| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/18/1997 | US5604037 Useful as integral dielectric heat sink for electronic systems in spacecraft, aircraft and supercomputers |
| 02/18/1997 | US5604026 Used to electrically connect two metal surfaces |
| 02/18/1997 | US5603981 Forming low melting alloy of indium and gallium |
| 02/18/1997 | US5603892 Enclosing components in sealed housing coupled to source of pressurized inert gas, flushing housing with inert gas to exhaust contaminants, placing getter material in communication with housing to eliminate contaminants |
| 02/18/1997 | US5603875 Depositing a cladding layer of zirconia or magnesia by plasma deposition |
| 02/18/1997 | US5603374 Heat sink assembly for an integrated circuit |
| 02/13/1997 | WO1997005757A1 Diamond electronic packages featuring bonded metal |
| 02/13/1997 | WO1997005653A1 Wire bond tape ball grid array package |
| 02/13/1997 | WO1997004910A1 Fluxless contacting of components |
| 02/13/1997 | WO1997004884A1 Manufacturing particles and articles having engineered properties |
| 02/13/1997 | WO1996036075A3 Miniature semiconductor device for surface mounting |
| 02/13/1997 | CA2228214A1 Semiconductor switch array with electrostatic discharge protection and method |
| 02/13/1997 | CA2228009A1 Manufacturing particles and articles having engineered properties |
| 02/13/1997 | CA2228004A1 Wire bond tape ball grid array package |
| 02/12/1997 | EP0758148A2 Method and apparatus for forming electrical contacts in multi-layer integrated circuits |
| 02/12/1997 | EP0758146A2 Flip chip semiconductor device |
| 02/12/1997 | EP0758145A2 Method of manufacturing circuit module |
| 02/12/1997 | EP0758113A1 Test mode matrix circuit for an embedded microprocessor core |
| 02/12/1997 | EP0757886A1 Thermal management system |
| 02/12/1997 | EP0757884A1 Method of forming a fluorinated silicon oxide layer using plasma chemical vapor deposition |
| 02/12/1997 | EP0757846A1 Electronic component comprising a thin-film structure with passive elements |
| 02/12/1997 | EP0757845A1 Method for passivating the sides of a thin film semiconductor component |
| 02/12/1997 | CN1142686A Apparatus and method for manufacturing electronic components with project electrodes |
| 02/12/1997 | CN1142673A Membrane forming material and circuit layout forming method |
| 02/11/1997 | US5603000 Integrated circuit memory with verification unit which resets an address translation register upon failure to define one-to-one correspondences between addresses and memory cells |
| 02/11/1997 | US5602772 Dynamic semiconductor memory device |
| 02/11/1997 | US5602771 Semiconductor memory device and defect remedying method thereof |
| 02/11/1997 | US5602720 Mounting structure for semiconductor device having low thermal resistance |
| 02/11/1997 | US5602719 No handle zip socket |
| 02/11/1997 | US5602492 Electrical test structure and method for measuring the relative locations of conducting features on an insulating substrate |
| 02/11/1997 | US5602491 Integrated circuit testing board having constrained thermal expansion characteristics |
| 02/11/1997 | US5602424 Semiconductor circuit device wiring with F.C.C. structure, plane oriention (100) and aligned with the current direction |
| 02/11/1997 | US5602423 Damascene conductors with embedded pillars |
| 02/11/1997 | US5602422 Flexible leads for tape ball grid array circuit |
| 02/11/1997 | US5602421 Microwave monolithic integrated circuit package with improved RF ports |
| 02/11/1997 | US5602419 Chip carrier semiconductor device assembly |
| 02/11/1997 | US5602406 Semiconductor integrated circuit device with reduced clock signal line noise |
| 02/11/1997 | US5602060 Applying solution of polycarbosilane in solvent onto substrate bearing electrically conductive components, curing in oxidizing atmosphere to covert to silicon oxide layer |
| 02/11/1997 | US5602059 Semiconductor device and method for manufacturing same |
| 02/11/1997 | US5602056 Method for forming reliable MOS devices using silicon rich plasma oxide film |
| 02/11/1997 | US5602055 Method of manufacturing a semiconductor device incorporating a selectively deposited contact |
| 02/11/1997 | US5602053 Method of making a dual damascene antifuse structure |
| 02/11/1997 | US5602050 Method of making a semiconductor device with conductors on stepped substrate having planar upper surfaces |
| 02/11/1997 | US5601924 Manufacturing particles and articles having engineered properties |
| 02/11/1997 | US5601902 Moisture-resistant |
| 02/11/1997 | US5601740 Method and apparatus for wirebonding, for severing bond wires, and for forming balls on the ends of bond wires |
| 02/11/1997 | US5601678 Depositing trace metal layer on circuit board, forming via hole, depositing via metal, depositing electrical contact on second board, aligning, laminating boards |
| 02/11/1997 | US5601672 Method for making ceramic substrates from thin and thick ceramic greensheets |
| 02/11/1997 | US5601638 Thick film paste |
| 02/11/1997 | US5601226 Device for assembling semiconductor chips between two heat sinks |
| 02/11/1997 | US5600884 Method of manufacturing electrical connecting member |
| 02/11/1997 | CA2054212C Method for polymerization of epoxide compounds |
| 02/06/1997 | WO1997004629A1 Metal ball grid electronic package |
| 02/06/1997 | WO1997004483A1 Ceramic circuit board |
| 02/06/1997 | WO1997004481A1 Carrier, semiconductor device, and method of their mounting |
| 02/06/1997 | WO1997004469A1 Composite magnetic material and product for eliminating electromagnetic interference |
| 02/06/1997 | WO1997004395A1 Method and apparatus for encryption key creation |
| 02/06/1997 | WO1997004378A1 Microcircuit with memory that is protected by both hardware and software |
| 02/06/1997 | WO1997004377A1 Single chip microprocessor, math co-processor, random number generator, real-time clock and ram having a one-wire interface |
| 02/06/1997 | WO1997004376A1 Secure module with microprocessor and co-processor |
| 02/06/1997 | WO1997003775A1 Silicon alloys for electronic packaging |
| 02/06/1997 | DE4434105C2 Halbleiterspeichervorrichtung mit einer verbesserten Immunität gegen einen Kurzschluß auf einer Stromversorgungsleitung und Verfahren zum Reparieren einer Halbleiterspeichervorrichtung A semiconductor memory device with an improved immunity to a short circuit on a power supply line and method of repairing a semiconductor memory device |
| 02/05/1997 | EP0757414A2 Adapter with a carrier having a connection apparatus |
| 02/05/1997 | EP0757413A2 Adapter with a carrier having a connection apparatus |
| 02/05/1997 | EP0757387A1 Leadframe for lead-on-chip mounting and its use for manufacturing a package with a chip mounted thereon |
| 02/05/1997 | EP0757386A2 Systems interconnected by bumps of joining material |
| 02/05/1997 | EP0757385A2 Cooling device for electronic circuits |
| 02/05/1997 | EP0757384A2 Method and apparatus for dissipating heat from an integrated circuit |
| 02/05/1997 | EP0757383A2 Plate type member for semiconductor device package |
| 02/05/1997 | EP0757381A2 A method of manufacturing a ball grid array package |
| 02/05/1997 | EP0757220A1 Radiating fins and method for manufacturing the same |
| 02/05/1997 | EP0757080A2 Curable organosiloxane compositions and semiconductor devices |
| 02/05/1997 | EP0757023A2 Aluminum nitride sintered bodies and their use in producing semiconductors |
| 02/05/1997 | EP0756759A1 Charge-coupled imaging device |
| 02/05/1997 | CN1142123A Method for forming through-hole of semi-conductor device |
| 02/05/1997 | CN1142122A Technology for production of frame for enclosing semi-conductor leadwire |
| 02/04/1997 | US5600541 Vertical IC chip stack with discrete chip carriers formed from dielectric tape |
| 02/04/1997 | US5600540 Heat sink and retainer for electronic integrated circuits |
| 02/04/1997 | US5600183 Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate |
| 02/04/1997 | US5600182 Barrier metal technology for tungsten plug interconnection |
| 02/04/1997 | US5600181 Hermetically sealed high density multi-chip package |
| 02/04/1997 | US5600180 Sealing structure for bumps on a semiconductor integrated circuit chip |
| 02/04/1997 | US5600179 Package for packaging a semiconductor device suitable for being connected to a connection object by soldering |
| 02/04/1997 | US5600178 Semiconductor package having interdigitated leads |
| 02/04/1997 | US5600175 Apparatus and method for flat circuit assembly |
| 02/04/1997 | US5600170 Interconnection structure of semiconductor device |
| 02/04/1997 | US5600155 Array with metal scan lines controlling semiconductor gate lines |
| 02/04/1997 | US5600151 Ultraviolet radiation transparent |
| 02/04/1997 | US5600101 Multilayer electronic component and method of manufacturing the same |
| 02/04/1997 | US5599747 Method of making circuitized substrate |
| 02/04/1997 | US5599745 Method to provide a void between adjacent conducting lines in a semiconductor device |
| 02/04/1997 | US5599744 Method of forming a microcircuit via interconnect |
| 02/04/1997 | US5599742 Interconnection forming method |
| 02/04/1997 | US5599737 Forming a blanket of conductive material over dielectric substrate, performing blanket etchback procedure to reduce thickness, and patterning |
| 02/04/1997 | US5599654 Process for forming patterned layer of fluorinated resin and devices containing same |
| 02/04/1997 | US5599205 Electrostatic discharge protection device |
| 02/04/1997 | US5599193 Resilient electrical interconnect |
| 02/04/1997 | US5598711 Fluid deflection method using a skirt |
| 02/04/1997 | US5598632 Method for producing micro heat panels |
| 01/30/1997 | WO1997003542A1 Circuit board and method of manufacturing the same |