Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
09/2013
09/26/2013US20130249084 Semiconductor device and manufacturing method thereof
09/26/2013US20130249083 Packaging substrate
09/26/2013US20130249082 Conductive bump structure on substrate and fabrication method thereof
09/26/2013US20130249081 Method for manufacturing fine-pitch bumps and structure thereof
09/26/2013US20130249080 Semiconductor Device and Method for Forming Openings and Trenches in Insulating Layer by First LDA and Second LDA for RDL Formation
09/26/2013US20130249079 Semiconductor Device and Method of Singulating Semiconductor Wafer along Modified Region within Non-Active Region Formed by Irradiating Energy through Mounting Tape
09/26/2013US20130249078 Integrated circuit packaging system with support structure and method of manufacture thereof
09/26/2013US20130249077 Integrated circuit packaging system with terminals and method of manufacture thereof
09/26/2013US20130249076 Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces
09/26/2013US20130249075 Semiconductor package, semiconductor apparatus and method for manufacturing semiconductor package
09/26/2013US20130249074 Stacked semiconductor package
09/26/2013US20130249073 Integrated circuit packaging system with support structure and method of manufacture thereof
09/26/2013US20130249072 Direct Contact Package for Power Transistors
09/26/2013US20130249071 Semiconductor device and method of assembling same
09/26/2013US20130249070 Semiconductor package structure
09/26/2013US20130249069 Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit
09/26/2013US20130249068 Integrated circuit packaging system with external interconnect and method of manufacture thereof
09/26/2013US20130249067 Clip Frame Semiconductor Packages and Methods of Formation Thereof
09/26/2013US20130249066 Electromigration-resistant lead-free solder interconnect structures
09/26/2013US20130249065 Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof
09/26/2013US20130249064 Stacked package and method of manufacturing stacked package
09/26/2013US20130249063 Shield plate, method for manufacturing a semiconductor device, and semiconductor device
09/26/2013US20130249062 Film embedding method and semiconductor device
09/26/2013US20130249051 Packaged Semiconductor Device Having Multilevel Leadframes Configured as Modules
09/26/2013US20130249045 Semiconductor devices with stress relief layers and methods of manufacturing the same
09/26/2013US20130249011 Integrated circuit (ic) having tsvs and stress compensating layer
09/26/2013US20130249008 Semiconductor device
09/26/2013US20130248990 Semiconductor devices and method for fabricating the same
09/26/2013US20130248864 Die testing using top surface test pads
09/26/2013US20130248860 Bundled memory and manufacture method for a bundled memory with an external input/output bus
09/26/2013US20130248859 Semiconductor Device and Method of Simultaneous Testing of Multiple Interconnects for Electro-Migration
09/26/2013US20130248668 Locking apparatus
09/26/2013US20130248234 Multilayer Printed Wiring Board
09/26/2013US20130248155 Bearing cup structure and thermal module thereof
09/26/2013US20130247372 Multilayer wiring board for an electronic device
09/26/2013DE112011104326T5 Hybridkern-Durchgangslöcher und -Durchkontakte Hybrid core-through holes and -Durchkontakte
09/26/2013DE112011102518T5 Bidirektionaler, in Serie gegeneinander geschalteter, gestapelter SCR für Hochspannungs-Pin-ESD-Schutz, Verfahren zur Fertigung und Konstruktionsstrukturen Bidirectional of back-connected, stacked SCR for high voltage pin ESD protection, methods of manufacture and construction of structures
09/26/2013DE10217073B4 Miniatur-Halbleitergehäuse für optoelektronische Bauelemente Miniature semiconductor package for optoelectronic devices
09/26/2013DE102013204300A1 Halbleiterchip, Halbleiteranordnung und Verfahren zum Betrieb eines Halbleiterchips Semiconductor chip, semiconductor device and method of operating a semiconductor chip
09/26/2013DE102013203232A1 Bonden von Komponenten zur Herstellung von elektronischen Anordnungen und elektronische Anordnungen einschließlich gebondeter Komponenten Bonding of components for the production of electronic devices and electronic devices including bonded components
09/26/2013DE102013103082A1 Niederspannungs-ESD-Begrenzung unter Verwendung von Hochspannungsbauelementen Low-voltage ESD limitation using high voltage components
09/26/2013DE102013103076A1 Electro static discharge (ESD) protection circuit for electronic module, has current control element that pumps the ESD pulse current which is selectively led back into substrate of primary shunt element based on trigger signal
09/26/2013DE102013102893A1 Ein Schaltkreisgehäuse, ein elektronisches Schaltkreisgehäuse und Verfahren zum Verkapseln eines elektronischen Schaltkreises A circuit package, an electronic circuit package and method for encapsulating an electronic circuit
09/26/2013DE102013005007A1 Polymer-Dickschichtzusammensetzungen für Lotlegierungen/Metallische Leiter Polymer thick film compositions for solder alloys / Metallic conductors
09/26/2013DE102012223248A1 Abdecksystem Cover system
09/26/2013DE102012218304A1 Leistungshalbleitervorrichtungsmodul Power semiconductor device module
09/26/2013DE102012213573B3 Semiconductor module arrangement, has module connected and mechanically held at terminals with circuit board in electrical conductive manner, where form-fit connection is indirectly formed between module and body over circuit board
09/26/2013DE102012204489A1 Component e.g. valve component, for e.g. electromechanical transmission of motor car, has contact element whose portion with reduced cross-section is formed as shaft and extends from central region of head up to support structure
09/26/2013DE102012006122A1 Heat transfer device i.e. heating and/or cooling plate, for maintaining moderate temperature of battery cells of lithium ion battery of vehicle, has gutter-shaped advance channels and return channels extended over entire length of cavity
09/26/2013DE102012006009A1 Method for determining junction temperature of pn-transition in e.g. MOSFET for use in energy converter, involves determining junction temperature based on determined time duration and power path voltage
09/26/2013DE102010042438B4 Sensoranordnung Sensor array
09/26/2013DE102010015970B4 Satz mehrerer Photovoltaikzellen, Photovoltaikzellenmodul, Anordnung zum Aufbringen einer vorgegebenen Information auf einen Satz von Photovoltaikzellen, Verfahren zum Ermitteln einer Information von einem Satz von Photovoltaikzellen, Anordnung zum Ermitteln einer Information von einem Satz von Photovoltaikzellen Set of several photovoltaic cells, photovoltaic cell module assembly for applying a predetermined information to a set of photovoltaic cells, methods for determining information from a set of photovoltaic cells, means for determining information from a set of photovoltaic cells
09/26/2013DE102009057146B4 Druckkontaktiertes Leistungshalbleitermodul mit Hybriddruckspeicher Pressure-contacted power semiconductor module with hybrid accumulator
09/25/2013EP2642517A1 Semiconductor device
09/25/2013EP2642516A2 Method of manufacturing semiconductor element
09/25/2013EP2642515A2 Semiconductor element and method of manufacturing same
09/25/2013EP2641997A1 Laminate and method for producing laminate
09/25/2013EP2641926A1 Polyfunctional epoxy compound
09/25/2013EP2641270A1 Multichip module for communications
09/25/2013EP2641269A1 Using bump bonding to distribute current flow on a semiconductor power device
09/25/2013EP2641039A2 Cooling device for a super conductor and super conducting synchronous machine
09/25/2013CN203219685U Heat radiation module combination structure
09/25/2013CN203219678U Sequentially arranged liquid-cooling power semiconductor modules and related facility
09/25/2013CN203219191U Environment-friendly bridge rectifier
09/25/2013CN203218258U Antistatic chip packaging structure
09/25/2013CN203218257U Novel triode pin structure
09/25/2013CN203218256U Novel triode double-row framework
09/25/2013CN203218255U Novel triode double-row framework
09/25/2013CN203218254U Multi-row array iron-based lead frame of DIP packaging chip
09/25/2013CN203218253U MSOP10 integrated circuit packaging lead frame structure
09/25/2013CN203218252U EMSOP8 integrated circuit packaging lead frame structure
09/25/2013CN203218251U Novel 48-pinned packaging structure for power management chip
09/25/2013CN203218250U Heavy current semiconductor device and heavy current semiconductor device framework
09/25/2013CN203218249U Power module using laser welded terminals
09/25/2013CN203218248U Pure water cooling system for high voltage semiconductor
09/25/2013CN203218247U Heat radiation device for disk-shaped diode
09/25/2013CN203218246U Novel 64-pinned packaging structure for power management chip
09/25/2013CN203218228U Bonding tool for semiconductor module
09/25/2013CN203217210U Array substrate, display panel and displayer
09/25/2013CN1983661B Transparent polymeric electrode for electro-optical structures
09/25/2013CN103329267A Semiconductor device and method of manufacturing thereof
09/25/2013CN103329266A Stacked microelectronic assembly having interposer connecting active chips
09/25/2013CN103329265A Electronic device submounts including substrates with thermally conductive vias
09/25/2013CN103329264A Microelectronic assembly with plural stacked active chips having through - silicon vias formed in stages
09/25/2013CN103329263A Stitch bump stacking design for overall package size reduction for multiple stack
09/25/2013CN103329262A Power device and package for power device
09/25/2013CN103329261A Electronic component comprising a ceramic carrier and use of a ceramic carrier
09/25/2013CN103329260A Package for accommodating semiconductor element, semiconductor device provided with same, and electronic device
09/25/2013CN103328880A Porous heat sink LED lamps
09/25/2013CN103328605A Composition containing quantum dot fluorescent body, molded body of quantum dot fluorescent body dispersion resin, structure containing quantum dot fluorescent body, light-emitting device, electronic apparatus, mechanical device, and method for producing the molded body of a quantum dot fluorescent body dispersion resin
09/25/2013CN103328575A Siloxane compositions including titanium dioxide nanoparticles suitable for forming encapsulants
09/25/2013CN103328531A Epoxy resin composition for sealing, and electronic component device
09/25/2013CN103328530A Epoxy resin composition and semiconductor sealing material using same
09/25/2013CN103327779A Heat dissipating assembly and elastic fastening member thereof
09/25/2013CN103327741A 3D (Three Dimensional)-printing-based package substrate and manufacturing method thereof
09/25/2013CN103327737A Chip assembly structure and chip assembly method
09/25/2013CN103325803A Method and structure of image sensor packaging and image sensor module and forming method of image sensor module
09/25/2013CN103325799A Structure of stacking chips and method for manufacturing the same
09/25/2013CN103325793A On-chip variable inductor capable of realizing wide frequency range tuning
09/25/2013CN103325784A Chip static electricity protection circuit based on memristor
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