| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/15/1997 | EP0753101A1 Engine components including ceramic-metal composites |
| 01/15/1997 | EP0729650A4 Solderable connector for high density electronic assemblies |
| 01/15/1997 | CN1140335A Protecting diode for semiconductor device |
| 01/15/1997 | CN1140334A Semiconductor device which dissipates heat |
| 01/15/1997 | CN1140332A Method of forming tungsten plug in semiconductor device |
| 01/14/1997 | US5594626 Partially-molded, PCB chip carrier package for certain non-square die shapes |
| 01/14/1997 | US5594624 Strap spring for heat sink clip assembly |
| 01/14/1997 | US5594623 Method and apparatus for attaching a heat sink and a fan to an integrated circuit package |
| 01/14/1997 | US5594328 Passive probe employing cluster of charge monitors for determining simultaneous charging characteristics of wafer environment inside IC process equipment |
| 01/14/1997 | US5594282 Resin sealing type semiconductor device and method of making the same |
| 01/14/1997 | US5594281 Semiconductor apparatus having wiring structure of an integrated circuit in which a plurality of logic circuits of the same structure are arranged in the same direction |
| 01/14/1997 | US5594279 Semiconductor device having shield wiring for noise suppression |
| 01/14/1997 | US5594278 Semiconductor device having a via hole with an aspect ratio of not less than four, and interconnections therein |
| 01/14/1997 | US5594276 Semiconductor device package with shaped parts for direct coupling to standard connectors |
| 01/14/1997 | US5594275 J-leaded semiconductor package having a plurality of stacked ball grid array packages |
| 01/14/1997 | US5594274 Lead frame for use in a semiconductor device and method of manufacturing the semiconductor device using the same |
| 01/14/1997 | US5594273 Apparatus for performing wafer-level testing of integrated circuits where test pads lie within integrated circuit die but overly no active circuitry for improved yield |
| 01/14/1997 | US5594272 Bipolar transistor with base and emitter contact holes having shorter central portions |
| 01/14/1997 | US5594259 Semiconductor device and a method for producing the same |
| 01/14/1997 | US5594258 Semiconductor device with reticle specific implant verification indicator |
| 01/14/1997 | US5594234 Downset exposed die mount pad leadframe and package |
| 01/14/1997 | US5593927 Method for packaging semiconductor dice |
| 01/14/1997 | US5593926 Method of manufacturing semiconductor device |
| 01/14/1997 | US5593925 Semiconductor device capable of preventing humidity invasion |
| 01/14/1997 | US5593924 Use of a capping layer to attain low titanium-silicide sheet resistance and uniform silicide thickness for sub-micron silicon and polysilicon lines |
| 01/14/1997 | US5593923 Method of fabricating semiconductor device having refractory metal silicide layer on impurity region using damage implant and single step anneal |
| 01/14/1997 | US5593921 Method of forming vias |
| 01/14/1997 | US5593920 Method for forming contact structures in integrated circuits |
| 01/14/1997 | US5593918 Techniques for forming superconductive lines |
| 01/14/1997 | US5593903 Method of forming contact pads for wafer level testing and burn-in of semiconductor dice |
| 01/14/1997 | US5593774 Polyimide base film; thermoplastic or thermosetting adhesive layers; tear strength; semiconductors |
| 01/14/1997 | US5593720 Process for making a multileveled electronic package |
| 01/14/1997 | US5593526 Ceramic coated glass spheres |
| 01/14/1997 | US5592735 Method of making a multi-chip module having an improved heat dissipation efficiency |
| 01/14/1997 | CA2068816C Apparatus and method for assembling circuit structures |
| 01/12/1997 | CA2180595A1 Method for encapsulating an electronic component, electronic component suitable of being used for carrying out said method and encapsulated component obtained using the method |
| 01/09/1997 | WO1997001188A1 Semiconductor device with a fuse link and with a trough located below the fuse link |
| 01/09/1997 | WO1997001187A1 Method of manufacture of material for semiconductor substrate, material for semiconductor substrate, and package for semiconductor |
| 01/09/1997 | WO1997000837A1 Highly heat-conductive silicon nitride sinter, process for producing the same, and pressure-welded structure |
| 01/09/1997 | WO1997000753A1 Solder, and soldered electronic component and electronic circuit board |
| 01/08/1997 | EP0752720A2 Lead for semiconductor device |
| 01/08/1997 | EP0752200A1 Two-phase thermal bag component |
| 01/08/1997 | EP0752160A1 Method for the sealed and electrically insulating attachment of an electrical conductor extending through a metal wall |
| 01/08/1997 | EP0607255B1 Additive compositions for high thermal cycled and aged adhesion |
| 01/08/1997 | CN2244775Y Semiconductor packaging unit with sawthooth sea gull wing shape |
| 01/08/1997 | CN1139820A Interconnection device for semiconductor device and making method |
| 01/08/1997 | CN1139819A Electrolyte, making process and semicondoctor device |
| 01/08/1997 | CN1033769C 电子电路 Electronic circuit |
| 01/07/1997 | US5592363 Electronic apparatus |
| 01/07/1997 | US5592199 Assembly structure of a flat type device including a panel having electrode terminals disposed on a peripheral portion thereof and method for assembling the same |
| 01/07/1997 | US5592026 Integrated structure pad assembly for lead bonding |
| 01/07/1997 | US5592025 Pad array semiconductor device |
| 01/07/1997 | US5592024 Semiconductor device having a wiring layer with a barrier layer |
| 01/07/1997 | US5592023 Semiconductor device |
| 01/07/1997 | US5592022 Electrical apparatus |
| 01/07/1997 | US5592021 Clamp for securing a power device to a heatsink |
| 01/07/1997 | US5592020 Semiconductor device with smaller package having leads with alternating offset projections |
| 01/07/1997 | US5592019 Semiconductor device and module |
| 01/07/1997 | US5592018 Membrane dielectric isolation IC fabrication |
| 01/07/1997 | US5592016 Antifuse with improved antifuse material |
| 01/07/1997 | US5592007 Membrane dielectric isolation transistor fabrication |
| 01/07/1997 | US5592004 Ultraviolet radiation erasable |
| 01/07/1997 | US5591999 Electrically erasable programmable read only memory device with an improved memory cell pattern layout |
| 01/07/1997 | US5591990 Active matrix assembly |
| 01/07/1997 | US5591966 Optical device |
| 01/07/1997 | US5591941 Solder ball interconnected assembly |
| 01/07/1997 | US5591679 Sealed cavity arrangement method |
| 01/07/1997 | US5591677 Planarizeed multi-level interconnect scheme with embedded low-dielectric constant insulators |
| 01/07/1997 | US5591676 Applying fluoropolymer layers |
| 01/07/1997 | US5591674 Integrated circuit with silicon contact to silicide |
| 01/07/1997 | US5591670 Method of manufacturing a semiconductor device having self aligned contact hole |
| 01/07/1997 | US5591663 Method of manufacturing ferroelectric capacitor with a hydrogen heat treatment |
| 01/07/1997 | US5591649 Process of removing a tape automated bonded semiconductor from bonded leads |
| 01/07/1997 | US5591034 Thermally conductive adhesive interface |
| 01/07/1997 | US5590712 Heat dissipating element |
| 01/07/1997 | US5590462 Process for dissipating heat from a semiconductor package |
| 01/07/1997 | US5590461 Method of making multi-layer wiring board |
| 01/07/1997 | CA2070062C Cooling structure for integrated circuits |
| 01/03/1997 | WO1997000599A1 Ground plane routing |
| 01/03/1997 | WO1997000598A1 Connection substrate |
| 01/03/1997 | WO1997000537A1 Flexible leads for tape ball grid array circuit |
| 01/03/1997 | WO1996030935A3 Method of manufacturing an electronic multilayer component |
| 01/03/1997 | CA2221756A1 Ground plane routing |
| 01/03/1997 | CA2221750A1 Flexible leads for tape ball grid array circuit |
| 01/02/1997 | EP0751569A2 Hybrid power circuit |
| 01/02/1997 | EP0751567A2 Copper alloys for chip and package interconnections and method of making |
| 01/02/1997 | EP0751566A2 A thin film metal barrier for electrical interconnections |
| 01/02/1997 | EP0751565A2 Film carrier for semiconductor device |
| 01/02/1997 | EP0751564A2 Ultra-thin noble metal coatings for electronic packaging |
| 01/02/1997 | EP0751563A2 Apparatus holding an electric device to a supporting part |
| 01/02/1997 | EP0751562A2 Thermally conducting fastening of an electronic power device to a printed circuit board with a heat dissipator |
| 01/02/1997 | EP0751561A1 Semiconductor package manufacturing method and semiconductor package |
| 01/02/1997 | EP0751557A2 Wiring circuit board for mounting of semiconductor chip and method for the preparation thereof |
| 01/02/1997 | EP0751556A1 Fabrication process for an interconnection substrate allowing to connect a die to a carrier substrate |
| 01/02/1997 | EP0751555A2 Method for making semiconductor devices having electroplated leads |
| 01/02/1997 | EP0750792A1 Cooling and screening device for an integrated circuit |
| 01/02/1997 | EP0750791A1 Electric connections arranged in a high-density grid |
| 01/02/1997 | EP0750790A1 Method and apparatus for capping metallization layer |
| 01/02/1997 | EP0750597A1 Method of producing ceramic composite bodies |
| 01/02/1997 | EP0610425B1 Process for preparing a polyimide film with a preselected value for cte |