| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/18/1996 | CN1138215A 半导体装置 Semiconductor device |
| 12/18/1996 | CN1138213A Method of and apparatus for visually inspecting leads of semiconductor device |
| 12/18/1996 | CN1138212A Molding die used for sealing semiconductor chips with good productivity and lead-frame used for mounting semiconductor chips |
| 12/17/1996 | US5586010 For an integrated circuit |
| 12/17/1996 | US5586009 Bus communication system for stacked high density integrated circuit packages |
| 12/17/1996 | US5586007 Circuit board having improved thermal radiation |
| 12/17/1996 | US5586006 Multi-chip module having a multi-layer circuit board with insulating layers and wiring conductors stacked together |
| 12/17/1996 | US5586005 In electronic apparatus |
| 12/17/1996 | US5586004 Mounting assembly for power semiconductors |
| 12/17/1996 | US5585991 Protective circuit for protecting load against excessive input voltage |
| 12/17/1996 | US5585676 IC chip for different type IC packages |
| 12/17/1996 | US5585675 Semiconductor die packaging tub having angularly offset pad-to-pad via structure configured to allow three-dimensional stacking and electrical interconnections among multiple identical tubs |
| 12/17/1996 | US5585674 Transverse diffusion barrier interconnect structure |
| 12/17/1996 | US5585673 Refractory metal capped low resistivity metal conductor lines and vias |
| 12/17/1996 | US5585672 Semiconductor module with an improved heat sink/insulation plate arrangement |
| 12/17/1996 | US5585671 Reliable low thermal resistance package for high power flip clip ICs |
| 12/17/1996 | US5585670 Semiconductor device package |
| 12/17/1996 | US5585668 Integrated circuit package with overlapped die on a common lead frame |
| 12/17/1996 | US5585667 Lead frame for handling crossing bonding wires |
| 12/17/1996 | US5585666 Semiconductor device with chip layout having inner electrode configuration and liquid crystal display apparatus employing the semiconductor device |
| 12/17/1996 | US5585665 Packaged semiconductor device and a leadframe therefor |
| 12/17/1996 | US5585664 Semiconductor integrated circuit device |
| 12/17/1996 | US5585663 In an integrated circuit |
| 12/17/1996 | US5585662 Semiconductor integrated circuit device with breakable fuse element covered with exactly controlled insulating film |
| 12/17/1996 | US5585602 Structure for providing conductive paths |
| 12/17/1996 | US5585600 Encapsulated semiconductor chip module and method of forming the same |
| 12/17/1996 | US5585310 Methods of mass production of semiconductor devices |
| 12/17/1996 | US5585282 Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor |
| 12/17/1996 | US5585195 Metal insert and rough-surface treatment method thereof |
| 12/17/1996 | US5585162 Ground plane routing |
| 12/17/1996 | US5585138 Bundling coated wire composed of metal core and insulation;fixing; cutting |
| 12/17/1996 | US5584707 Chip socket system |
| 12/17/1996 | US5584339 Heat sink assembly for the central processor of computer |
| 12/12/1996 | WO1996039795A1 Multiple probing of an auxiliary test pad which allows for reliable bonding to a primary bonding pad |
| 12/12/1996 | WO1996039717A1 Reduced leakage antifuse structure and fabrication method |
| 12/12/1996 | WO1996039716A1 Multilayer module with thinfilm redistribution area |
| 12/12/1996 | WO1996039715A1 Integrated circuit package leadframe |
| 12/12/1996 | WO1996039714A1 Method for reducing a transient thermal mismatch |
| 12/12/1996 | WO1996039298A1 Method for the reduction of lateral shrinkage in multilayer circuit boards on a support |
| 12/12/1996 | DE4345236C2 Semiconductor structure and its prepn. |
| 12/12/1996 | DE19622971A1 Semiconductor device for SMT and mfg. method |
| 12/12/1996 | DE19622650A1 High power digital IC housing |
| 12/12/1996 | DE19620549A1 Rated melt point programmable by laser beam e.g. for monolithic i.c. storage device |
| 12/12/1996 | DE19514619A1 Power semiconductor heat-sink arrangement |
| 12/12/1996 | CA2196307A1 Reduced leakage antifuse structure and fabrication method |
| 12/11/1996 | EP0747955A2 Hybrid circuit and method of fabrication |
| 12/11/1996 | EP0747954A2 Reflowed solder ball with low melting point metal cap |
| 12/11/1996 | EP0747953A2 Finning for crossed-flow heat exchangers to be fitted on electronic circuits |
| 12/11/1996 | EP0747952A2 Thermally enhanced ball grid array package |
| 12/11/1996 | EP0747951A2 Method of constructing a sealed chip-on-board electronic module |
| 12/11/1996 | EP0747950A2 Feedthrough glass-to-metal seal repair process |
| 12/11/1996 | EP0747949A2 Wirebondless module package and method of fabrication |
| 12/11/1996 | EP0747948A2 Method and apparatus for fabricating self-assembling microstructures |
| 12/11/1996 | EP0747947A2 Dual Damascene process having tapered vias |
| 12/11/1996 | EP0747942A2 Improvements in or relating to integrated circuits |
| 12/11/1996 | EP0747930A1 Electronic device with multiple bonding wires, method of fabrication and method of testing bonding wire integrity |
| 12/11/1996 | EP0747502A1 Improved adhesion layer for tungsten deposition |
| 12/11/1996 | EP0747399A2 Adhesive tape for electronic parts and liquid adhesive |
| 12/11/1996 | EP0747371A1 Epoxy resins consisting of flexible chains terminated with glycidyloxyphenyl groups for use in microelectronics adhesives |
| 12/11/1996 | EP0747370A1 Polydiglycidylphenyl ethers of alkylene or alkylenoxy chains for use in microelectronics adhesives |
| 12/11/1996 | EP0746968A1 Detachable apparatus for cooling integrated circuits |
| 12/11/1996 | EP0746884A1 Spring biased tapered contact element |
| 12/11/1996 | EP0746876A1 Lead frame for handling crossing bonding wires |
| 12/11/1996 | EP0746875A1 Method of manufacturing semiconductor devices with semiconductor elements formed in a layer of semiconductor material glued on a support wafer |
| 12/11/1996 | EP0746739A1 Heat-radiating element |
| 12/11/1996 | EP0746688A1 Low profile fan body with heat transfer characteristics |
| 12/11/1996 | CN1137695A Apparatus for providing controlled impedance in electrical contact |
| 12/11/1996 | CN1137641A Method and compositions for diffusion patierning tape on substrate |
| 12/11/1996 | CN1033543C Electric circuit having superconducting multilayered structure and manufacturing method |
| 12/10/1996 | US5583747 Thermoplastic interconnect for electronic device and method for making |
| 12/10/1996 | US5583746 Heat sink assembly for a central processing unit of a computer |
| 12/10/1996 | US5583739 Capacitor fabricated on a substrate containing electronic circuitry |
| 12/10/1996 | US5583733 For use with a semiconductor chip package |
| 12/10/1996 | US5583451 Polarity control circuit which may be used with a ground bounce limiting buffer |
| 12/10/1996 | US5583381 Resin molded type-semiconductor device having a conductor film |
| 12/10/1996 | US5583380 Integrated circuit contacts with secured stringers |
| 12/10/1996 | US5583379 Outer lead for a semiconductor IC package having individually annealed plated layers |
| 12/10/1996 | US5583378 Ball grid array integrated circuit package with thermal conductor |
| 12/10/1996 | US5583377 Pad array semiconductor device having a heat sink with die receiving cavity |
| 12/10/1996 | US5583376 High performance semiconductor device with resin substrate and method for making the same |
| 12/10/1996 | US5583375 Semiconductor device with lead structure within the planar area of the device |
| 12/10/1996 | US5583374 Semiconductor device having a reduced wiring area in and out of data path zone |
| 12/10/1996 | US5583372 Adhesion enhanced semiconductor die for mold compound packaging |
| 12/10/1996 | US5583371 Resin-sealed semiconductor device capable of improving in heat radiation characteristics of resin-sealed semiconductor elements |
| 12/10/1996 | US5583370 Tab semiconductor device having die edge protection and method for making the same |
| 12/10/1996 | US5583347 For an electro-optical device |
| 12/10/1996 | US5583321 Multi-layer circuit construction methods and structures with customization features and components for use therein |
| 12/10/1996 | US5583317 For microelectronic packaging |
| 12/10/1996 | US5583316 Heat-generating element cooling device |
| 12/10/1996 | US5583074 Semiconductor circuit |
| 12/10/1996 | US5582745 Method of making circuit boards with locally enhanced wiring density |
| 12/10/1996 | US5582341 Bonding apparatus for terminal component |
| 12/10/1996 | US5582242 Thermosiphon for cooling a high power die |
| 12/10/1996 | US5582240 Method of dissipating heat from a heat generating device |
| 12/10/1996 | US5582215 Ceramic die for cutting and shaping lead frames and method of cleaning the same |
| 12/10/1996 | US5581876 Method of adhering green tape to a metal support substrate with a bonding glass |
| 12/08/1996 | CA2177219A1 Method and apparatus for fabricating self-assembling microstructures |
| 12/08/1996 | CA2151214A1 Electronic devices with electronic components carried upon a substrate |
| 12/05/1996 | WO1996039012A1 Electrical connection |
| 12/05/1996 | WO1996038861A1 Raised tungsten plug antifuse and fabrication process |