/1996EP0742581A2 Sealed cavity arrangement
11/13/1996EP0742261A2 Semiconductor encapsulating epoxy resin compositions suitable for semiconductor encapsulation, their manufacture and use, semiconductor devices encapsulated therewith
11/13/1996EP0741910A1 Cavity-containing structure and method for making same
11/13/1996CN1135680A Piezoelectric oscillator and voltage-control oscillator, and manufacturing process thereof
11/13/1996CN1135657A Lead-wire frame for resin sealed semiconductor device and method for production of resin sealed semiconductor device
11/12/1996US5574959 Powder metallurgy injection molding
11/12/1996US5574630 Laminated electronic package including a power/ground assembly
11/12/1996US5574627 Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices
11/12/1996US5574626 Add-on heat sink
11/12/1996US5574415 Method of fabricating microwave interconnects and packaging and the interconnects and packaging
11/12/1996US5574395 Semiconductor circuit
11/12/1996US5574314 Packaged semiconductor device including shielded inner walls
11/12/1996US5574313 Hermetically sealed microwave integrated circuit package with ground plane fused to package frame
11/12/1996US5574312 Low-inductance power semiconductor module
11/12/1996US5574311 Semiconductor device
11/12/1996US5574310 Semiconductor package for surface mounting with reinforcing members on support legs
11/12/1996US5574309 Integrated circuit card comprising means for the protection of the integrated circuit
11/12/1996US5574285 Electromagnetic radiation detector and its production process
11/12/1996US5573978 Method of forming a metal wire in a semiconductor device
11/12/1996US5573971 Semiconductors
11/12/1996US5573970 Method for reducing contamination of anti-fuse material in an anti-fuse structure
11/12/1996US5573960 Method of manufacturing semiconductor layers by bonding without defects created by bonding
11/12/1996US5573959 Method of forming a liquid crystal device
11/12/1996US5573808 Method for producing a multilayer circuit
11/12/1996US5573427 For use in mounting an ic package
11/12/1996US5573418 Press-in connection type structure for electric part
11/12/1996US5572789 Process for forming a profiled element
11/12/1996US5572779 Method of making an electronic thick film component multiple terminal
11/07/1996WO1996035233A1 Cover for an electronic component
11/07/1996WO1996035155A1 Printed circuit board with selectable routing configuration
11/07/1996WO1996035129A1 Method and apparatus for testing semiconductor dice
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