| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 09/25/2013 | CN103325775A Two-direction three-end solid discharge tube |
| 09/25/2013 | CN103325774A Power semiconductor device |
| 09/25/2013 | CN103325773A Packing structure for integrated circuit |
| 09/25/2013 | CN103325772A Wafer structure, chip structure and stacked chip structure |
| 09/25/2013 | CN103325771A Interposer and electrical testing method thereof |
| 09/25/2013 | CN103325770A Integrated circuit copper interconnection structure and preparation method thereof |
| 09/25/2013 | CN103325769A Copper interconnection structure and manufacturing method thereof |
| 09/25/2013 | CN103325768A Integrated power transistor circuit having current-measuring cell and manufacturing method thereof |
| 09/25/2013 | CN103325767A Integrated semi-conductor display panel |
| 09/25/2013 | CN103325766A Metal interconnecting wire capacitor structure |
| 09/25/2013 | CN103325765A Silicon substrate inductance structure with magnetic core |
| 09/25/2013 | CN103325764A Support mounted electrically interconnected die assembly |
| 09/25/2013 | CN103325763A Spiral inductance element and electronic device |
| 09/25/2013 | CN103325762A Ball grid array package substrate with through holes and method of forming same |
| 09/25/2013 | CN103325761A Upright package structure and preparation method for novel high-density multi-layer circuit chip |
| 09/25/2013 | CN103325760A Conductive bump structure on substrate and fabrication method thereof |
| 09/25/2013 | CN103325759A 半导体模块 Semiconductor Modules |
| 09/25/2013 | CN103325758A FCQFN encapsulation part preventing solder balls from collapsing and manufacturing process of FCQFN encapsulation part |
| 09/25/2013 | CN103325757A Packaging piece based on substrate and adopting slotting technology and manufacturing process of packaging piece |
| 09/25/2013 | CN103325756A Multi-device SMT flat packaging piece based on frame and manufacturing process of multi-device SMT flat packaging piece |
| 09/25/2013 | CN103325755A Semiconductor package structure |
| 09/25/2013 | CN103325754A Enhanced polymer composite material adapter plate based on carbon nano tube and preparation method thereof |
| 09/25/2013 | CN103325753A Plastic packaging piece and manufacturing process based on frameless CSP packaging back ball placing |
| 09/25/2013 | CN103325752A Circuit package, electronic circuit package, and method for encapsulating an electronic circuit |
| 09/25/2013 | CN103325751A Step-type micro convex point structure and preparation method thereof |
| 09/25/2013 | CN103325750A High-power whole wafer flat plate pressure welding type encapsulating structure and method thereof |
| 09/25/2013 | CN103325749A Integrated circuit (IC) having TSVs and stress compensating layer |
| 09/25/2013 | CN103325748A 半导体装置 Semiconductor device |
| 09/25/2013 | CN103325747A 垂直式半导体元件及其制造方法 Vertical-type semiconductor device and manufacturing method |
| 09/25/2013 | CN103325746A Semiconductor packages and methods of formation thereof |
| 09/25/2013 | CN103325745A 半导体装置 Semiconductor device |
| 09/25/2013 | CN103325744A LED light source module with high voltage-withstanding performance |
| 09/25/2013 | CN103325743A Insulated heat-conducting substrate with high reliability |
| 09/25/2013 | CN103325742A Chip packaging substrate and chip packaging structure |
| 09/25/2013 | CN103325741A Packaging piece based on substrate and adopting liquid plastic packaging and manufacturing process of packaging piece |
| 09/25/2013 | CN103325740A Stacked wafer structure and method for stacking a wafer |
| 09/25/2013 | CN103325739A Semiconductor package substrate |
| 09/25/2013 | CN103325738A Substrate attachment device and substrate attachment method |
| 09/25/2013 | CN103325703A Probing chips during package formation |
| 09/25/2013 | CN103325702A Chip binding method and chip binding structure |
| 09/25/2013 | CN103325701A Installation method, installation structure and power module for power module PCB |
| 09/25/2013 | CN103325700A Method for achieving through hole interconnection by filling through hole from bottom to top and product thereof |
| 09/25/2013 | CN103325699A Manufacturing method of semiconductor device |
| 09/25/2013 | CN103325697A Semiconductor packaging structure and manufacturing method thereof |
| 09/25/2013 | CN103325690A Semiconductor package and methods of formation thereof |
| 09/25/2013 | CN103325680A Method for improving radiation resistance of integrated circuit bipolar type audion |
| 09/25/2013 | CN103323916A High frequency transmission module and optical fiber connector |
| 09/25/2013 | CN103319692A High performance organosilicon epoxy material, preparation method and applications thereof |
| 09/25/2013 | CN102339803B Die package structure manufacturing method |
| 09/25/2013 | CN102280367B Method for protecting alignment mark and semiconductor element formed therewith |
| 09/25/2013 | CN102244060B Packaging base plate and manufacturing method thereof |
| 09/25/2013 | CN102217070B Semiconductor device and method for producing same |
| 09/25/2013 | CN102171816B Wiring board, semiconductor device and method for manufacturing same |
| 09/25/2013 | CN102117781B Bonding structure and method for manufacturing same |
| 09/25/2013 | CN102027590B High frequency storing case and high frequency module |
| 09/25/2013 | CN101971310B Method of forming a thermo pyrolytic graphite-embedded heatsink |
| 09/25/2013 | CN101930956B Chip packaging structure and manufacturing method thereof |
| 09/25/2013 | CN101800212B Test structure for integrity of semiconductor element gate oxide |
| 09/25/2013 | CN101669025B A biosensor chip and a method of manufacturing the same |
| 09/25/2013 | CN101563765B Electronic, in particular microelectronic, functional group and method for its production |
| 09/25/2013 | CN101388373B Semiconductor device and production method thereof |
| 09/25/2013 | CN101233612B Metal-ceramic composite substrate and method for manufacturing same |
| 09/24/2013 | US8542486 Electronic apparatus with improved heat dissipation |
| 09/24/2013 | US8542337 Pixel structure of active matrix organic light emitting display and manufacturing thereof |
| 09/24/2013 | US8541893 Semiconductor memory device and power line arrangement method thereof |
| 09/24/2013 | US8541891 Semiconductor device |
| 09/24/2013 | US8541890 Substrate based unmolded package |
| 09/24/2013 | US8541889 Probe card including frame and cover plate for testing a semiconductor device |
| 09/24/2013 | US8541888 Pad layout structure of a driver IC chip |
| 09/24/2013 | US8541886 Integrated circuit packaging system with via and method of manufacture thereof |
| 09/24/2013 | US8541885 Technique for enhancing transistor performance by transistor specific contact design |
| 09/24/2013 | US8541884 Through-substrate via having a strip-shaped through-hole signal conductor |
| 09/24/2013 | US8541882 Stacked IC device with recessed conductive layers adjacent to interlevel conductors |
| 09/24/2013 | US8541881 Package structure and manufacturing method thereof |
| 09/24/2013 | US8541879 Super-self-aligned contacts and method for making the same |
| 09/24/2013 | US8541878 Semiconductor apparatus, method of manufacturing semiconductor apparatus, method of designing semiconductor apparatus, and electronic apparatus |
| 09/24/2013 | US8541877 Electronic device package and method for fabricating the same |
| 09/24/2013 | US8541876 Microelectronic package having direct contact heat spreader and method of manufacturing same |
| 09/24/2013 | US8541875 Integrated three-dimensional module heat exchanger for power electronics cooling |
| 09/24/2013 | US8541874 Semiconductor device |
| 09/24/2013 | US8541873 Microelectronic packages having cavities for receiving microelectronic elements |
| 09/24/2013 | US8541872 Integrated circuit package system with package stacking and method of manufacture thereof |
| 09/24/2013 | US8541871 Multilayered lead frame for a semiconductor light-emitting device |
| 09/24/2013 | US8541870 Semiconductor package utilizing tape to reinforce fixing of leads to die pad |
| 09/24/2013 | US8541855 Co/Ni multilayers with improved out-of-plane anisotropy for magnetic device applications |
| 09/24/2013 | US8541851 MEMS package |
| 09/24/2013 | US8541827 Semiconductor memory device including multi-layer gate structure |
| 09/24/2013 | US8541819 Semiconductor device and structure |
| 09/24/2013 | US8541782 Method for evaluating oxide semiconductor and method for manufacturing semiconductor device |
| 09/24/2013 | US8541317 Deposition method for passivation of silicon wafers |
| 09/24/2013 | US8541306 Semiconductor device and method of double photolithography process for forming patterns of the semiconductor device |
| 09/24/2013 | US8541305 3D integrated circuit and method of manufacturing the same |
| 09/24/2013 | US8541300 Method of manufacturing semiconductor device, semiconductor device thus manufactured, and semiconductor manufacturing apparatus |
| 09/24/2013 | US8541288 Manufacturing method of thin film transistor array substrate |
| 09/24/2013 | US8541262 Die edge contacts for semiconductor devices |
| 09/24/2013 | CA2687424C A contact pad and method of forming a contact pad for an integrated circuit |
| 09/19/2013 | WO2013138452A1 Low cost interposer fabricated with additive processes |
| 09/19/2013 | WO2013138029A1 High capacitance density metal-insulator-metal capacitors |
| 09/19/2013 | WO2013137895A1 At least one die produced, at least in part, from wafer, and including at least one replicated integrated circuit |
| 09/19/2013 | WO2013137809A1 Semiconductor devices with close-packed via structures having in-plane routing and method of making same |