Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/1996
12/05/1996WO1996038860A1 Base plate for an integrated electric circuit component
12/05/1996WO1996038859A1 Surface conditioning insulating layer for fine line conductive pattern
12/05/1996WO1996038858A2 Method and probe card for testing semiconductor devices
12/05/1996DE19619921A1 Mfg. semiconductor device having capped element
12/05/1996DE19520938A1 Component to cooling body thermal coupling appts. for integrated electronic component
12/05/1996CA2196557A1 Raised tungsten plug antifuse and fabrication process
12/04/1996EP0746188A1 Use of micromodule as surface mount package and corresponding method
12/04/1996EP0746028A2 Integrated inductor arrangement
12/04/1996EP0746027A2 Polysilicon/tungsten silicide multilayer composite formed on an integrated circuit structure, and improved method of making same
12/04/1996EP0746026A2 Improvements in or relating to semiconductor products
12/04/1996EP0746025A2 Improved fuse link structures through the addition of dummy structures
12/04/1996EP0746024A2 Semiconductor device with built-in AC coupling circuitry
12/04/1996EP0746023A2 Multichip press-contact type semiconductor device
12/04/1996EP0746022A1 Hybrid multi-chip module and method of fabricating
12/04/1996EP0746021A2 Compression bonded type semiconductor element and manufacturing method for the same
12/04/1996EP0746020A2 Scaled adaptive lithography
12/04/1996EP0746019A2 A silicide process for sub-micron silicon and polysilicon lines
12/04/1996EP0746017A2 Method of forming connection hole
12/04/1996EP0745270A1 Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
12/04/1996EP0683923A4 Method of producing a radio frequency transponder with a molded environmentally sealed package.
12/04/1996CN2241922Y Tightening device for radiator of integrated circuit
12/04/1996CN1137329A Method for fabricating self-assembling microstructures
12/04/1996CN1137176A Surface mounting type light emitting diode
12/04/1996CN1137172A Integrated electro-optic package
12/03/1996US5581444 Device and method for enhancing thermal and high frequency performance of integrated circuit packages
12/03/1996US5581443 Structure for cooling a circuit module having a circuit board and a heat-generating IC chip mounted on the board, and portable electronic apparatus incorporating the structure
12/03/1996US5581442 Spring clip for clamping a heat sink module to an electronic module
12/03/1996US5581441 Electrically-operated heat exchanger release mechanism
12/03/1996US5581217 For isolating a microstrip circuit
12/03/1996US5581125 Interconnect for semiconductor devices and method for fabricating same
12/03/1996US5581124 Semiconductor device having wiring and contact structure
12/03/1996US5581123 Semiconductor device and its manufacturing method
12/03/1996US5581122 Packaging assembly with consolidated common voltage connections for integrated circuits
12/03/1996US5581121 Warp-resistant ultra-thin integrated circuit package
12/03/1996US5581119 Packaged integrated circuit
12/03/1996US5581118 Electronic surface mount device
12/03/1996US5581111 Dielectric-polysilicon-dielectric antifuse for field programmable logic applications
12/03/1996US5581109 Semiconductor device
12/03/1996US5581093 Contact structure of an interconnection layer for a semiconductor device and a multilayer interconnection SRAM
12/03/1996US5580831 Sawcut method of forming alignment marks on two faces of a substrate
12/03/1996US5580829 Method for minimizing unwanted metallization in periphery die on a multi-site wafer
12/03/1996US5580825 Process for making multilevel interconnections of electronic components
12/03/1996US5580824 Method for fabrication of interconnections in semiconductor devices
12/03/1996US5580821 Semiconductor processing method of forming an electrically conductive contact plug
12/03/1996US5580813 Method of forming a semiconductor memory device having a contact region between memory cell and an interlayer insolating layer
12/03/1996US5580810 Method of making a semiconductor memory device
12/03/1996US5580687 Contact stepper printed lithography method
12/03/1996US5579987 Semiconductor package vertical mounting device and mounting method
12/03/1996US5579827 Heat sink arrangement for central processing unit
12/03/1996US5579606 Refrigerator door opening/closing apparatus
12/03/1996CA2073822C Liquid coolant circulating system
11/1996
11/28/1996WO1996038031A2 Chip socket assembly and chip file assembly for semiconductor chips
11/28/1996WO1996038030A1 Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board
11/28/1996WO1996037931A1 Spring element electrical contact and methods
11/28/1996WO1996037917A1 Semiconductor assembly
11/28/1996WO1996037916A1 Method of transfer molding electronic packages and packages produced thereby
11/28/1996WO1996037915A1 Adherent film with low thermal impedance and high electrical impedance used in an electronic assembly with a heat sink
11/28/1996WO1996037914A1 Manufacturing process for hybrid circuit modules including electronic chip devices
11/28/1996WO1996037913A1 Semiconductor device having a semiconductor chip electrically connected to a wiring substrate
11/28/1996WO1996037532A1 Epoxy resin moulding materials fire-proofed without halogens
11/28/1996WO1996037334A1 Method and apparatus for shaping spring elements
11/28/1996WO1996037333A1 Ribbon-like core interconnection elements
11/28/1996WO1996037332A1 Fabricating interconnects and tips using sacrificial substrates
11/28/1996WO1996037331A1 Wire bonding, severing, and ball forming
11/28/1996WO1996030944A3 Support module
11/28/1996WO1996030933A3 Solder bump fabrication methods and structure including a titanium barrier layer
11/28/1996DE19547783C1 Semiconductor sensor, e.g. for pressure measurement etc.
11/28/1996DE19540306C1 Prodn. of conductor frames for semiconductor components
11/28/1996DE19522517C1 Power MOSFET disconnection circuit providing over-temp protection
11/28/1996DE19519499A1 Low temp. activated hot melt adhesive films for bonding integrated circuit modules into chip or smart cards
11/28/1996DE19518706A1 Protecting opto-electronic semiconductor components mounted on circuit board
11/28/1996CA2222049A1 Contact arrangement for detachably attaching an electric component, especially an integrated circuit to a printed circuit board
11/28/1996CA2221931A1 Semiconductor assembly
11/27/1996EP0744241A2 Method of joining together a pair of members each having a high thermal conductivity
11/27/1996EP0744084A1 Semiconductor storage component with a plurality of storage chips in a shared casing
11/27/1996EP0744033A1 An integrated resistor for sensing electrical parameters
11/27/1996EP0743929A1 Substrate of a ceramic material
11/27/1996CN1136711A Resin sealed semiconductor unit and its producing method
11/27/1996CN1136710A Structure of semiconductor device and method for forming said device shell
11/27/1996CN1136602A Lead frame manufacturing method
11/26/1996US5579256 Semiconductor memory device and defect remedying method thereof
11/26/1996US5579249 System for modeling an integrated chip package and method of operation
11/26/1996US5579217 Laminated bus assembly and coupling apparatus for a high power electrical switching converter
11/26/1996US5579212 Protective cover for a silicon chip device and method relating thereto
11/26/1996US5579208 Semiconductor device having a plurality of semiconductor chips
11/26/1996US5579205 Electromechanical module with post-solder attachable/removable heat sink frame and low profile
11/26/1996US5578934 Method and apparatus for testing unpackaged semiconductor dice
11/26/1996US5578874 Hermetically self-sealing flip chip
11/26/1996US5578872 Planar contact with a void
11/26/1996US5578871 Integrated circuit package and method of making the same
11/26/1996US5578869 For an electronic package
11/26/1996US5578868 IC memory card
11/26/1996US5578867 Passivation method and structure using hard ceramic materials or the like
11/26/1996US5578866 Method of manufacturing a block-shaped support body for a semiconductor component
11/26/1996US5578861 Semiconductor device having redundant circuit
11/26/1996US5578854 Vertical load resistor SRAM cell
11/26/1996US5578849 Semiconductor integrated circuit device including a memory device having memory cells with increased information storage capacitance
11/26/1996US5578841 Vertical MOSFET device having frontside and backside contacts
11/26/1996US5578840 Microelectronic integrated circuit structure and method using three directional interconnect routing based on hexagonal geometry
11/26/1996US5578836 Electrically programmable antifuse element
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