| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 03/06/1997 | DE19531651A1 Arranging conductive tracks on semiconductor component surface |
| 03/06/1997 | DE19531628A1 Kühlkörper Heat Sink |
| 03/06/1997 | DE19524001A1 Verfahren zum Verpacken einer druckempfindlichen elektronischen Schaltung mit einer allseitig abdichtenden Schutzumhäusung A method of packaging a pressure-sensitive electronic circuitry on all sides with a sealing Schutzumhäusung |
| 03/05/1997 | EP0760527A2 An apparatus for cooling a heat source |
| 03/05/1997 | EP0760165A1 Electronic device comprising means for compensating an undesired capacitance |
| 03/05/1997 | EP0760164A1 A high density integrated circuit assembly combining leadframe leads with conductive traces |
| 03/05/1997 | EP0760163A1 Integrated circuit package having a liquid metal - aluminum/copper joint |
| 03/05/1997 | EP0760020A1 Device having a switch comprising a chromium layer and method for depositing chromium layers by sputtering |
| 03/05/1997 | EP0541823B1 Heat pipe connector, electronic device and heat radiating fan having said pipe |
| 03/05/1997 | EP0514547B1 SEMICONDUCTOR MEMORY HAVING A FERROELECTRIC CAPACITOR AND A TiON BARRIER FILM |
| 03/05/1997 | CN1144403A Semiconductor diode consisting of groove form casing component and packaging method |
| 03/05/1997 | CN1144400A Semiconductor device having bond pad and process for forming the device |
| 03/05/1997 | CN1034198C Semiconductor device having double-layered silicide structure |
| 03/04/1997 | US5608749 Semiconductor laser diode and semiconductor laser diode array including plated heat sink (PHS) electrode |
| 03/04/1997 | US5608610 Mechanically floating multi-chip substrate |
| 03/04/1997 | US5608595 Semiconductor power module and power conversion device |
| 03/04/1997 | US5608559 Display board having wiring with three-layered structure and a display device including the display board |
| 03/04/1997 | US5608557 Circuitry with gate line crossing semiconductor line at two or more channels |
| 03/04/1997 | US5608359 Function-differentiated temperature compensated crystal oscillator and method of producing the same |
| 03/04/1997 | US5608267 Molded plastic semiconductor package including heat spreader |
| 03/04/1997 | US5608265 Encapsulated semiconductor device package having holes for electrically conductive material |
| 03/04/1997 | US5608264 Surface mountable integrated circuit with conductive vias |
| 03/04/1997 | US5608263 Micromachined self packaged circuits for high-frequency applications |
| 03/04/1997 | US5608262 Packaging multi-chip modules without wire-bond interconnection |
| 03/04/1997 | US5608261 High performance and high capacitance package with improved thermal dissipation |
| 03/04/1997 | US5608260 Leadframe having contact pads defined by a polymer insulating film |
| 03/04/1997 | US5608257 Fuse element for effective laser blow in an integrated circuit device |
| 03/04/1997 | US5608245 Array on substrate with repair line crossing lines in the array |
| 03/04/1997 | US5608237 Bidirectional semiconductor switch |
| 03/04/1997 | US5608192 Multilayer thin-film wiring board |
| 03/04/1997 | US5607883 High performance and high capacitance package with improved thermal dissipation |
| 03/04/1997 | US5607880 Method of fabricating multilevel interconnections in a semiconductor integrated circuit |
| 03/04/1997 | US5607879 Method for forming buried plug contacts on semiconductor integrated circuits |
| 03/04/1997 | US5607877 Projection-electrode fabrication method |
| 03/04/1997 | US5607818 Method for making interconnects and semiconductor structures using electrophoretic photoresist deposition |
| 03/04/1997 | US5607773 Method of forming a multilevel dielectric |
| 03/04/1997 | US5607569 Method of fabricating ceramic package body for holding semiconductor devices |
| 03/04/1997 | US5607059 Surface package type semiconductor package and method of producing semiconductor memory |
| 03/04/1997 | CA2080955C Cooling unit capable of speedily cooling an integrated circuit chip |
| 02/27/1997 | WO1997007543A1 Single deposition layer metal dynamic random access memory |
| 02/27/1997 | WO1997007540A1 Housing for microelectronics components and modules and process for producing it |
| 02/27/1997 | WO1997007535A1 Hex metal on rectangular cells; metal or metal two is hex |
| 02/27/1997 | WO1997006853A1 Hermetically sealed electrical feedthrough for use with implantable electronic devices |
| 02/27/1997 | DE19630342A1 Manufacturing method for semiconductor device |
| 02/27/1997 | DE19610272A1 Semiconductor device with contact hole manufacturing method for e.g. MOS transistor of memory |
| 02/27/1997 | DE19530951A1 Conductive wiring on semiconductor component surface arranging method |
| 02/26/1997 | EP0759636A2 Heat sink for semiconductors or similar |
| 02/26/1997 | EP0759635A2 Planarized final passivation for semiconductor devices |
| 02/26/1997 | CN1144016A Semiconductor package manufacturing method and semiconductor package |
| 02/25/1997 | US5606487 Electronic device for offsetting adverse effects of a plurality of chips which repetitively produce large pulses of heat |
| 02/25/1997 | US5606204 Resin-sealed semiconductor device |
| 02/25/1997 | US5606203 Semiconductor device having Al-Cu wiring lines where Cu concentration is related to line width |
| 02/25/1997 | US5606201 Fluid-cooled power transistor arrangement |
| 02/25/1997 | US5606200 Resin sealed semiconductor device with improved structural integrity |
| 02/25/1997 | US5606199 Resin-molded type semiconductor device with tape carrier connection between chip electrodes and inner leads of lead frame |
| 02/25/1997 | US5606198 Semiconductor chip with electrodes on side surface |
| 02/25/1997 | US5606196 High-frequency, high-density semiconductor chip package with screening bonding wires |
| 02/25/1997 | US5606195 High-voltage bipolar transistor utilizing field-terminated bond-pad electrodes |
| 02/25/1997 | US5606184 Semiconductor |
| 02/25/1997 | US5605864 Forming transistor gates and word lines, depositing insulator layer, spacer layer, patterning, etching |
| 02/25/1997 | US5605863 Device packaging using heat spreaders and assisted deposition of wire bonds |
| 02/25/1997 | US5605862 Process for making low-leakage contacts |
| 02/25/1997 | US5605724 Method of forming a metal conductor and diffusion layer |
| 02/25/1997 | US5605715 Securing electrically conductive masking element to portion of electrically conductive base, coating by electrophoresis other portions with fusible particles, heating to sintering temperature to fuse particles into dielectric layer |
| 02/25/1997 | US5605592 Method of manufacturing a bus communication system for stacked high density integrated circuit packages |
| 02/25/1997 | US5605558 Having aluminum nitride grains on surfaces of aluminum and silicon crystals and in interfaces between crystals |
| 02/25/1997 | US5605464 IC package connector |
| 02/25/1997 | US5605428 Device for indexing magazine compartments and wafer-shaped objects in the compartments |
| 02/25/1997 | US5604978 Method for cooling of chips using a plurality of materials |
| 02/25/1997 | CA2053055C Liquid cooling system for lsi packages |
| 02/25/1997 | CA1338945C Curing combination for cationically polymerizable materials |
| 02/20/1997 | WO1997006562A1 Metal interconnect structure for an integrated circuit with improved electromigration reliability |
| 02/20/1997 | WO1997006561A1 Reduced electromigration interconnection line |
| 02/20/1997 | WO1997006560A1 Low cost local interconnect process |
| 02/20/1997 | DE19633078A1 Non-radiating dielectric waveguide |
| 02/20/1997 | DE19532755C1 Chip module for chip card used as telephone or identification card |
| 02/20/1997 | DE19530577A1 Gehäuse für Bauelemente der Mikroelektronik und Verfahren zu seiner Herstellung Enclosures for components in microelectronics and process for its preparation |
| 02/19/1997 | EP0758798A2 Semiconductor device with enhanced electrical characteristic |
| 02/19/1997 | EP0758664A1 Nonhalogenated poly(arylene ether) dielectrics |
| 02/19/1997 | EP0758488A1 Heat sink for integrated circuit packages |
| 02/19/1997 | EP0758487A1 Tape application platform and processes therefor |
| 02/19/1997 | EP0555284B1 Plastisol composition |
| 02/19/1997 | CN1143377A 环氧树脂组合物 The epoxy resin composition |
| 02/19/1997 | CN1143304A Method for preparing base for semiconductor assembling |
| 02/19/1997 | CN1143262A Hidden lead wire chip base and chip package using said base |
| 02/19/1997 | CN1143261A Method for forming insulation film between every metal wiring for semiconductor device |
| 02/19/1997 | CN1143259A Method, carrier and mould parts for encapsulating chip |
| 02/18/1997 | US5604673 Low temperature co-fired ceramic substrates for power converters |
| 02/18/1997 | US5604382 Semiconductor device with pillar-shaped contact layer |
| 02/18/1997 | US5604381 Semiconductor device and method of manufacturing without undercutting conductive lines |
| 02/18/1997 | US5604380 Having wiring layers separated by interlayer insulation having flattening film component of cured silicone ladder polymers including hydrogen silsesquioxane to adjust carbon content and etching rate |
| 02/18/1997 | US5604379 Semiconductor device having external electrodes formed in concave portions of an anisotropic conductive film |
| 02/18/1997 | US5604378 Semiconductor device, its lead frame, and heat spreader having through holes |
| 02/18/1997 | US5604376 Paddleless molded plastic semiconductor chip package |
| 02/18/1997 | US5604372 Semiconductor pressure sensor apparatus |
| 02/18/1997 | US5604330 Staggered land pad pattern on substrate for tab interconnection |
| 02/18/1997 | US5604328 Multilayer electronic component |
| 02/18/1997 | US5604161 Semiconductor device assembly with minimized bond finger connections |
| 02/18/1997 | US5604160 Method for packaging semiconductor devices |
| 02/18/1997 | US5604156 Wire forming method for semiconductor device |