Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
01/1997
01/02/1997DE19624869A1 Electronic module cooling device for e.g. DC rectifier diode
01/02/1997DE19608883A1 Semiconductor device with spin-on glass interlayer
01/02/1997DE19523897A1 Verwendung von Silicon-modifizierten Epoxidharzen als Vergußmassen für elektrotechnische oder elektronische Bauteile Use of silicone-modified epoxy resins as casting for electrical or electronic components
01/02/1997DE19523597A1 Window of module housing opaque covering method for UV-EPROM
01/02/1997DE19522455A1 Electromagnetic compatibility screening of electronic components esp. integrated circuits in motor vehicles
01/01/1997CN1139297A Structure and method of coupling substrates
12/1996
12/31/1996US5590030 Circuit board capable of efficiently conducting heat through an inside thereof using thermal lands surrounding through-hole connections
12/31/1996US5590026 Apparatus for dissipating heat from an integrated circuit
12/31/1996US5590025 Fan attachment clip for heat sink
12/31/1996US5590017 Alumina multilayer wiring substrate provided with high dielectric material layer
12/31/1996US5589724 Piezoelectric device and a package
12/31/1996US5589713 Contact holes filled with aluminum
12/31/1996US5589712 Metal wiring including a first layer with aluminum as main component and a second layer having titanium and nitrogen as main components in a given ratio; lower reflectance relative to exposure light
12/31/1996US5589711 Semiconductor package
12/31/1996US5589709 Lead frame capacitor and capacitively-coupled isolator circuit using same
12/31/1996US5589706 Fuse link structures through the addition of dummy structures
12/31/1996US5589668 Multi-metal layer wiring tab tape carrier and process for fabricating the same
12/31/1996US5589424 Photodefinable dielectric layers comprising poly(aromatic diacetylenes)
12/31/1996US5589420 Method for a hybrid leadframe-over-chip semiconductor package
12/31/1996US5589417 TiSi2 /TiN clad interconnect technology
12/31/1996US5589402 Process for manufacturing a package for mating with a bare semiconductor die
12/31/1996US5588483 Heat radiating apparatus
12/31/1996CA2143105C Heat sink assembly for solid state devices
12/27/1996WO1996042110A1 Semiconductor device
12/27/1996WO1996042109A1 Smart card chip coated with a layer of insulating material, and smart card comprising same
12/27/1996WO1996042107A1 Semiconductor device, wiring board for mounting semiconductor and method of production of semiconductor device
12/27/1996WO1996042106A1 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
12/27/1996EP0750352A2 Semiconductor device layout
12/27/1996EP0750350A2 Solid state pixel array with supplementary crossover structure
12/27/1996EP0750349A2 Imager device with integral address line repair segments
12/27/1996EP0750348A1 Semiconductor device with electromagnetic radiation reduced
12/27/1996EP0750345A2 Power semiconductor module
12/27/1996EP0750344A2 Semiconductor power module with connection pins
12/27/1996EP0750343A1 Fuse with ESD protection
12/27/1996EP0750342A2 Semiconductor device having the inner end of connector leads placed onto the surface of semiconductor chip
12/27/1996EP0750341A1 A releasable mount heat-sink for a very large scale integrated circuit
12/27/1996EP0750337A2 Electronic coating materials using mixed polymers
12/27/1996EP0749996A1 Epoxy resin composition
12/27/1996EP0749675A1 Low profile fan body with heat transfer characteristics
12/27/1996EP0749674A1 Apparatus having inner layers supporting surface-mount components
12/27/1996EP0749640A1 Semiconductor chip affording a high-density external interface
12/27/1996EP0749636A1 Method and apparatus for interconnecting solar cells
12/27/1996EP0749634A1 Technique for producing interconnecting conductive links
12/27/1996EP0749633A1 Prefabricated semiconductor chip carrier
12/27/1996EP0749577A1 Covering layer for electrical conductors or semiconductors
12/27/1996EP0749500A1 Method of manufacturing a thin silicon-oxide layer
12/27/1996EP0593777B1 Refrigerant composition and binary refrigerating system using the composition
12/27/1996CA2221286A1 Semiconductor unit package, semiconductor unit packaging method, and encapsulant for use in semiconductor unit packaging
12/27/1996CA2220636A1 Smart card chip coated with a layer of insulating material, and smart card comprising same
12/25/1996CN1138602A Semiconductor encapsulating epoxy resin compositions and semiconductor devices encapsulated therewith
12/25/1996CN1033672C Thin film electrical component
12/24/1996US5587883 Lead frame assembly for surface mount integrated circuit power package
12/24/1996US5587882 Thermal interface for a heat sink and a plurality of integrated circuits mounted on a substrate
12/24/1996US5587613 Low-capacitance, isotropically etched antifuse and method of manufacture therefor
12/24/1996US5587610 Semiconductor device having a conductive layer with an aperture
12/24/1996US5587608 Structure heat sink for power semiconductors
12/24/1996US5587607 Semiconductor integrated circuit device having improvement arrangement of pads
12/24/1996US5587606 Lead frame having deflectable and thereby precisely removed tie bars
12/24/1996US5587605 Package for mating with a semiconductor die
12/24/1996US5587598 Semiconductor device with charge-up preventing function
12/24/1996US5587597 Integrated circuit
12/24/1996US5587590 Sample of metal silicide film for facilitating inspection of crystal structure by x-ray inspection
12/24/1996US5587342 Method of forming an electrical interconnect
12/24/1996US5587341 Process for manufacturing a stacked integrated circuit package
12/24/1996US5587339 Method of forming contacts in vias formed over interconnect layers
12/24/1996US5587331 Method of forming a contact hole for a metal line in a semiconductor device
12/24/1996US5587275 Photosensitive resin composition and a process for forming a patterned polyimide film using the same
12/24/1996US5587119 Method for manufacturing a coaxial interconnect
12/24/1996US5587111 Ultrafine particles of metal
12/24/1996US5586890 For establishing electrical connection
12/24/1996US5586715 Method of making solder balls by contained paste deposition
12/24/1996US5586389 Method for producing multi-board electronic device
12/24/1996US5586388 Method for producing multi-board electronic device
12/19/1996WO1996041507A1 Low profile semiconductor die carrier
12/19/1996WO1996041506A1 Photolithographically patterned spring contact
12/19/1996WO1996041377A1 High performance semiconductor die carrier
12/19/1996WO1996041376A1 Mesh planes for multilayer module
12/19/1996WO1996041375A1 Integrated circuit comprising a substrate and a wiring layer with a buffer layer between the substrate and the wiring layer
12/19/1996WO1996041374A1 Double half via antifuse
12/19/1996WO1996041373A1 Low inductance electrical ground connection integrated circuit die package
12/19/1996WO1996041372A1 Method and apparatus for fabricating self-assembling microstructures
12/19/1996WO1996041204A1 Method and apparatus for probing, testing, burn-in, repairing and programming of integrated circuits in a closed environment using a single apparatus
12/19/1996WO1996041030A1 Method for producing metal matrix composites incorporating partially sintered preforms
12/19/1996WO1996039889A1 Fan attachment clip for heat sink
12/19/1996WO1996033511A3 Method of manufacturing a progammable semiconductor device in the form of an anti-fuse
12/19/1996CA2223106A1 Bottom electrode structure for integrated circuit capacitors and method of making the same
12/18/1996EP0749160A1 Method for cooling a housing mounted integrated circuit
12/18/1996EP0749159A2 Resin-sealed semiconductor device
12/18/1996EP0749157A2 Method of solder bonding
12/18/1996EP0749156A1 Semiconductor device with self-aligned contacts and method of fabrication
12/18/1996EP0749155A2 Composite electronic coatings
12/18/1996EP0748519A1 Electronic package for isolated circuits
12/18/1996EP0748518A1 Method of etching conductive lines without undercutting
12/18/1996EP0748261A1 Layered chip structure
12/18/1996EP0532244B1 Semiconductor device
12/18/1996EP0513273B1 Electrical connection for a power chip
12/18/1996CN2243125Y Improved buckling device for integrated circuit radiating fin
12/18/1996CN1138343A Epoxy resin composition for sealing photosemiconductor device
12/18/1996CN1138286A Wiring construction body, method of manufacturing same, and circuit board using wiring construction body
12/18/1996CN1138216A Semiconductor device with plastic packaged
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