| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/30/1997 | WO1997003467A1 Top loading socket for ball grid arrays |
| 01/30/1997 | WO1997003466A1 Integrated circuit chip card and the method and system for the manufacture of same |
| 01/30/1997 | WO1997003465A1 Semiconductor pellet, method of its packaging, and bump electrode |
| 01/30/1997 | WO1997003464A1 Integrated circuit contacts with secured stringers |
| 01/30/1997 | WO1997003459A1 On-chip vacuum package technology for micromechanical devices |
| 01/30/1997 | WO1997003129A1 Epoxy resin composition |
| 01/30/1997 | WO1997003031A1 Aluminum nitride sinter and process for the production thereof |
| 01/30/1997 | WO1997002733A2 Microwave/millimeter wave circuit structure with discrete flip-chip mounted elements, and method of fabricating the same |
| 01/30/1997 | WO1996036176A3 Image display apparatus with line number conversion |
| 01/30/1997 | WO1996036071A3 Method of manufacturing a semiconductor device suitable for surface mounting |
| 01/30/1997 | DE19628702A1 Flußmittelfreie Kontaktierung von Bauelementen Flux-contacting devices |
| 01/30/1997 | DE19532653C1 Schaltungsanordnung mit einer Hybridschaltung Circuit arrangement with a hybrid circuit |
| 01/30/1997 | CA2226856A1 Top loading socket for ball grid arrays |
| 01/30/1997 | CA2226225A1 Integrated circuit chip card and the method and system for the manufacture of same |
| 01/29/1997 | EP0756366A1 Electrostatic discharge protection using high temperature superconductors |
| 01/29/1997 | EP0756325A2 Semiconductor device having a base |
| 01/29/1997 | EP0756324A2 Bump electrode for transistor and method for producing the same |
| 01/29/1997 | EP0756322A1 Semiconductor device with integrated heat sink |
| 01/29/1997 | EP0756294A1 Mount for supporting a high frequency transformer over a component on a substrate in a hybrid module and method of assembling the hybrid module |
| 01/29/1997 | EP0755957A1 Nonhalogenated poly(arylene ethers) |
| 01/29/1997 | EP0755619A1 An arrangement for shielding and/or cooling electronic components mounted on a circuit board |
| 01/29/1997 | EP0755573A1 Electronic component and process for producing same |
| 01/29/1997 | CN1141510A Semiconductor device and process of fabrication thereof |
| 01/29/1997 | CN1141506A Method of forming metal interconnects in semiconductor devices |
| 01/29/1997 | CN1141504A Method of mfg. semiconductor device and apparatus for same |
| 01/28/1997 | US5598321 Ball grid array with heat sink |
| 01/28/1997 | US5598320 Rotable and slideble heat pipe apparatus for reducing heat build up in electronic devices |
| 01/28/1997 | US5598038 Resin encapsulated semiconductor device |
| 01/28/1997 | US5598036 Ball grid array having reduced mechanical stress |
| 01/28/1997 | US5598035 Integrated circuit package with external storage capacitor for improved signal quality for sensitive integrated circuit elements |
| 01/28/1997 | US5598034 Plastic packaging of microelectronic circuit devices |
| 01/28/1997 | US5598033 Micro BGA stacking scheme |
| 01/28/1997 | US5598032 Hybrid chip card capable of both contact and contact-free operation and having antenna contacts situated in a cavity for an electronic module |
| 01/28/1997 | US5598031 Electrically and thermally enhanced package using a separate silicon substrate |
| 01/28/1997 | US5598030 Semiconductor device having multilevel tab leads |
| 01/28/1997 | US5598029 Power supply wiring for semiconductor device |
| 01/28/1997 | US5598028 Highly-planar interlayer dielectric thin films in integrated circuits |
| 01/28/1997 | US5598027 Semiconductor device and method of fabricating the same |
| 01/28/1997 | US5598026 Low dielectric constant insulation layer for integrated circuit structure and method of making same |
| 01/28/1997 | US5598012 Thin-film transistor with wide gate electrode and liquid crystal display incorporating same |
| 01/28/1997 | US5598010 Semiconductor integrated circuit device having dummy pattern effective against micro loading effect |
| 01/28/1997 | US5598009 Hot carrier injection test structure and testing technique for statistical evaluation |
| 01/28/1997 | US5597763 Method for manufacturing a semiconductor wiring structure including a self-aligned contact hole |
| 01/28/1997 | US5597736 High-yield spatial light modulator with light blocking layer |
| 01/28/1997 | US5597660 Amorphous lithium phosphorous oxynitride |
| 01/28/1997 | US5597644 Glass glaze |
| 01/28/1997 | US5597643 Multi-tier laminate substrate with internal heat spreader |
| 01/28/1997 | US5597470 Method for making a flexible lead for a microelectronic device |
| 01/28/1997 | US5597074 Packing tray of semiconductor devices and a method for manufacturing the same |
| 01/28/1997 | US5597035 Method of cooling a heat generating electrical component |
| 01/28/1997 | US5597034 High performance fan heatsink assembly |
| 01/28/1997 | CA2074436C Heat sink |
| 01/23/1997 | WO1997002601A1 Process for packaging a pressure-sensitive electronic circuit in a protective housing sealed all around |
| 01/23/1997 | WO1997002600A1 Electronic package with improved thermal properties |
| 01/23/1997 | WO1997002596A1 Electronic component and method of production thereof |
| 01/23/1997 | WO1997002595A1 Semiconductor device and its manufacture |
| 01/23/1997 | WO1997002321A1 Use of silicone-modified epoxy resins as sealing compound |
| 01/23/1997 | DE19628376A1 Integrated circuit device, e.g. chip scale package |
| 01/23/1997 | DE19628264A1 Formation of finely-detailed printed circuits esp. for semiconductor component mounting plates |
| 01/23/1997 | DE19526010A1 Surface-mounted electronic component mfr., esp. thin quad- flat package prodn. |
| 01/22/1997 | EP0755079A2 A protective material for a semiconductor element, a semiconductor element provided with said protective material, and a semiconductor device provided with said semiconductor element |
| 01/22/1997 | EP0755075A2 A tape carrier package |
| 01/22/1997 | EP0755074A2 Submount |
| 01/22/1997 | EP0754351A1 Integrated circuits with borderless vias |
| 01/22/1997 | EP0754350A1 Cavity filled metal electronic package |
| 01/22/1997 | CN1140904A Surface mounting type light emitting diode |
| 01/22/1997 | CN1140902A Connection leads for electronic component |
| 01/22/1997 | CN1140901A Resin sealing type semiconductor device and method of making the same |
| 01/22/1997 | CN1140899A Method for making semiconductor devices having electroplated leads |
| 01/21/1997 | US5596485 Plastic packaged integrated circuit with heat spreader |
| 01/21/1997 | US5596231 High power dissipation plastic encapsulated package for integrated circuit die |
| 01/21/1997 | US5596230 Interconnection with self-aligned via plug |
| 01/21/1997 | US5596228 Apparatus for cooling charge coupled device imaging systems |
| 01/21/1997 | US5596227 Ball grid array type semiconductor device |
| 01/21/1997 | US5596226 Semiconductor chip having a chip metal layer and a transfer metal and corresponding electronic module |
| 01/21/1997 | US5596225 Leadframe for an integrated circuit package which electrically interconnects multiple integrated circuit die |
| 01/21/1997 | US5596224 Molded-in lead frames |
| 01/21/1997 | US5596223 Semiconductor device and method of selecting the same |
| 01/21/1997 | US5596172 Planar encapsulation process |
| 01/21/1997 | US5596171 Package for a high frequency semiconductor device and methods for fabricating and connecting the same to an external circuit |
| 01/21/1997 | US5595937 Method for fabricating semiconductor device with interconnections buried in trenches |
| 01/21/1997 | US5595935 Method for forming interconnect in integrated circuits |
| 01/21/1997 | US5595934 Method for forming oxide protective film on bonding pads of semiconductor chips by UV/O3 treatment |
| 01/21/1997 | US5595638 Method for manufacturing a semiconductor device utilizing an anodic oxidation |
| 01/21/1997 | US5595240 Cooling apparatus of electronic devices |
| 01/16/1997 | WO1997001872A1 Microwave circuit, capped microwave circuit and use thereof in a circuit arrangement |
| 01/16/1997 | WO1997001866A1 Ball grid array package utilizing solder coated spheres |
| 01/16/1997 | WO1997001865A1 Semiconductor device and method of manufacturing the same |
| 01/16/1997 | WO1997001594A1 Hydroxy-substituted ethynylated biphenyls |
| 01/16/1997 | WO1997001593A1 Improved poly(arylene ether) compositions and the method for their manufacture |
| 01/16/1997 | WO1997001591A1 Epoxy resin composition for printed wiring board and laminated board produced with the use of the same |
| 01/16/1997 | WO1996036450A3 Fabricating metal matrix composites containing electrical insulators |
| 01/16/1997 | WO1996036072A3 Method of manufacturing a device, by which method a substrate with semiconductor element and conductor tracks is glued to a support body with metallization |
| 01/15/1997 | EP0753990A1 Connection device and process |
| 01/15/1997 | EP0753892A1 Semiconductor device including protection means |
| 01/15/1997 | EP0753890A2 Electrode structure for semiconductor device, method for forming the same, and mounted body including semiconductor device |
| 01/15/1997 | EP0753888A2 Method for encapsulating an electronic component and article obtained thereby |
| 01/15/1997 | EP0753827A1 Method of producing and assembling chip cards and card obtained by this method |
| 01/15/1997 | EP0753592A1 Copper-tungsten alloys and process for producing the same |
| 01/15/1997 | EP0753204A1 Method of froming semiconductor component designed for vertical integration and use for testing purposes |